0607 Xilinx/NASA: Meeting Schedule
Author: Ken LaBel
Document Date: 07/13/06 |
0607 Xilinx/NASA: Activities Associated with Working with Xilinx to Develop a Space Flow for Virtex
Author: Author Non-NEPP
Document Date: 07/13/06 |
0607 Xilinx/NASA: Aerospace Status Review (slides)
Author: Author Non-NEPP
Document Date: 07/13/06 |
0607 Xilinx/NASA: Assembly Reliability for Two CCGA Packages (slides)
Author: Reza Ghaffarian
Document Date: 07/13/06 |
0607 Xilinx/NASA: Attendance List for GFSC June 26, 2006 Meeting
Author: Ken LaBel
Document Date: 07/13/06 |
0607 Xilinx/NASA: Design for Performance Optimization of Virtex Devices (slides)
Author: Author Non-NEPP
Document Date: 07/13/06 |
0607 Xilinx/NASA: FPGA Mission Assurance Center (slides)
Author: Author Non-NEPP
Document Date: 07/13/06 |
0607 Xilinx/NASA: The NASA Electronic Parts and Packaging (NEPP) Program (slides)
Author: Ken LaBel
Document Date: 07/13/06 |
0607 Xilinx/NASA: Xilinx Space Heritage (slides)
Author: Author Non-NEPP
Document Date: 07/13/06 |
0607 Xilinx/NASA: Xilinx V4 Single Event Effects (SEE) High-Speed Testing (slides)
Author: Author Non-NEPP
Document Date: 07/13/06 |
0607 Xilinx/NASA: Defense and Aerospace Screening Flows (slides)
Author: Author Non-NEPP
Document Date: 07/13/06 |
0607 Xilinx/NASA: Multi-Bit Upsets in the Virtex Devices (slides)
Author: Author Non-NEPP
Document Date: 07/13/06 |
0607 Xilinx/NASA: Reconfigurable Scalable Computing for Space Applications (slides)
Author: Author Non-NEPP
Document Date: 07/13/06 |
0607 Xilinx/NASA: Reliability Engineering – An Integrated Approach at Xilinx (slides)
Author: Author Non-NEPP
Document Date: 07/13/06 |
0607 Xilinx/NASA: SpaceCube IRAD Development Effort (slides)
Author: Author Non-NEPP
Document Date: 07/13/06 |
1/f Noise in Proton Irradiated SiGe HBTs
Author: Robert Reed
Document Date: 02/26/02 |
311-INST-001 Rev. A
Author: NASA Document Reference Only
Document Date: 06/18/03 |
3-D Simulation of Heavy-Ion Induced Charge Collection in SiGe HBTs
Author: Muthubalan Varadharajaperumal
Document Date: 08/15/05 |
3rd NEPP Workshop Program Guide
Author: Lissa Galbraith
Document Date: 04/04/02 |
A Brief History of Space Climatology: From the Big Bang to the Present - 2018 NSREC Short Course Paper
Author: Mike Xapsos
Document Date: 02/28/19 |
A Brief History of Space Climatology: From the Big Bang to the Present - 2018 NSREC Short Course Presentation
Author: Mike Xapsos
Document Date: 02/28/19 |
A Comparison of Charge Transfer Efficiency Measure. Techniques on Proton Damaged n-Channel CCD's
Author: Paul W. Marshall
Document Date: 01/29/04 |
A Comparison Of Moisture Resistance With Different Types Of End-Terminations In Ceramic Capacitors
Author: Henning Leidecker
Document Date: 09/25/01 |
A Comparison of Van Allen Belt Radiation Environment Modeling Programs: AE8/AP8 Legacy, AE9/AP9, and SPENVIS - Summer 2016 Poster by Evan Reed
Author: Jonathan Pellish
Document Date: 12/14/16 |
A General Approach to MEMS Reliability Assurance
Author: Joanne Wellman
Document Date: 10/04/01 |
A Model for Single-Event Transients Comparators 2000 NSREC
Author: Allan Johnston
Document Date: 09/19/01 |
A NASA Perspective on Validation and Testing of Design Hardening for the Natural Space Radiation Environment
Author: Ken LaBel
Document Date: 10/18/13 |
A Rapid Technique for Moisture Diffusion Characterization of Molding Compounds in PEMs
Author: Alexander Teverovsky
Document Date: 10/15/02 |
A Screening Method Using Infrared Imaging to Detect Pattern Defects in Foil and Thin Film Resistors - CMSE 2015 Presentation
Author: Lyudmyla Panashchenko
Document Date: 08/09/17 |
A Study to Determine the Thermal Characteristics of COTS Boards and Their Behavior in Vacuum
Author: Jeannette Plante1
Document Date: 09/25/01 |
A Systems Approach for Quality and Reliability of Chip Scale Package Assembly
Author: Reza Ghaffarian
Document Date: 09/25/01 |
A Technique for Assessing the Moisture Resistance of PEMs Using MOS Test Structures
Author: Alexander Teverovsky
Document Date: 03/05/02 |
A-A-59569 BRAID, WIRE (COPPER, TIN-COATED, SILVER-COATED, OR NICKEL COATED, TUBULAR OR FLAT)
Author: Author Non-NEPP
Document Date: 06/11/03 |
Accelerated Thermal and Mechanical Testing of CSP
Author: Reza Ghaffarian
Document Date: 10/09/01 |
Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies
Author: Reza Ghaffarian
Document Date: 09/25/01 |
Acoustic Microscopy, a Tool for Evaluating Quality of Microelectronics
Author: Steve Bolin
Document Date: 10/10/01 |
Active Parts Core Suppliers Listing (CSL) - Core Suppliers List Part I
Author: Ashok Sharma
Document Date: 10/25/01 |
Active Supplier Assessment Program (ASAP) - Part IV Transistors
Author: Ashok Sharma
Document Date: 09/28/01 |
Active Supplier Assessment Program Core Suppliers Listing
Author: Ashok Sharma
Document Date: 09/28/01 |
Active Supplier Assessment Program Core Suppliers Listing - Part I Microcircuits
Author: Ashok Sharma
Document Date: 09/28/01 |
Active Supplier Assessment Program Core Suppliers Listing - Part II Hybrid Microcircuits
Author: Ashok Sharma
Document Date: 09/28/01 |
Advanced Adhesion and Bonding
Author: Rajeshuni Ramesham
Document Date: 10/09/01 |
Advanced Charge Injected Devices for Space Instruments
Author: Industry Document Reference Only
Document Date: 02/13/04 |
Advanced Electronic Packaging - The Assurance Challenges
Author: Michael Sampson
Document Date: 10/24/13 |
Advanced Electronics Technologies: Challenges for Radiation Effects Testing, Modeling, and Mitigation - 2005 Space Environment Effects Working Group Presentation
Author: Ken LaBel
Document Date: 10/31/13 |
Advanced Micro Devices (AMD) Processor: Radiation Test Results - NEPP ETW 2013 Presentation
Author: Ken LaBel
Document Date: 10/23/13 |
Advanced Packaging of Image Sensors
Author: Usama Abdali
Document Date: 10/05/01 |
Advanced Sensor Technologies Assessment, Test Techniques and Predictive/Mitigative Methods: Review
Author: Cheryl Marshall1
Document Date: 01/14/04 |
AFMC COTS Guide - 1993
Author: Michael Sampson
Document Date: 01/18/02 |
AFRL/AFMC Military Products from Commercial Lines (TRW 1999)
Author: Industry Document Reference Only
Document Date: 01/18/02 |
Agile Input SEU Testing of hte SPT7760 A/D Converter
Author: Raymond Ladbury
Document Date: 01/29/04 |
ALTERA STRATIXTM EP1S25 FIELD-PROGRAMMABLE GATE ARRAY (FPGA)
Author: Anthony Sanders
Document Date: 08/22/06 |
Alternative Test Methods for Electronic Parts
Author: Jeannette Plante1
Document Date: 11/03/04 |
An Analysis of Charge Transfer Efficiency Noise on Proton-Damaged CCDs for the HST WFC3
Author: Paul W. Marshall
Document Date: 01/29/04 |
An Insider's Guide to Designing Spacecraft Systems and Instruments for Operation in the Natural Spac
Author: Ken LaBel
Document Date: 09/25/01 |
An Investigation of Proton Energy Effects in SiGe HBT Technology
Author: Paul W. Marshall
Document Date: 01/21/04 |
An SEU Hardening Approach for High-Speed SiGe HBT Digital Logic
Author: Ramkumar Krithivasan
Document Date: 08/15/05 |
Analysis of Failure Modes in Therm Actuated MEMS Relays
Author: Alexander Teverovsky
Document Date: 03/19/03 |
Analysis of Plastic Parts Package Delamination
Author: Shri Agarwal
Document Date: 02/24/06 |
Angular and Energy Dependence of Proton Upset in Optocouplers 1999 NSREC
Author: Allan Johnston
Document Date: 09/19/01 |
Angular Dependence of DRAM Upset Susceptibility and Implications for Testing and Analysis 2000 NSREC
Author: Steven Guertin
Document Date: 09/18/01 |
Anomalous Radiation Effects in Fully Depleted SOI MOSFETs Fab'd on SIMOX
Author: Cheryl Marshall1
Document Date: 02/15/02 |
APPLICATION OF THERMO-MECHANICAL MEASUREMENTS OF PLASTIC PACKAGES FOR RELIABILITY EVALUATION OF PEMS
Author: Alexander Teverovsky
Document Date: 06/07/04 |
Applications for Fiber Amplifiers For Space: Laser Altimetry and Mapping
Author: Author Non-NEPP
Document Date: 10/31/05 |
ASAP Vendor Information Matrix (VIM)
Author: Ashok Sharma
Document Date: 10/26/01 |
Assembly and Cleaning of CSPs for High, Low, and UltraLow Volume Applications
Author: Reza Ghaffarian
Document Date: 09/14/01 |
Assembly Reliability of Ball Grid Array and Chip Scale Packages for High Reliability Applications
Author: Reza Ghaffarian
Document Date: 10/29/01 |
Assessing Part-to-Part Variation for Destructive Single-Event Effects
Author: Raymond Ladbury
Document Date: 10/24/13 |
Assurance Against Radiation Effects on Electronics - 2004 QLF Presentation
Author: Ken LaBel
Document Date: 10/30/13 |
Assurance of COTS Boards for Space Flight
Author: Jeannette Plante1
Document Date: 09/25/01 |
Assurance of COTS Boards for Space Flight - Part I
Author: Jeannette Plante1
Document Date: 09/17/01 |
Assurance of COTS Fiber Optic Cable Assemblies for Space Flight
Author: Melanie Ott
Document Date: 09/17/01 |
ATC Capacitor RF Evaluation Device #9 - Graph
Author: Ashok Sharma
Document Date: 10/26/01 |
ATC Capacitor RF Evaluation Device #9 - Test 1
Author: Ashok Sharma
Document Date: 10/26/01 |
ATC Capacitor RF Evaluation Device #9 - Test 10
Author: Ashok Sharma
Document Date: 10/26/01 |
ATC Capacitor RF Evaluation Device #9 - Test 2
Author: Ashok Sharma
Document Date: 10/26/01 |
ATC Capacitor RF Evaluation Device #9 - Test 3
Author: Ashok Sharma
Document Date: 10/26/01 |
Automotive Specifications/Electronic Parts - Lower Cost and Acceptable Performance?
Author: Michael Sampson
Document Date: 10/23/13 |
Ball Grid Array Assembly Reliability - NEPP WebEx Series #3
Author: Reza Ghaffarian
Document Date: 01/28/04 |
Ball Grid Array Reliability Assessment for Aerospace Applications
Author: Reza Ghaffarian
Document Date: 09/19/01 |
Board Level Proton Testing Book of Knowledge for NASA Electronic Parts and Packaging Program
Author: Steven Guertin
Document Date: 02/26/18 |
Body of Knowledge (BOK) for Copper Wire Bonds
Author: Michael Sampson
Document Date: 09/28/15 |
Breakdown of Gate Oxides During Irradiation with Heavy Ions 1998 NSREC
Author: Allan Johnston
Document Date: 09/18/01 |
Broad Beam and Ion Microprobe Studies of Single-Event Upsets in High Speed 0.18 um SiGe HBT Devices
Author: Robert Reed
Document Date: 02/13/04 |
Building Reliability into ASIC Design
Author: Jonathan Perret
Document Date: 11/19/01 |
CALCE Electronic Products and Systems Center Technical Review and Planning Meetings
Author: Ashok Sharma
Document Date: 11/19/01 |
Capabilites and Reliability of LEDs and Laser Diodes
Author: Melanie Ott
Document Date: 10/30/01 |
Capacitor Military Specification Coordination Meeting (DSCC)
Author: Jay Brusse
Document Date: 10/25/01 |
Carrier Plus: A Sensor Payload for Living With a Star Space Environment Test Bed (LWS/SET)
Author: Cheryl Marshall1
Document Date: 02/02/04 |
Carrier Plus: A Sensor Payload for Living With a Star Space Environment Test Bed (LWS/SET) (slides
Author: Cheryl Marshall1
Document Date: 02/02/04 |
Catastrophic Heavy-Ion Failure of a Commercial ASIC 2000 SEE Symposium
Author: Luis Selva
Document Date: 09/19/01 |
Catastrophic SEE in High-Voltage Power MOSFETs
Author: Luis Selva
Document Date: 09/22/03 |
CAVE - Overview of Lead Free Solder Research
Author: Jim Blanche
Document Date: 03/11/04 |
Challenges for Electronics in the Vision for Space Exploration - 2005 SSPVSE Presentation
Author: Ken LaBel
Document Date: 10/30/13 |
Challenges with PEMS Found in the MMEM Study - Rockwell Study (slides)
Author: Industry Document Reference Only
Document Date: 01/22/02 |
Characteristic Times of Moisture Diffusion and Bake-out Conditions for Plastic Encapsulated Parts
Author: Alexander Teverovsky
Document Date: 10/15/02 |
Characteristics of th HST's Rad. Environment Inferred from Charge-Collection Modeling of Near....
Author: Raymond Ladbury
Document Date: 01/29/04 |
Characterization of a Twelve Channel Optical Fiber, Ribbon Cable and MTP Array Connector Assembly...
Author: Melanie Ott
Document Date: 10/22/02 |
Characterization of Proton Damage in Light-Emitting Diodes 2000 NSREC
Author: Allan Johnston
Document Date: 09/18/01 |
Characterization of SETs in the LM119 Voltage Comparator
Author: Stephen Buchner
Document Date: 01/22/04 |
Characterization of Transient Error Cross Sections in High Speed Fiber Optic Data Links
Author: Cheryl Marshall1
Document Date: 02/26/02 |
Characterizing Space Flight Inductors and Transformer Failures
Author: Trent Griffin
Document Date: 09/02/03 |
Charge Collection Analysis and SEU Modeling of SiGe HBTs for High-Speed Digital Logic
Author: Paul W. Marshall
Document Date: 01/22/04 |
Chip Scale Package Implementation Challenges
Author: Reza Ghaffarian
Document Date: 09/25/01 |
Chip-Scale Package Reliability-Has it Been Proven?
Author: Reza Ghaffarian
Document Date: 09/25/01 |
Chlorine contamination diffusion in silicones
Author: Alexander Teverovsky
Document Date: 03/05/02 |
Circuit Modeling of th LM124 Operational Amplifier for Analog SET Analysis
Author: Stephen Buchner
Document Date: 01/29/04 |
Class D Missions and CubeSats: EEE Parts Diatribe – A Starting Point for Discussion - CubeSats Workshop 2013 Presentation
Author: Ken LaBel
Document Date: 09/24/13 |
Close the Information Gap on IC-Package Reliability
Author: Reza Ghaffarian
Document Date: 09/25/01 |
Cloudy with a Chance of Solar Flares: The Sun as a Natural Hazard - 2017 AAAS Web Presentation
Author: Jonathan Pellish
Document Date: 11/01/17 |
CO1-34 Report: Effect of Proof Testing on Optical Fiber Fusion Splices
Author: Mike Osterman
Document Date: 11/07/01 |
Commercial Microelectronics Technologies for Applications in the Satellite Radiation Environment
Author: Ken LaBel
Document Date: 09/28/01 |
Commercial Off The Shelf (COTS): Radiation Effects Considerations and Approaches - NEPP ETW 2012 Presentation
Author: Ken LaBel
Document Date: 10/24/13 |
Commercial off the shelf for LHS experiments.pdf (slides)
Author: Michael Sampson
Document Date: 01/18/02 |
Commercial Tree of HBTs
Author: Marcellus Proctor
Document Date: 02/12/04 |
Commercial-Off-The-Shelf Microelectromechanical Systems
Author: Reza Ghaffarian
Document Date: 09/19/01 |
CompactPCI® Connectors In Space Flight Applications
Author: Richard Williams
Document Date: 08/20/08 |
Comparison of DC/DC Converter Needs for Space Use
Author: Author Non-NEPP
Document Date: 12/21/04 |
Comparison of SETs in Bipolar Linear Circuits Gen'd with an Ion Microbeam, Laser Light & Circuitry
Author: Stephen Buchner
Document Date: 01/29/04 |
Comparison of SETs in Bipolar Linear Circuits Generated with an Ion Microbeam, Laser and Circuit Sim
Author: Stephen Buchner
Document Date: 01/22/04 |
Comparison of SETs Induced in an Op Amp LM124 by Pulsed Laser Light and a Broad Beam of Heavy Ions
Author: Stephen Buchner
Document Date: 02/10/04 |
Comparison of SETs Induced in an OpAmp LM124 by Pulsed Laser Light and a Broad Beam of Heavy Ions
Author: Stephen Buchner
Document Date: 02/13/04 |
Comparison of Total Dose Effects on Micropower Op-Amps: Bipolar and CMOS 1998 NSREC
Author: Allan Johnston
Document Date: 09/19/01 |
Comparison of Total Dose Responses on High Resolution Analog-to-Digital Converters Technologies 1997
Author: Allan Johnston
Document Date: 09/19/01 |
Comparisons of the Proton-Induced Dark Current and Charge Transfer Efficiency Responses of CCDs
Author: Cheryl Marshall1
Document Date: 08/30/05 |
Compendium of Single Event Failures in Power MOSFETs 1998 NSREC
Author: Luis Selva
Document Date: 09/19/01 |
Components to Assembly: Role of Model Based Physics-of-Failure (PoF) Reliability Assessment - NEPP-ETW 2016 Presentation by Bhanu Sood
Author: Ken LaBel
Document Date: 12/14/16 |
Concerns About Commercial Component Obsolecense in Commercial Aircraft 1998 (slides)
Author: Author Non-NEPP
Document Date: 01/22/02 |
Conducting Polymers and the Evolving Electronics Technology
Author: Bashir Syed
Document Date: 10/02/01 |
Conference Agenda: Reliability, Testing, and Characterization of MEMS/MOEMS II
Author: Rajeshuni Ramesham
Document Date: 01/13/03 |
Considerations for GPU SEE Testing - 2017 SEE-MAPLD Presentation
Author: Edward Wyrwas
Document Date: 11/07/17 |
Continuing Evaluation of Bipolar Linear Devices for Total Dose Bias Dependency and ELDRS Effects
Author: Steven McClure
Document Date: 09/22/03 |
Controlled PEMs A High Density Packaging Solution for Space.pdf
Author: Industry Document Reference Only
Document Date: 01/18/02 |
Corrosion of Silver-Plated Copper Conductors
Author: Industry Document Reference Only
Document Date: 01/10/05 |
Cost Impacts of Upgrading Electronic Parts for Use in NASA Space Flight Systems
Author: Jeannette Plante1
Document Date: 05/05/03 |
COTS #3 Photonics, Optocoupler, Experiment on STRV-1D
Author: Melanie Ott
Document Date: 10/30/01 |
COTS and ROTS for mission critical systems.pdf
Author: Industry Document Reference Only
Document Date: 01/18/02 |
COTS Boards Insertion Methodology and Plan, Draft, August 1998
Author: Jeannette Plante1
Document Date: 09/17/01 |
COTS Ceramic Chip Capacitors: an Evaluation of the Parts and Assurance Methodologies (paper)
Author: Jay Brusse
Document Date: 03/11/05 |
COTS Ceramic Chip Capacitors: an Evaluation of the Parts and Assurance Methodologies (slides)
Author: Jay Brusse
Document Date: 03/11/05 |
COTS PEMs Procurement/Acquisition Concerns and Issues
Author: Henning Leidecker
Document Date: 11/26/02 |
Cryogenic Evaluation of an Advanced DC/DC Converter Module For Deep Space Applications
Author: Richard Patterson
Document Date: 03/05/03 |
CSP Assembly Reliability: Commercial and Harsh Environments
Author: Reza Ghaffarian
Document Date: 09/19/01 |
CSP Reliability for Single- and Double-Sided Assemblies
Author: Reza Ghaffarian
Document Date: 09/25/01 |
Current SEE and Radiation Damage Results for Candidate Spacecraft Electronics
Author: Martha O'Bryan
Document Date: 01/21/04 |
Current Silicon Die Thinning and Bonding onto Membranes Technologies for Solar Sails - An Abstract
Author: Witold Sokolowski
Document Date: 10/05/01 |
Current Silicon Die Thinning and Bonding onto Membranes Technologies for Solar Sails - Presentation
Author: Witold Sokolowski
Document Date: 10/05/01 |
Cyclic Voltametric Response of Boron-Doped CVD Diamond
Author: Rajeshuni Ramesham
Document Date: 09/19/01 |
Degradation of Precision Reference Devices in Space Environments 1997 NSREC
Author: Bernard Rax
Document Date: 09/19/01 |
Degradation of Surface Mount Solid Tantalum Capacitors in Humid Environments
Author: Alexander Teverovsky
Document Date: 03/19/03 |
Detection of Outgassing Species from the Electrical Insulators Using Cyranose E-Nose
Author: Rajeshuni Ramesham
Document Date: 09/28/01 |
Development And Application Of High Temperature Sensors And Electronics
Author: Gary Hunter
Document Date: 10/04/01 |
Device SEE Susceptibility Update 1998
Author: Luis Selva
Document Date: 09/19/01 |
Different Modes of Surface Passivation of GaAs
Author: Takar Raikar
Document Date: 10/05/01 |
Displacement Damage in Bipolar Linear Integrated Circuits 1999 NSREC
Author: Bernard Rax
Document Date: 09/18/01 |
Does Red Phosphorus in Molding Compounds for Electronic Devices Present a Reliability Risk?
Author: Ashok Sharma
Document Date: 10/23/02 |
Dose Rate and Bias Dependency of Total Dose Sensitivity of Low Dropout Volltage Regulators 2000 NSRE
Author: Steven McClure
Document Date: 09/19/01 |
DPA Guide for PEMs - Draft
Author: Alexander Teverovsky
Document Date: 02/22/02 |
Draft Single Event Effects (SEEs) Specification
Author: Ken LaBel
Document Date: 09/28/01 |
DSCC-DWG-87106 - Capacitor, Ceramic, Switch Mode Power Supply
Author: Author Non-NEPP
Document Date: 03/03/03 |
Dynamic Stress Analysis of TSOP Devices with Different Chip Sizes
Author: Mark Fan
Document Date: 09/17/01 |
EEE Links Article: Evaluation of Laminated Flexible PCBs Under Wide Temperature Cycling
Author: Richard Patterson
Document Date: 03/04/03 |
EEE Links January 2003
Author: Jeanne Ilg
Document Date: 02/03/03 |
EEE Links July 2001
Author: Author Non-NEPP
Document Date: 10/02/01 |
EEE Links Volume 10 No. 1 Feb. 2004
Author: Jeannette Plante1
Document Date: 02/27/04 |
EEE Links Volume 10 No. 2 Apr. 2004
Author: Jeannette Plante1
Document Date: 04/22/04 |
EEE Parts Bullentin, June/July 2010, Vol 2, Is 4
Author: Shri Agarwal
Document Date: 09/02/10 |
EEE Parts Bulletin December 2009, Vol 1, Issue 6
Author: Shri Agarwal
Document Date: 12/10/09 |
EEE Parts Bulletin Jan - May 2014, Issue 1
Author: Shri Agarwal
Document Date: 11/19/14 |
EEE Parts Bulletin, April/May 2013, Vol 5, issue 2
Author: Shri Agarwal
Document Date: 05/31/13 |
EEE Parts Bulletin, April/May2010, Vol2, Is3
Author: Shri Agarwal
Document Date: 06/02/10 |
EEE Parts Bulletin, Aug 2016-May 2017, Vol 9, Issue 1
Author: Shri Agarwal
Document Date: 09/05/17 |
EEE Parts Bulletin, Aug–Dec 2015, Vol 7, Issue 3
Author: Shri Agarwal
Document Date: 09/05/17 |
EEE Parts Bulletin, August 2009, Vol 1, issue 3
Author: Shri Agarwal
Document Date: 09/23/09 |
EEE Parts Bulletin, August 2017 to May 2018, Pub 2018July17, Vol 10, Issue 1
Author: Shri Agarwal
Document Date: 10/25/18 |
EEE Parts Bulletin, December 2013 Vol 5 Issue 4
Author: Shri Agarwal
Document Date: 02/18/14 |
EEE Parts Bulletin, Feb_Mar 2010
Author: Shri Agarwal
Document Date: 03/25/10 |
EEE Parts Bulletin, Jan–July 2016, Vol 8, Issue 1, Rev A
Author: Shri Agarwal
Document Date: 09/05/17 |
EEE Parts Bulletin, July 2009, Vol 1, Issue 2
Author: Shri Agarwal
Document Date: 09/23/09 |
EEE Parts Bulletin, July August 2011
Author: Shri Agarwal
Document Date: 09/14/11 |
EEE Parts Bulletin, June 2009, Vol 1, Issue 1
Author: Shri Agarwal
Document Date: 09/23/09 |
EEE Parts Bulletin, June 2018 to Sept. 2018, Pub 2019Apr30, Vol 10, Issue 2 - Compendium Special Edition on Electrostatic Discharge (ESD)
Author: Shri Agarwal
Document Date: 05/14/19 |
EEE Parts Bulletin, June July 2013, Vol 5, Issue 3
Author: Shri Agarwal
Document Date: 07/24/13 |
EEE Parts Bulletin, June-July 2017, Pub 2017Oct02, Vol 9, Issue 2
Author: Shri Agarwal
Document Date: 10/24/17 |
EEE Parts Bulletin, June–July, 2015, Vol 7, Issue 2
Author: Shri Agarwal
Document Date: 09/05/17 |
EEE Parts Bulletin, March 2013, Vol 5, Issue 1
Author: Shri Agarwal
Document Date: 04/02/13 |
EEE Parts Bulletin, March April 2012, Vol 4, Issue 1
Author: Shri Agarwal
Document Date: 04/04/12 |
EEE Parts Bulletin, May June 2011, Vol 3, Issue 1
Author: Shri Agarwal
Document Date: 07/05/11 |
EEE Parts Bulletin, Nov/Dec 2012, Vol 4, Issue 3
Author: Shri Agarwal
Document Date: 12/26/12 |
EEE Parts Bulletin, Nov_Dec 2011, Vol 2, Issue 6
Author: Shri Agarwal
Document Date: 01/11/11 |
EEE Parts Bulletin, October 2009, Volume1, Issue 5
Author: Shri Agarwal
Document Date: 10/20/09 |
EEE Parts Bulletin, Sept 2009, Vol 1, Issue 4
Author: Shri Agarwal
Document Date: 09/16/09 |
EEE Parts Bulltin, January 2010 Vol 2 Issue 1
Author: Shri Agarwal
Document Date: 01/27/10 |
EEE Parts Management and Control For MSFC Space Flight Hardware
Author: NASA Document Reference Only
Document Date: 09/03/03 |
EEE-INST-002: Instructions for EEE Parts Selection, Screening, Qualification, and Derating
Author: Kusum Sahu
Document Date: 08/07/07 |
Effect of Conformal Coat on Tin Whisker Growth
Author: Jong Kadesch
Document Date: 09/25/01 |
Effect of Environments on Degradation of Molding Compound and Wire Bonds in PEMs
Author: Alexander Teverovsky
Document Date: 12/05/05 |
Effect of Extreme Environmental Thermal Cycling on COTS MEMS Pressure Sensor
Author: Rajeshuni Ramesham
Document Date: 02/28/02 |
Effect of Extreme Temperature Cycling of PDIP-8 OP181 Op Amp
Author: Richard Patterson
Document Date: 03/05/03 |
Effect of Inductance and Requirements for Surge Current Testing of Tantalum Capacitors
Author: Alexander Teverovsky
Document Date: 12/05/05 |
Effect of Moisture on Characteristics of Surface Mount Solid Tantalum Capacitors
Author: Alexander Teverovsky
Document Date: 02/04/03 |
Effect of Surge Current Testing on Reliability of Solid Tantalum Capacitors
Author: Alexander Teverovsky
Document Date: 03/27/08 |
Effect of Vacuum on High Temperature Degredation of Gold/Aluminum Wire Bonds in PEMs
Author: Alexander Teverovsky
Document Date: 03/23/04 |
Effect of Vacuum on High-Temperature Degradation of Au-Al Wire Bonds in PEMS
Author: Alexander Teverovsky
Document Date: 04/19/04 |
Effects of humidity on non-hermetically packaged III-V structures and devices
Author: Rosa Leon
Document Date: 09/13/01 |
Effects of Ionizing Radiation on the Mechanical and Electrical Properties of Carbon Nanotubes
Author: Harry Shaw
Document Date: 03/04/03 |
Effects of Via-Conductor Orientation in the Electromigration Failure of Al-Cu Wires
Author: Rosa Leon
Document Date: 10/04/01 |
Effects of Wide Temperature Thermal Cycling on Flexible Laminated Printed Circuit Boards
Author: Richard Patterson
Document Date: 03/05/03 |
EFlash DC-to-DC Converters 01QTR04
Author: Jeannette Plante1
Document Date: 01/15/04 |
EIA G-11 (Passive Parts Committee) Meeting Notes February 1998
Author: Jay Brusse
Document Date: 10/25/01 |
EIA G-11 (Passive Parts Committee) Meeting Notes June 1997
Author: Michael Sampson
Document Date: 10/25/01 |
EIA G12 Meeting January 13-14, 2004, Phoenix, Arizona
Author: Michael Sampson
Document Date: 02/27/04 |
Electric Currents through Ion Tracks in Silicon Devices
Author: Larry Edmonds
Document Date: 09/19/01 |
Electromigration Failure in Au and Joule Heating Induced Oxidation in Cu Conductors
Author: Rosa Leon
Document Date: 11/19/01 |
Electromigration Failure in Au and Joule Heating Induced Oxidation in Cu Conductors - Part 1
Author: Rosa Leon
Document Date: 11/19/01 |
Electromigration Failure in Au and Joule Heating Induced Oxidation in Cu Conductors - Part 2
Author: Rosa Leon
Document Date: 11/19/01 |
Electromigration Failure in Au and Joule Heating Induced Oxidation in Cu Conductors - Part 3
Author: Rosa Leon
Document Date: 11/19/01 |
Electron Induced Scintillation Testing of Commercially Available Optical Fibers for Space Flight
Author: Melanie Ott
Document Date: 09/17/01 |
Electronic Components for the Commercialization of Space Systems Workshop
Author: Michael Sampson
Document Date: 10/25/01 |
Electronics Radiation Characterization (ERC) Project – Overview of FY03
Author: Ken LaBel
Document Date: 10/28/02 |
Embedded Passives in Space (slides)
Author: Robert Graber
Document Date: 10/04/01 |
Emerging Radiation Hardness Assurance (RHA) issues: A NASA approach for space flight programs
Author: Ken LaBel
Document Date: 09/28/01 |
Enabling COTS Parts Insertion in NASA Systems: A Combined NEPAG (Q, AE) – NEPP Program (AE) Activity
Author: Chuck Barnes
Document Date: 11/13/02 |
Environmental Hysteresis in Moulding Compounds and Volt Reference PEMs: Presentation
Author: Alexander Teverovsky
Document Date: 02/20/03 |
Environmental Hysteresis in Moulding Compounds and Volt Reference PEMs: White Paper
Author: Alexander Teverovsky
Document Date: 03/19/03 |
Environmental Stress Testing of Power Transistors Encapsulated in Plastic Packages
Author: Alexander Teverovsky
Document Date: 11/23/04 |
Environmentally Induced Swelling and Shrinkage of Molding Compounds in PEMs
Author: Alexander Teverovsky
Document Date: 10/15/02 |
EOS Simulation and Failure Analysis of Metallurgically Bonded Silicon Diodes.
Author: Alexander Teverovsky
Document Date: 03/05/02 |
ERC Roadmap
Author: Ken LaBel
Document Date: 03/04/02 |
ESA Sponsored DC/DC Converter for Space
Author: Jeannette Plante1
Document Date: 12/21/04 |
ESD Prevention for GSFC Hardware
Author: Marcellus Proctor
Document Date: 10/01/03 |
ESD Stress Test Models
Author: Jose Sancho
Document Date: 01/30/06 |
ESD Testing of an EEPROM-Based Multichip Module
Author: Harry Shaw
Document Date: 10/23/01 |
EV61261_LT1014IS
Author: Alexander Teverovsky
Document Date: 02/22/02 |
EV72015_LT1014IS
Author: Alexander Teverovsky
Document Date: 02/22/02 |
EV78074_58V1001T25
Author: Alexander Teverovsky
Document Date: 02/22/02 |
Evaluating Constraints on Heavy-Ion SEE Susceptibility Imposed by Proton SEE Testing and Other Mixed Environments - NSREC 2016 oral presentation
Author: Raymond Ladbury
Document Date: 08/15/17 |
Evaluation of RF MEMS Lifetime Performance in a High Power (>1W) Application
Author: Joanne Wellman
Document Date: 01/02/03 |
Evaluation of 3D Plus Test Structures
Author: Jeannette Plante1
Document Date: 11/01/02 |
Evaluation of an Ultra Low Power Reed Solomon Encoder for NASA's ST5 Mission
Author: Ken Li
Document Date: 02/02/04 |
Evaluation of an Ultra Low Power Reed Solomon Encoder for NASA's ST5 Mission (slides)
Author: Mike Xapsos
Document Date: 02/02/04 |
Evaluation of Commercial Communication Protocols for Space Application
Author: Stephen Buchner
Document Date: 02/13/04 |
Evaluation of Data Retention Characteristics for Ferroelectric Random Access Memories (FRAMs)
Author: Ashok Sharma
Document Date: 11/19/01 |
Evaluation of ESD Effects During Removal of Conformal Coatings Using Micro Abrasive Blasting, 10/97
Author: Robert Cummings
Document Date: 09/17/01 |
Evaluation of Flexible Laminated Printed Circuit Boards Under Wide Temperature Cycling
Author: Richard Patterson
Document Date: 03/05/03 |
Evaluation of Laminated Flexible Printed Circuit Boards Under Wide Temperature Cycling
Author: Richard Patterson
Document Date: 02/28/02 |
Evaluation Of Linear Technology LT1461 Voltage Reference At Low Temperatures
Author: Richard Patterson
Document Date: 03/04/03 |
Evaluation of Maxwell Technology PowerCache Ultracapacitor
Author: Henry Machado
Document Date: 10/02/01 |
Evaluation of Micromachined Relays for Space Applications
Author: Alexander Teverovsky
Document Date: 02/03/03 |
Evaluation of MultiLayer Ceramic Capacitors for Low Voltage Type Failures - October 20, 2000
Author: Pete Jones
Document Date: 10/25/01 |
Evaluation of Non-Evaporable Getters for High Vacuum Hermetic Packages
Author: Rajeshuni Ramesham
Document Date: 05/23/05 |
Evaluation of the Die Attachment, Ablestik 84-1, for its Reliability for TDRS, September 1998
Author: Jong Kadesch
Document Date: 09/17/01 |
Evaluation of Vertical Cavity Surface Emitting Lasers (VCSEL) mounted on CVD Diamond Substrates
Author: Harry Shaw
Document Date: 10/25/01 |
Evaluation of Voltage Reference Circuits and N-Channel Field Effect Transistors at Low Temperatures
Author: Richard Patterson
Document Date: 03/05/03 |
Evaluation Report for the Amphenol-Bendix 453 Miniature Circular Connector with Mil-T-29504 Optical
Author: Jeannette Plante1
Document Date: 10/25/01 |
Executive Summary CVD Diamond Film Project WPI Major Qualifying Project
Author: Henning Leidecker
Document Date: 09/17/01 |
Experience With Plastic Part Evaluations at Cold Temperatures
Author: Michael Sandor
Document Date: 10/05/01 |
Experiment Test Plan for Determining Low Voltage Failure Mechanism in Ceramic Capacitors
Author: Pete Jones
Document Date: 09/18/01 |
Extreme Temperature (-125oC to +90oC) Thermal Cycling of UC282, LT1813, and LTC1409
Author: Rajeshuni Ramesham
Document Date: 02/28/02 |
Fabricating Diamond Membranes Using Reactive-Ion Etching
Author: Rajeshuni Ramesham
Document Date: 09/19/01 |
Failures in Hybrid Microcircuits during Environmental Testing
Author: Alexander Teverovsky
Document Date: 03/27/08 |
FEA Stress Analysis for the Comparison of BGA and CGA
Author: Mark Fan
Document Date: 09/17/01 |
Fiber Optic Cable Assemblies for Space Flight Applications - Issues and Remedies
Author: Melanie Ott
Document Date: 10/25/01 |
Fiber Optic Cable Assemblies for Space Flight Applications - Issues and Remedies, Viewgraphs
Author: Melanie Ott
Document Date: 10/23/01 |
Fiber Optic Cable Assemblies for Space Flight Applications III: Characterization of Commercial Cable
Author: Melanie Ott
Document Date: 09/17/01 |
Fiber Optic Cable Assemblies for Space Flight II - Thermal and Radiation Effects (AEIS Conf)
Author: Melanie Ott
Document Date: 10/29/01 |
Fiber Optic Cable Assemblies for Space Flight II - Thermal and Radiation Effects (JPL Pckg WShp)
Author: Melanie Ott
Document Date: 10/29/01 |
Fiber Optic Epoxy Outgassing Study for Space Flight Applications
Author: Melanie Ott
Document Date: 10/25/01 |
Fiber Optic System Qualification at Goddard Space Flight Center
Author: Melanie Ott
Document Date: 10/29/01 |
Final Results for the Photobit Active Pixel Sensor Heavy-Ion Transient Response Test
Author: Cheryl Marshall1
Document Date: 01/29/04 |
Flight Data Analysis Report - Seastar and XTE
Author: Christian Poivey
Document Date: 02/02/04 |
Flight Experiments for Living With a Star Space Environment Testbed (LWS-SET) - HEART 2003 Presentation
Author: Ken LaBel
Document Date: 10/30/13 |
Flip Chip on Organic Substrates: A Feasibility Study for Space Applications by Scott Popelar, Rich Measmer, Cobham Semiconductor Solutions; Jong-ook Suh, JPL - GOMAC Tech 2017 Presentation
Author: Doug Sheldon
Document Date: 08/31/17 |
Format for Quartely Report
Author: Ken LaBel
Document Date: 05/09/06 |
Fundamentals of Microelectromechanical Systems - Part 1 of 3
Author: Author Non-NEPP
Document Date: 10/22/01 |
Fundamentals of Microelectromechanical Systems - Part 2 of 3
Author: Author Non-NEPP
Document Date: 10/22/01 |
Fundamentals of Microelectromechanical Systems - Part 3 of 3
Author: Author Non-NEPP
Document Date: 10/22/01 |
Getters for Reliable Hermetic Packages
Author: Rajeshuni Ramesham
Document Date: 09/19/01 |
Giant Magnetoresistive (GMR) Sensor MicroElectroMechanical System (MEMS) Device
Author: Rajeshuni Ramesham
Document Date: 09/19/01 |
Glass Transition Temperature (Tg) Paper JPL
Author: Michael Sandor
Document Date: 11/01/04 |
Glass Transition Temperature (Tg) Presentation JPL
Author: Michael Sandor
Document Date: 11/01/04 |
GLAST LAT Project Parts and Mission Assurance Requirements (slides)
Author: Nick Virmani
Document Date: 01/18/02 |
Gold-Indium Intermetallic Compounds: Properties and Growth Rates
Author: Author Non-NEPP
Document Date: 08/08/03 |
Gone Fission: A Guide to Evaluating Risks Due to High-Z Materials in Active EEE Parts
Author: Raymond Ladbury
Document Date: 08/16/17 |
GSFC 311-INST Section C - Crystal Oscillators
Author: Author Non-NEPP
Document Date: 11/13/01 |
GSFC EEE Parts Activities 2003
Author: Darryl Lakins
Document Date: 03/04/03 |
GSFC Parts Engineering in COTS PEMs era (slides)
Author: Alexander Teverovsky
Document Date: 02/17/04 |
GSFC PEMs Information and Links
Author: Marcellus Proctor
Document Date: 10/25/04 |
GSFC-311-QPLD-032 - Qualified Parts List Directory
Author: Eric Haggquist
Document Date: 11/12/03 |
Guide of Space Grade Requirements for Electrical Connectors
Author: Melanie Ott
Document Date: 10/25/01 |
Guidebook on the Use of PEMs at High Altitudes (slides)
Author: Mike Osterman
Document Date: 11/06/01 |
Heavy Ion & Proton Test Results for SiGe CMOS: IBM 5HP and 7HP and Jazz Semiconductor Jazz-120
Author: Paul W. Marshall
Document Date: 06/01/05 |
Heavy Ion Broad Beam and Microprobe Studies of SEUs in 0.20 um SiGe HBT Transistors and Circuits
Author: Robert Reed
Document Date: 08/12/05 |
Heavy Ion SEE Power Supply for GaAs Power Amplifier TPS9103
Author: Christian Poivey
Document Date: 01/14/04 |
Heavy Ion SEE Test of 16 bit ADC LTC1608
Author: Christian Poivey
Document Date: 01/06/04 |
Heavy Ion SEE Test of 16 bit DAC LT1657
Author: Christian Poivey
Document Date: 01/06/04 |
Heavy Ion SEE Test of Power On Reset LP3470
Author: Christian Poivey
Document Date: 01/06/04 |
Heavy Ion SEE Test of Switching Regulator LM2651
Author: Christian Poivey
Document Date: 01/06/04 |
Heavy Ion SEE Test of the 5Ohm Ron SPST Switches ADG452
Author: Christian Poivey
Document Date: 01/06/04 |
Heavy Ion SEE Test on CMOS Voltage Converter ICL7662
Author: Christian Poivey
Document Date: 01/06/04 |
Heavy Ion SEE Test on the CMOS Op Amp LMC6484
Author: Christian Poivey
Document Date: 02/02/04 |
Heavy Ion SEE Test Report for 3 Candidate 22V10 Reprogrammable Logic Devices
Author: Scott Kniffin
Document Date: 01/14/04 |
Heavy Ion SEE Test Report for 4A Adjustable Switch Regulator MSK5042 Run 2 of 2
Author: Christian Poivey
Document Date: 01/14/04 |
Heavy Ion SEE Test Report for 4A Adjustable Switching Regulator MSK5042 Run 1 of 2
Author: Christian Poivey
Document Date: 01/14/04 |
Heavy Ion SEE Test Report for AN10E40 FPAA
Author: Anthony Sanders
Document Date: 01/14/04 |
Heavy Ion SEE Test Results for Temperature Sensor TMP36
Author: Christian Poivey
Document Date: 01/14/04 |
Heavy Ion SEE Testing of the Intel Pentium III (P3) Microprocessor
Author: James Howard
Document Date: 01/29/04 |
Heavy Ion SEE Tests of 8 bit ADC AD1175
Author: Christian Poivey
Document Date: 01/06/04 |
Heavy Ion Test Results for Electronic Devices
Author: Ken LaBel
Document Date: 09/28/01 |
Heavy Ion Testing at the Galactic Cosmic Ray Energy Peak - RADECS 2009 Paper
Author: Jonathan Pellish
Document Date: 11/12/13 |
Heavy Ion Transient and Latchup Tesing for the LM193A Dual Differential Comparator
Author: Anthony Sanders
Document Date: 01/29/04 |
Heavy Ion Transient and Latch-up Test Results for the OP42 Op Amp
Author: Anthony Sanders
Document Date: 01/29/04 |
Heavy Ion Transient Characterization of a Hardened-by-Design Active Pixel Sensor Array
Author: Cheryl Marshall1
Document Date: 01/21/04 |
High Density Microelectronics Packaging Roadmap For Space Applications 2001
Author: Lissa Galbraith
Document Date: 09/17/01 |
High Density Microelectronics Packaging Roadmap for Space Applications 2003
Author: Lissa Galbraith
Document Date: 06/17/02 |
High Density Microelectronics Roadmap for Aerospace Applications 2003
Author: Lissa Galbraith
Document Date: 03/13/03 |
High Frequency Of Radiation Hardened CMOS 8-Bit Flash Analog-To-Digital Converter At Cryogenic Temp.
Author: Richard Patterson
Document Date: 03/05/03 |
High Speed Fiber Optics Test Bed Network Technologies Investigation
Author: Melanie Ott
Document Date: 10/30/01 |
High-Temperature Degradation of Wire Bonds in Plastic Encapsulated Microcircuits
Author: Alexander Teverovsky
Document Date: 06/20/05 |
Historical: Draft Specification for Optical Cable for Space Flight I
Author: Jeannette Plante1
Document Date: 10/30/01 |
Historical: Draft Specification for Optical Cable for Space Flight II
Author: Jeannette Plante1
Document Date: 10/30/01 |
Historical: Draft Specification for Optical Cable for Space Flight III
Author: Jeannette Plante1
Document Date: 10/25/01 |
Historical: Draft Specification for Optical Cable for Space Flight IV
Author: Jeannette Plante1
Document Date: 10/30/01 |
Hot Pixel Annealing in the HST Wide Field Camera 3 CCD's
Author: Elizabeth Polidan
Document Date: 06/06/05 |
Hot-Carrier Degradation of 2-Volt Silicon-On-Insulator (SOI) Transistors
Author: Udo Lieneweg
Document Date: 10/04/01 |
Hot-Carrier Reliability of Transistors Fabricated by 0.25-mm Fully-Depleted SOI CMOS (Abstract)
Author: Udo Lieneweg
Document Date: 10/09/01 |
How Long Can the Hubble Space Telescope Operate Reliably? - 2014 NSREC Oral Presentation
Author: Mike Xapsos
Document Date: 08/09/17 |
How Long Can the Hubble Space Telescope Operate Reliably? – A Total Dose Perspective - 2014 TNS Paper
Author: Mike Xapsos
Document Date: 08/09/17 |
Hybrid Supplier Assessment Checklist
Author: Ashok Sharma
Document Date: 10/26/01 |
IEEE Parts Bulletin, June 2012, Volume 4, Issue 2
Author: Shri Agarwal
Document Date: 07/26/12 |
Impact of Proton Irradiation on High-Voltage 4H-SiC JBS Switching Diodes
Author: Zhiyun Luo
Document Date: 08/12/05 |
Impact of Tg of Molding Compounds on Screening and Reliability Qual of PEMs for Space (paper)
Author: Alexander Teverovsky
Document Date: 11/12/03 |
Impact of Tg of Molding Compounds on Screening and Reliability Qual of PEMs for Space (slides)
Author: Alexander Teverovsky
Document Date: 11/12/03 |
Implementing the Next Generation of NASA Class D Missions – Radiation Engineering Considerations for Higher?Risk Missions - MRQW 2013 Presentation
Author: Jonathan Pellish
Document Date: 02/25/14 |
Implications of Single Event Effect Characterization of Hybrid DC-DC Converters and a Solid State Po
Author: Ken LaBel
Document Date: 09/28/01 |
Improved Radiation Qualification & Test Methods for Optical Detector Noise Characterization
Author: Heidi Becker
Document Date: 08/29/05 |
Inclusion of Radiation Environment Variability in Total Dose Hardness Assurance Methodology - NSREC 2016 oral presentation
Author: Mike Xapsos
Document Date: 08/15/17 |
Inclusion of Radiation Environment Variability in Total Dose Hardness Assurance Methodology - TNS 2017 paper
Author: Mike Xapsos
Document Date: 08/15/17 |
In-flight Annealing of Displacement Damage in GaAs LEDs: A Galileo Story
Author: Gary Swift
Document Date: 09/22/03 |
In-Flight Anomalies and Radiation Performance of NASA Missions, Selected Lessons Learned - 2008 SERESSA Presentation
Author: Ken LaBel
Document Date: 11/12/13 |
In-Flight Observations of Multiple-Bit Upset in DRAMs 2000 NSREC
Author: Gary Swift
Document Date: 09/18/01 |
Influence of Structural Characteristics on the Response of Si Avalanche Photodiodes to Proton Rad
Author: Allan Johnston
Document Date: 09/23/03 |
Information Assurance Risk Management.pdf
Author: Michael Sampson
Document Date: 01/18/02 |
In-situ Measurements of Thermo-Mechanical Characteristics of Molding Compounds in PEMs
Author: Alexander Teverovsky
Document Date: 09/02/03 |
Inspection of Hidden Solder Connections
Author: Author Non-NEPP
Document Date: 10/05/01 |
Integral and Integrated Passives Webbook Update - Part 1
Author: Mike Osterman
Document Date: 11/07/01 |
Integral and Integrated Passives Webbook Update - Part 2
Author: Mike Osterman
Document Date: 11/07/01 |
Integral and Integrated Passives Webbook Update - Part 3
Author: Mike Osterman
Document Date: 11/07/01 |
Integral Heater for Reworking High Density Interfaces
Author: Author Non-NEPP
Document Date: 10/05/01 |
Intermetallic Issues with Wire Joining by Thermocompression and Soldering
Author: Henning Leidecker
Document Date: 03/11/05 |
International Rectifier Radiation-Hardened Power MOSFETs Under Wide Temperature
Author: Richard Patterson
Document Date: 03/05/03 |
Intersil HS-9008RH CMOS 8-Bit Flash Analog To Digital Converter in Temp. Range Of 23 C To 193 C
Author: Richard Patterson
Document Date: 03/05/03 |
INTRODUCING A NEW MEMBER TO THE FAMILY: GOLD WHISKERS
Author: Alexander Teverovsky
Document Date: 04/16/03 |
Introduction to the Workmanship Standards Program
Author: Jeannette Plante1
Document Date: 02/17/11 |
Investigation of Millisecond-Long Analog Single Event Transients in the LM6144 Op Amp
Author: Stephen Buchner
Document Date: 06/07/05 |
Investigation of Stepper Motor Controllers For Ultra Low Temperature Environments
Author: Richard Patterson
Document Date: 03/05/03 |
IPPAQ Optoelectronics Survey Results
Author: Melanie Ott
Document Date: 08/22/01 |
ISS FIber Optic Failure Investigation Root Cause Report
Author: Jeannette Plante1
Document Date: 09/27/05 |
JESD57 Test Standard, “Procedures for the Measurement of Single-Event Effects in Semiconductor Devices from Heavy-Ion Irradiation” Revision Updates - SEE-MAPLD 2016 presentation
Author: Jean-Marie Lauenstein
Document Date: 08/15/17 |
Joint Airlock Enhances International Space Station Spacewalk Capabilities
Author: Linda Fortenberry
Document Date: 10/02/01 |
JPL Institutional Parts Program Requirements
Author: Author Non-NEPP
Document Date: 09/03/03 |
JPL's Guide to Plastic COTS Parts (slides)
Author: Michael Sandor
Document Date: 01/22/02 |
Key Proton Test Findings for Sensor Technologies: CID816, HgCdTe, CCD
Author: Paul W. Marshall
Document Date: 02/13/04 |
Langley Research Center - Soluble Imide (LaRC-SI) Bonding Experiment
Author: James Bockman
Document Date: 10/04/01 |
LaRC Si-Environment
Author: Arthur Frederickson
Document Date: 01/23/02 |
Laser Diode Initiated Systems for Space Applications
Author: Author Non-NEPP
Document Date: 10/31/05 |
Laser SEE Test Results for AD7414 Temperature Sensor
Author: Scott Kniffin
Document Date: 01/21/04 |
Laser Single Event Effects Test Results for AD7414 Temperature Sensor
Author: Scott Kniffin
Document Date: 01/14/04 |
Laser Testing of CULPRiT RS Encoder and USES Compression Chip
Author: Ken Li
Document Date: 01/21/04 |
Latchup in Integrated Circuits from Energetic Protons 1997 NSREC
Author: Allan Johnston
Document Date: 09/19/01 |
Latchup Test Conditions for Analog-to-Digital Converters 2000
Author: Allan Johnston
Document Date: 09/19/01 |
LCC20 PACKAGES ON T.I. LM158A OPERATIONAL AMPLIFIERS UNDER EXTREME TEMP. & WIDE THERMAL CYCLING
Author: Richard Patterson
Document Date: 03/05/03 |
LEMO 3-Pin Connector Thermal Test in Vacuum
Author: David Beverly
Document Date: 03/06/06 |
Lessons Learned from Radiation-induced Effects on Solid State Recorders and Memories (report)
Author: Christian Poivey
Document Date: 02/02/04 |
Lessons Learned from Radiation-induced Effects on Solid State Recorders and Memories (slides)
Author: Christian Poivey
Document Date: 01/29/04 |
Lessons Learned from Screening and Qualification of COTS PEMs for Space Applications (slides)
Author: Alexander Teverovsky
Document Date: 02/17/04 |
Lessons Learned from Screening and Qualification Testing of COTS PEMS in 2004
Author: Alexander Teverovsky
Document Date: 05/23/05 |
Level I , II and III Requirements Compared for Microcircuits
Author: David Peters
Document Date: 03/23/04 |
Lifetime Characterization of Capacitive RF MEMS Switches
Author: Author Non-NEPP
Document Date: 05/14/03 |
List of Radiation Hardness Assurance References
Author: Author Non-NEPP
Document Date: 10/31/05 |
Low Temperature Evaluation of HTANFET SOI N-CHANNEL FET
Author: Richard Patterson
Document Date: 03/05/03 |
Low Temperature Evaluation Of The LTC1419 A/D Converter
Author: Richard Patterson
Document Date: 03/04/03 |
Low Temperature Evaluation Of The LTC1799 Oscillator
Author: Richard Patterson
Document Date: 03/04/03 |
Low Temperature Evaluation of the TC170 CMOS Current-Mode PWM Controller
Author: Richard Patterson
Document Date: 03/05/03 |
Low Temperature Evaluation of the UCC1802 Low Power BiCMOS Current Mode PWM
Author: Richard Patterson
Document Date: 03/06/03 |
Low Temperature Evaluation of the UCC3581 Voltage-Mode PWM Controller
Author: Author Non-NEPP
Document Date: 03/06/03 |
Low Temperature Evaluation of the UCC3585 Low Voltage Synchronization Buck Controller
Author: Author Non-NEPP
Document Date: 03/06/03 |
Low Temperature Evaluation of the UCC3588 5-bit Programmable Output Power Supply Controller
Author: Author Non-NEPP
Document Date: 03/06/03 |
Low Temperature Evaluation of the Unitrode UC3846 Current-Mode PWM Controller
Author: Richard Patterson
Document Date: 03/05/03 |
Low Temperature Performance of a 12-bit Serial CMOS A/D Converter
Author: Author Non-NEPP
Document Date: 03/06/03 |
Low Temperature Testing of JPL BGA Board #1
Author: Richard Patterson
Document Date: 03/05/03 |
Low-Cost Low Actuation Voltage Copper RF MEMS Switches
Author: Author Non-NEPP
Document Date: 05/08/03 |
Low-Temperature Electronics for Space & Terrestrial Applications - NEPP Webex Series #2
Author: Richard Patterson
Document Date: 12/17/03 |
Making Electronic Parts and Packaging Technology Viable for Flight Projects
Author: Richard Brace
Document Date: 10/04/01 |
Manufacturing Robustness of CSP on an SMT Line
Author: Reza Ghaffarian
Document Date: 09/19/01 |
Measurement of the Effective Sensitive Volume of FAMOS Cells of an Ultraviolet Erasable Programmable
Author: Leif Scheick
Document Date: 09/19/01 |
Measurements of Thermo-Mechanical Characteristics of PEMs for Failure Analysis and Reliability Evalu
Author: Alexander Teverovsky
Document Date: 06/07/04 |
Meeting Minutes G-11 September 2003
Author: Author Non-NEPP
Document Date: 03/01/04 |
Meeting Report: DSCC, Resistors, 1996
Author: Jay Brusse
Document Date: 10/25/01 |
Memories and NASA Spacecraft: A Description of Memories, Radiation Failure Modes, and System Design Considerations - Spaceborne 2010 Presentation
Author: Ken LaBel
Document Date: 11/13/13 |
Memories and NASA Spacecraft: Part 1 - History and Requirements - RADECS 2010 Presentation
Author: Ken LaBel
Document Date: 11/13/13 |
Memories and NASA Spacecraft: Part 2 - Future Developments - RADECS 2010 Presentation
Author: Ken LaBel
Document Date: 11/13/13 |
Memory Overview, Technologies and Needs - NEPP ETW 2010 Presentation
Author: Ken LaBel
Document Date: 11/13/13 |
MEMS Sensors and Carrier-Level Reliability
Author: Mike Osterman
Document Date: 11/07/01 |
Microbeam Testing of SiGe HBTs Fabricated in IBM 5HP, 6HP and 7HP
Author: Robert Reed
Document Date: 02/13/04 |
Micromachined Low-Loss Microwave Switches
Author: Author Non-NEPP
Document Date: 05/08/03 |
Micromechanical Membrane Switches
Author: Author Non-NEPP
Document Date: 05/08/03 |
MIL-81044 - Wire, Electric, Crosslinked Polyakene Insulated
Author: Author Non-NEPP
Document Date: 03/12/03 |
MIL-C-123 - Fixed, Ceramic Dielectric High Reliability Capacitors
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-C-17 - Cables, Radio Frequency, Felxible and Semirigid
Author: Author Non-NEPP
Document Date: 03/12/03 |
MIL-C-27500 - Cable, Power, Electrical & Cable Special Purpose, Electrical Shielded & Unshielded
Author: Author Non-NEPP
Document Date: 03/12/03 |
MIL-C-85049 CONNECTOR ACCESSORIES, ELECTRICAL
Author: Author Non-NEPP
Document Date: 06/16/03 |
MIL-DTL-5015 CONNECTORS, ELECTRICAL, CIRCULAR THREADED, AN TYPE
Author: Author Non-NEPP
Document Date: 06/16/03 |
MIL-DTL-9395 - Switches, Pressure, (Absolute Gage & Differential)
Author: Author Non-NEPP
Document Date: 03/19/03 |
MIL-HDBK-978B - NASA Parts Application Handbook (Volumes 1 through 5)
Author: NASA Document Reference Only
Document Date: 11/04/04 |
MIL-HDBK-978B Volume 1 of 5
Author: NASA Document Reference Only
Document Date: 08/02/11 |
MIL-HDBK-978B Volume 2 of 5
Author: NASA Document Reference Only
Document Date: 08/02/11 |
MIL-HDBK-978B Volume 3 of 5
Author: NASA Document Reference Only
Document Date: 08/02/11 |
MIL-HDBK-978B Volume 4 of 5
Author: NASA Document Reference Only
Document Date: 08/02/11 |
MIL-HDBK-978B Volume 5 of 5
Author: NASA Document Reference Only
Document Date: 08/02/11 |
MIL-P-50884 - Printed Circuit Wiring Boards Flexible & Rigid-flex
Author: Author Non-NEPP
Document Date: 03/12/03 |
MIL-PRF-14409 - Capacitors, Variable (Piston Type, Tubular Trimmer)
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-PRF-15733 - Filters & Capacitors, Radio Frequency Interferece
Author: Author Non-NEPP
Document Date: 03/11/03 |
MIL-PRF-19978 - Capacitors, Fixed, Plastic (Or Paper-plastic) Dielectric
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-PRF-20J - Capacitor , Fixed, Ceramic Dielectric, (Temperature Compensating) Reliability
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-PRF-23269 - Capacitors, Fixed, Glass Dielectric, Established Reliability
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-PRF-23419 - Fuse, Cartridge, Instrument Type
Author: Author Non-NEPP
Document Date: 03/11/03 |
MIL-PRF-23648 - Resistors, Thermal (Thermistor)
Author: Author Non-NEPP
Document Date: 03/12/03 |
MIL-PRF-24236 - Switches, Thermostatic ( Metallic & Bimetallic)
Author: Author Non-NEPP
Document Date: 03/19/03 |
MIL-PRF-28861 - Filters & Capacitors, Radio Frequency/Electromagnetic Interference Suppresion
Author: Author Non-NEPP
Document Date: 03/11/03 |
MIL-PRF-3098 - Crystal Units, Quartz
Author: Author Non-NEPP
Document Date: 03/10/03 |
MIL-PRF-38534 - Integrated Circuits (Microcircuits) Manufacturing
Author: Author Non-NEPP
Document Date: 03/11/03 |
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing
Author: Author Non-NEPP
Document Date: 03/11/03 |
MIL-PRF-39001- Capacitors, Fixed, Mica Dielectric, Reliability
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-PRF-39003 - Capacitors, Fixed, Electrolytic (Solid Electrolyte), Tantalum
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-PRF-39006 - Capacitor, Fixed, Electrolytic (NonSolid Electrolytic) Tantalum Est. Reliability
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-PRF-39010/1E - Coils, Fixed, Radio Frequency, Molded, Microminiature, Magnetically Shielded
Author: Author Non-NEPP
Document Date: 03/28/03 |
MIL-PRF-39014 - Capacitor, Fixed, Ceramic Dielectric (General Purpose) Est. & Non-Est. Reliability
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-PRF-39014/22D, Capacitors, Fixed, Ceramic Dielectric (General Purpose), Established Reliability
Author: Author Non-NEPP
Document Date: 03/28/03 |
MIL-PRF-39014/2K-Capacitors, Fixed, Ceramic Dielectric (General Purpose), Est. & NonEst Reliability
Author: Author Non-NEPP
Document Date: 03/28/03 |
MIL-PRF-39014/5F, Capacitors, Fixed, Ceramic Dielectric (General Purpose), Established Reliability
Author: Author Non-NEPP
Document Date: 03/28/03 |
MIL-PRF-39015/2H, Resistors, Variable, Wire-Wound (Lead-Screw Actuated), Est. & NonEst. Reliability
Author: Author Non-NEPP
Document Date: 03/28/03 |
MIL-PRF-39015/3L, Resistors, Variable, Wire-Wound (Lead-Screw Actuated),Est. & NonEst. Reliability,
Author: Author Non-NEPP
Document Date: 03/28/03 |
MIL-PRF-39016 - Relays, Electromagnetic, Established Reliability
Author: Author Non-NEPP
Document Date: 03/11/03 |
MIL-PRF-39017/1P - Resistors, Fixed, Film (Insulated), NonEst. Reliability & Est. Reliability
Author: Author Non-NEPP
Document Date: 04/04/03 |
MIL-PRF-39017/3H - Resistors, Fixed, Film (Insulated), NonEst. Reliability, & Est. Reliability
Author: Author Non-NEPP
Document Date: 04/04/03 |
MIL-PRF-39017/5M - Resistors, Fixed, Film (Insulated), NonEst. & Est. Reliability
Author: Author Non-NEPP
Document Date: 04/04/03 |
MIL-PRF-39019/1G, Circuit Breakers, Magnetic, Low-Power, Sealed, Trip-Free one-Pole
Author: Author Non-NEPP
Document Date: 04/04/03 |
MIL-PRF-39022 - Capacitors, Fixed, Metallized, Paper-plastic film, CR Plastic Film Dielectric
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-PRF-39039017/2K - Resistors, Fixed, Film (Insulated), NonEst. & Est. Reliability
Author: Author Non-NEPP
Document Date: 04/04/03 |
MIL-PRF-49464 - Capacitors, Chip, Single Layer, Fixed, Parallel Flate, Ceramic Dielectric, Rel.
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-PRF-49467 - Capacitor, Fixed, Cermaic, Multilayer, High Voltage (General Purpose)
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-PRF-55310 - Oscillator, Crystal Controlled
Author: Author Non-NEPP
Document Date: 03/11/03 |
MIL-PRF-55365 - Capacitor, Fixed, Electrolytic (Tantalum), Chip, Est. & Non-Est Reliability
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-PRF-55681 - Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Est. & Non-Est. Rel.
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-PRF-55681/2C, Capacitors, Chips, Multiple Layers, Fixed, Ceramic Dielectric, Est. Reliability
Author: Author Non-NEPP
Document Date: 05/29/03 |
MIL-PRF-55681/3D, Capacitors, Chips, Multiple Layers, Fixed, Ceramic Dielectric, Est. Reliability
Author: Author Non-NEPP
Document Date: 05/29/03 |
MIL-PRF-55681/4E, Capacitors, Chips, Multiple Layers, Fixed, Ceramic Dielectric, Established Reliabi
Author: Author Non-NEPP
Document Date: 05/29/03 |
MIL-PRF-55681/5D, Capacitors, Chips, Multiple Layers, Fixed, Ceramic Dielectric, Est. Reliability
Author: Author Non-NEPP
Document Date: 05/29/03 |
MIL-PRF-55681/7B, Capacitors, Chips, Multiple Layers, Fixed, Ceramic Dielectric, Est. Reliability
Author: Author Non-NEPP
Document Date: 05/29/03 |
MIL-PRF-55681/8B, Capacitors, Chips, Multiple Layers, Fixed, Ceramic Dielectric, Established Reliabi
Author: Author Non-NEPP
Document Date: 05/29/03 |
MIL-PRF-6106 - Relays, Electromagnetic,
Author: Author Non-NEPP
Document Date: 03/11/03 |
MIL-PRF-81 - Capacitors, Variale, Ceramic Dielectric
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-PRF-83401/2G, Resistors, Network, Fixed, Film, Style RZ020
Author: Author Non-NEPP
Document Date: 05/29/03 |
MIL-PRF-83421 - Capacitors, Fixed, Metallized, Plastic Film Dielectric, Hermetically Sealed
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-PRF-83421/1B, Capacitors Fixed, Metallized Plastic Film Dielectric, DC & AC, Hermetically Sealed
Author: Author Non-NEPP
Document Date: 05/29/03 |
MIL-PRF-83446/6D, Coils, Radio Frequency, Chip, Fixed
Author: Author Non-NEPP
Document Date: 05/29/03 |
MIL-PRF-83513/2F, Connectors, Electrical, Rectangular, Receptacle, Microminiature, Polarized Shell
Author: Author Non-NEPP
Document Date: 05/29/03 |
MIL-PRF-83536 - Relays, Electromagnetic, Established Reliability
Author: Author Non-NEPP
Document Date: 03/11/03 |
MIL-PRF-87164 - Capacitors, Fixed, Mica Dielectric, High Reliability
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-PRF-87217 - Capacitors, Fixed, Supermetallized Plastic Film Dielectric
Author: Author Non-NEPP
Document Date: 03/03/03 |
MIL-PRF-8805 - Switches & Switch Assemblies, Sensitive, Snap Action
Author: Author Non-NEPP
Document Date: 03/19/03 |
MIL-R-39016/12F, Relays, Electromagnetic, Est. Reliability, DODT, Low Level to 1.0 Ampere (Latching)
Author: Author Non-NEPP
Document Date: 06/17/03 |
MIL-R-39016/15J, Relays, Electromagnetic, Est. Reliability, DODT, Low Level to 1.0 Ampere
Author: Author Non-NEPP
Document Date: 06/17/03 |
MIL-R-39016/18G, Relays, Electromagnetic, Est. Reliability, DODT, Low Level to 1.0 Ampere
Author: Author Non-NEPP
Document Date: 06/17/03 |
MIL-R-39016/20H, Relays, Electromagnetic, Est. Reliability, DODT, Low Level to 1.0 Ampere
Author: Author Non-NEPP
Document Date: 06/17/03 |
MIL-R-39016/23E - Relays, Electromagnetic, Established Reliability
Author: Author Non-NEPP
Document Date: 04/04/03 |
MIL-R-39016/29F - Relays, Electromagnetic, Established Reliability
Author: Author Non-NEPP
Document Date: 04/04/03 |
MIL-R-39016/31B - Relays, Electromagnetic, Established Reliability, Hermetically Sealed
Author: Author Non-NEPP
Document Date: 04/04/03 |
MIL-R-39016/7F, Relays, Electromagnetic, Established Reliability, SPDT, Low Level to 1.0 Ampere
Author: Author Non-NEPP
Document Date: 04/04/03 |
MIL-R-39016/9H, Relays, Electromagnetic, Established Reliability, DPDT, Low Level to 1.0 Ampere
Author: Author Non-NEPP
Document Date: 04/04/03 |
MIL-STD-1344 TEST METHODS FOR ELECTRICAL CONNECTORS
Author: Author Non-NEPP
Document Date: 06/16/03 |
MIL-STD-1553 AIRCRAFT INTERNAL TIME DIVISION COMMAND/RESPONSE MULTIPLEX DATA BUS
Author: Author Non-NEPP
Document Date: 06/16/03 |
MIL-STD-202 - Department Of Defense Test Method Standard Electronic & Electrical Component Parts
Author: Author Non-NEPP
Document Date: 03/11/03 |
MIL-STD-2223 Test Method For Insulated Electric Wire
Author: Author Non-NEPP
Document Date: 06/11/03 |
MIL-STD-750 - Department Of Defense Test Method Standards Semiconductor Devices
Author: Author Non-NEPP
Document Date: 03/11/03 |
MIL-STD-883 - Department Of Defense Test Method Standard Microcircuits
Author: Author Non-NEPP
Document Date: 03/11/03 |
MIL-STD-981 - Design, Manufacturing & Quality Standards for Custom Electromagnetic Devices
Author: Author Non-NEPP
Document Date: 03/11/03 |
MIL-W-22759 - Wire, Electric, Fluoropolymer-insulated Extrude TFE
Author: Author Non-NEPP
Document Date: 03/12/03 |
Modeling of SEEs in Circuit-Hardened High-Speed SiGe HBT Logic
Author: Paul W. Marshall
Document Date: 01/29/04 |
Modeling of Single Event Effects in Circuit-Hardened High-Speed SiGe HBT Logic
Author: Robert Reed
Document Date: 02/26/02 |
Modeling Radiation-Induced Transients in the Next Generation Space Telescope (NGST)
Author: Robert Reed
Document Date: 01/29/04 |
Moisture Characteristics of Molding Compound and Environmental Effects in PEMs (slides)
Author: Alexander Teverovsky
Document Date: 11/26/02 |
Moisture Characteristics of Molding Compounds in PEMs (slides)
Author: Alexander Teverovsky
Document Date: 10/28/02 |
Moisture diffusion in molding compounds and quality assurance of PEMs for space applications
Author: Alexander Teverovsky
Document Date: 12/09/02 |
Moisture effects in PEMs intended for space applications (slides)
Author: Alexander Teverovsky
Document Date: 04/12/02 |
Moisture-related failures of operational amplifiers in plastic packages
Author: Alexander Teverovsky
Document Date: 08/16/04 |
Monte Carlo Simulation of BGA Failure Distributions for Virtual Qualification
Author: Reza Ghaffarian
Document Date: 09/25/01 |
MPTB AS-1773 FODB Lessons Learned
Author: Christina Seidleck
Document Date: 02/13/04 |
MSFC-STD-3012A - ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE
Author: Author Non-NEPP
Document Date: 07/17/14 |
MSFC-STD-355C with Amendment 1: STANDARD - RADIOGRAPHIC INSPECTION OF ELECTRONIC PARTS
Author: NASA Document Reference Only
Document Date: 01/27/12 |
Multi Spectral Lidar
Author: Melanie Ott
Document Date: 10/31/05 |
NASA Detector Requirements (slides)
Author: Cheryl Marshall1
Document Date: 02/13/04 |
NASA EEE Parts Assurance Group (NEPAG)
Author: David Peters
Document Date: 10/10/01 |
NASA Electronic Radiation Characterization Project
Author: Ken LaBel
Document Date: 01/14/04 |
NASA Electronics Parts & Packaging Program Assurance Research on Optoelectronics
Author: Melanie Ott
Document Date: 10/31/05 |
NASA Perspective on Radiation Hardness Assurance (RHA)
Author: James Howard
Document Date: 01/29/04 |
NASA Presentation to G12 Space Sub-Committee
Author: Michael Sampson
Document Date: 10/23/13 |
NASA Presentation to G12 Space Sub-Committee
Author: Michael Sampson
Document Date: 02/25/14 |
NASA Techn Brief: Tailoring Cores of Optical Fibers by a Sol-Gel Method
Author: Harry Shaw
Document Date: 10/25/01 |
NASA-STD-6001 FLAMMABILITY, ODOR, OFFGASSING, & COMPATIBILITY REQUIREMENTS & TEST PROCEDURES
Author: Author Non-NEPP
Document Date: 06/09/03 |
NASA-STD-8739.1B
Author: Jeannette Plante
Document Date: 04/28/17 |
NASA-STD-8739.3 - Soldered Electrical Connections
Author: Author Non-NEPP
Document Date: 03/11/03 |
NASA-STD-8739.4A
Author: Jeannette Plante
Document Date: 04/28/17 |
NASA-STD-8739.5A
Author: Jeannette Plante
Document Date: 04/28/17 |
NASA-STD-8739.6A
Author: Jeannette Plante
Document Date: 04/28/17 |
NEPAG PEMS Activation Energy Calculator
Author: Michael Sandor
Document Date: 11/01/04 |
NEPAG PEMS CSAM Data Analysis for Multiplexer
Author: Michael Sandor
Document Date: 11/02/04 |
NEPAG PEMS CSAM Data Review for Multiplexer
Author: Michael Sandor
Document Date: 11/02/04 |
NEPAG PEMS Guidelines DRAFT
Author: Michael Sandor
Document Date: 11/02/04 |
NEPAG PEMS MSL & Moisture Qualification Results
Author: Robert (David) Gerke
Document Date: 11/01/04 |
NEPAG PEMS Packaging Evaluation Results
Author: Robert (David) Gerke
Document Date: 11/01/04 |
NEPP and CALCE Working Together
Author: Mike Osterman
Document Date: 10/09/01 |
NEPP Conference 2002 Final Program
Author: Lissa Galbraith
Document Date: 04/26/02 |
NEPP News Flash - June 2001
Author: Chuck Barnes
Document Date: 10/09/01 |
NEPP News Flash - November 2001
Author: Author Non-NEPP
Document Date: 11/28/01 |
NEPP News Flash - October 2002
Author: Jeanne Ilg
Document Date: 10/17/02 |
NEPP News Flash - September 2001
Author: Chuck Barnes
Document Date: 10/09/01 |
NEPP News Flash May 2006
Author: Lois Scaglione
Document Date: 05/09/06 |
NEPP Parts Activities Presented to SPWG (March 1998)
Author: Jay Brusse
Document Date: 10/25/01 |
New DC/DC Converter for Space Applications - JAXA
Author: Author Non-NEPP
Document Date: 12/21/04 |
No-Clean Assembly Process Conditions - Effects on Flip-Chip/Underfill Reliability
Author: Author Non-NEPP
Document Date: 10/05/01 |
Notes on the Reliability of The HST Gyros
Author: Henning Leidecker
Document Date: 01/28/02 |
On Nibbles and Bytes: The Conundrum of Memory for Space Systems - NASA Electronic Parts and Packaging (NEPP) and Efforts in Memories - 2009 RHET Presentation
Author: Ken LaBel
Document Date: 11/12/13 |
On the Role of Energy Deposition in Triggering SEGR in Power MOSFETs 1999 NSREC
Author: Luis Selva
Document Date: 09/19/01 |
On the Suitability of Fiber Optic Data Links in the Space Radiation Environment
Author: Ken LaBel
Document Date: 09/17/01 |
Optical Assemblies for Space Environments: Characterization of W.L.Gore Flexlite with Diamond AVIMS
Author: Melanie Ott
Document Date: 03/31/04 |
Optical Fiber Cable Assembly Characterization for the Mercury Laser Altimeter (MLA)
Author: Melanie Ott
Document Date: 06/16/03 |
Optical Inspection of ADI OP Amp Packages Before and After Thermal Cycling (-125oC to 90oC
Author: Rajeshuni Ramesham
Document Date: 10/02/01 |
Overview of COTS Reliability Work Done by JPL
Author: Michael Sandor
Document Date: 11/01/04 |
Overview of NASA-STD-8739.1A Changes
Author: Jose Sancho
Document Date: 05/27/09 |
Overview of NEPAG COTS PEMS Evaluation
Author: Michael Sandor
Document Date: 10/30/04 |
Package induced instability in voltage reference PEMs (slides)
Author: Alexander Teverovsky
Document Date: 06/17/03 |
Package Qualification Testing Results Performed on the 5 Part Types in the NEPP/NEPAG PEMS Study
Author: Robert (David) Gerke
Document Date: 03/18/04 |
Packaging of High Temperature SiC Based Electronics
Author: Liangyu Chen-Author PI
Document Date: 10/02/01 |
Packaging Technology for 500° SiC Microsystems
Author: Liangyu Chen-Author PI
Document Date: 10/04/01 |
Parameter Degradation and SEU in Optocouplers in Radiation Environments
Author: Robert Reed
Document Date: 02/26/02 |
Particle Test Fluence: What’s the Right Number? - SEEMAPLD 2014 Presentation
Author: Ken LaBel
Document Date: 07/27/16 |
Particle Test Fluence: What’s the Right Number? - SEEMAPLD 2014 Presentation
Author: Ken LaBel
Document Date: 02/28/17 |
Parts Obsolescence Workshop: Impact of Commercial Parts on Part Obsolescence 1997
Author: Author Non-NEPP
Document Date: 01/18/02 |
Parts Selection for Space Systems, An Overview and Radiation Perspective - 2008 SERESSA Presentation
Author: Ken LaBel
Document Date: 11/12/13 |
PEM-INST-001 Instructions for Plastic Encapsulated Microcircuit (PEM) Select, Screen, & Qualify
Author: Alexander Teverovsky
Document Date: 06/16/03 |
PEMS Cold Tests Powerpoint Slides
Author: Jeannette Plante1
Document Date: 11/01/04 |
PEMS CSAM Presentation JPL
Author: Michael Sandor
Document Date: 11/01/04 |
PEMS Moisture Test Terminology Compared
Author: Jeannette Plante1
Document Date: 11/01/04 |
PEMs Research
Author: Alexander Teverovsky
Document Date: 09/23/04 |
PEMS-INST-001 (pointer)
Author: Alexander Teverovsky
Document Date: 01/04/05 |
Performance of Analog Devices OP284 OpAmps Under Wide Temperature Cycling
Author: Richard Patterson
Document Date: 03/05/03 |
Performance of Low-Loss RF MEMS Capacitive Switches
Author: Muzar Jah
Document Date: 05/08/03 |
Performance of Rad-Hard Quad Receivers at Extreme Temperatures
Author: Quiesup Kim
Document Date: 10/04/01 |
Performance Of The AD590 Temperature Transducer At Low Temperature
Author: Richard Patterson
Document Date: 03/05/03 |
Performance Of The Analog Devices AD780BR Voltage Reference At Cryogenic Temperatures
Author: Richard Patterson
Document Date: 03/05/03 |
Performance of the LTC1650 16-bit D/A Converter at Cyrogenic Temperatures
Author: Author Non-NEPP
Document Date: 03/06/03 |
Performance of Various Types of Resistors at Low Temperatures
Author: Richard Patterson
Document Date: 03/05/03 |
Phase And Gain Response Of A Closed-Loop-Control High Voltage DC-DC Converter At Cryo Temperatures
Author: Richard Patterson
Document Date: 03/04/03 |
Phenomenological Application of Target Theory Effects in SEE Analysis 2000 SEE Symp
Author: Leif Scheick
Document Date: 09/19/01 |
Photonic Integrated Circuit (PIC) Device Structures: Background, Fabrication Ecosystem, Relevance to Space Systems Applications, and Discussion of Related Radiation Effects - BOK Paper by Shannon Alt
Author: Ken LaBel
Document Date: 09/29/16 |
Photonic Integration and Usage Guidelines Manual D-18228
Author: Author Non-NEPP
Document Date: 10/30/01 |
Photonic Validation Methods Handbook D-18230
Author: Author Non-NEPP
Document Date: 10/30/01 |
Plastic Encapsulated Microcircuit (PEM) Derating, Storage and Qualification Report
Author: Ashok Sharma
Document Date: 10/25/01 |
Plastic Encapsulated Microcircuit (PEM) Guidelines for Screening and Qualification for Space
Author: Jong Kadesch
Document Date: 09/28/01 |
Plastic Encapsulated Microcircuits (PEMs) Reliability/Usage Guidelines For Space Applications
Author: Michael Sandor
Document Date: 10/30/02 |
Potential Manufacturers for High Reliability Solid-State Relays
Author: David Beverly
Document Date: 06/01/05 |
PPL-21 Notice 1
Author: NASA Document Reference Only
Document Date: 06/18/03 |
Preliminary Evaluation of Data Retention Characteristics for Ferroelectric Random Access Memories
Author: Ashok Sharma
Document Date: 10/02/01 |
Preliminary Heavy Ion SEE Test of ADC 16 bits LTC1605
Author: Christian Poivey
Document Date: 01/29/04 |
Preliminary Heavy Ion SEE Test Report for CMOS Op-Amp LMC6484
Author: Christian Poivey
Document Date: 01/14/04 |
Preliminary Test Plan for Reliability Evaluation of Copper-Based Metallization Systems
Author: Ashok Sharma
Document Date: 10/25/01 |
President's Vision on Space Exploration Feb 12, 2004
Author: Author Non-NEPP
Document Date: 03/23/04 |
Probabilistic Model for Low Altitude Trapped Proton Fluxes
Author: Mike Xapsos
Document Date: 01/21/04 |
Probing Proton Damage in SOI CMOS Technology by Using Lateral Bipolar Action
Author: Ying Li
Document Date: 08/15/05 |
Programmable Oscillators: Evaluation Test Report
Author: Shri Agarwal
Document Date: 05/17/05 |
Programmable Read Only Memory (PROM) Programming Procedure Guideline, 2000
Author: Ashok Sharma
Document Date: 10/25/01 |
Proton and Heavy Ion SEE Test Results for 12.5 GHz Pseudo-Random Number Generator via IBM 7HP SiGe
Author: Robert Reed
Document Date: 01/14/04 |
Proton Damage Effects in Linear Integrated Circuits 1998 NSREC
Author: Bernard Rax
Document Date: 09/18/01 |
Proton Damage in Linear and Digital Optocouplers 1999 RADECS
Author: Allan Johnston
Document Date: 09/19/01 |
Proton Degradation in Light-Emitting Diodes 1999 NSREC
Author: Allan Johnston
Document Date: 09/18/01 |
Proton Displacement Damage in Light-Emitting and Laser Diodes 2000 RADCOTS
Author: Allan Johnston
Document Date: 09/19/01 |
Proton Induced Transients and Charge Collection Measurements in LWIR HgCdTe Focal Plane Array
Author: Paul W. Marshall
Document Date: 02/13/04 |
Proton Induced Transients and Charge Collection Mechanisms in a LWIR HgCdTe Focal Plane Array
Author: Paul W. Marshall
Document Date: 02/13/04 |
Proton Irradiation Effects in Oxide-Confined Vertical Cavity Surface Emitting Laser (VCSEL) Diodes 1
Author: Chuck Barnes
Document Date: 09/19/01 |
Proton Radiation Response of SiGe HBT Analog and RF Circuits and Passives
Author: Cheryl Marshall1
Document Date: 01/29/04 |
Proton SEE Test Results for the Intel Pentium III (P3) Microprocessor
Author: James Howard
Document Date: 01/14/04 |
Proton SEE Testing of the Myrinet Crossbar Switch and Network Interface Card
Author: James Howard
Document Date: 01/21/04 |
Proton SEE Testing of the Myrinet Crossbar Switch and Network Interface Card
Author: James Howard
Document Date: 01/14/04 |
Proton SEE Testing of UT54LVDS217 Serializer
Author: Stephen Buchner
Document Date: 02/13/04 |
Proton SEU Cross Sections Derived from Heavy-Ion Test Data
Author: Larry Edmonds
Document Date: 09/19/01 |
Proton Single Event Effects (SEE) Guideline
Author: Ken LaBel
Document Date: 09/14/09 |
Proton Single Event Effects (SEE) Guideline - 2009 Proton Guideline
Author: Ken LaBel
Document Date: 11/12/13 |
Proton Test Guideline Development - Lessons Learned
Author: Stephen Buchner
Document Date: 01/29/04 |
Proton Test Results for MTX8501/MRX8501 12 x 1.25 Gbps Parallel Array Transmitter and Receiver Modul
Author: Paul W. Marshall
Document Date: 01/14/04 |
Proton Testing Guideline Development - Lessons Learned
Author: Stephen Buchner
Document Date: 01/14/04 |
Proton Testing of the AD8151 Cross-Point Switch
Author: Cheryl Marshall1
Document Date: 01/14/04 |
Proton Testing: Opportunities, Pitfalls and Puzzles - 2017 SEE-MAPLD Presentation
Author: Raymond Ladbury
Document Date: 11/07/17 |
Proton Tolerance of 3rd Generation, 0.12 um 185 GHz SiGe HBTs
Author: Yuan Lu
Document Date: 08/15/05 |
Proton Tolerance of Multiple-Threshold Voltage and Multiple-Breakdown Voltage CMOS Device Design
Author: Ying Li
Document Date: 08/15/05 |
Proton Tolerance of Third-Generation 0.12 um 185 GHz SiGe HBT Technology
Author: Robert Reed
Document Date: 02/13/04 |
Proton-Induced Bit Error Studies in a 10 Gb/s Fiber Optic Link
Author: Paul W. Marshall
Document Date: 02/13/04 |
Proton-Induced Bit Error Studies in a 10 Gb/s Fiber Optic Link (slides)
Author: Paul W. Marshall
Document Date: 02/13/04 |
Proton-induced dark current and charge transfer efficiency reponses of n-and p-channel CCD's
Author: Cheryl Marshall1
Document Date: 05/31/05 |
Pulsed Laser Test of Atmel SpaceWire ASIC
Author: Stephen Buchner
Document Date: 02/13/04 |
Quad Flat No-Lead (QFN) Evaluation Testing
Author: Reza Ghaffarian
Document Date: 02/26/18 |
Qualification of PEMs Using Board-level Testing
Author: Alexander Teverovsky
Document Date: 11/07/02 |
QUALIFIED PARTS LIST DIRECTORY
Author: Thomas Perry
Document Date: 06/17/04 |
Qualified Parts List Directory
Author: Javad Shockri
Document Date: 04/28/05 |
Radiation Damage of Electronic and Optoelectronic Devices in Space 2000 4th Int. WS on Rad Effects
Author: Allan Johnston
Document Date: 09/18/01 |
Radiation Effect Characterization and Test Methods of Single-Chip and Multi-Chip Stacked 16Mbit DRAM
Author: Ken LaBel
Document Date: 09/28/01 |
Radiation Effects Data for Commercially Available Optical Fiber: Database Summary
Author: Melanie Ott
Document Date: 01/21/04 |
Radiation Effects in Advanced Microelectronics Technologies 1997 RADECS
Author: Allan Johnston
Document Date: 09/18/01 |
Radiation Effects on Advanced Flash Memories 1999 NSREC
Author: Duc Nguyen
Document Date: 09/18/01 |
Radiation Effects on Current Field Programmable Technologies
Author: Ken LaBel
Document Date: 09/28/01 |
Radiation Effects on Electronics 101: Simple Concepts and New Challenges - NEPP WebEx Series #6
Author: Ken LaBel
Document Date: 04/22/04 |
Radiation Engineering for Designers - NASA Engineering Network Presentation
Author: Jonathan Pellish
Document Date: 08/09/17 |
Radiation Environment Inferred from Charge Collection Modeling of NICMOS Darkframes
Author: Raymond Ladbury
Document Date: 01/21/04 |
Radiation Environment Performance of JWST Prototype FPA's
Author: Paul W. Marshall
Document Date: 02/02/04 |
Radiation Environments and Environmental Models - an overview
Author: Janet Barth
Document Date: 01/06/04 |
Radiation Evaluation Method for COTS Boards
Author: Author Non-NEPP
Document Date: 01/18/02 |
Radiation Hardness of Optical Fiber Presentation to the Space Parts Working Group
Author: Melanie Ott
Document Date: 10/29/01 |
Radiation Induced Charge Collection in Detector Arrays
Author: Robert Reed
Document Date: 01/21/04 |
Radiation Requirements and Requirements Flowdown: Single Event Effects (SEEs) and Requirements
Author: Ken LaBel
Document Date: 10/18/13 |
Radiation Response of a MEMS Accelerometer: An Electrostatic Force
Author: Larry Edmonds
Document Date: 09/19/01 |
Radiation Test Results for Charge Coupled Device CCD486
Author: Paul W. Marshall
Document Date: 01/14/04 |
Radiation Test Results for the Pentium III (P3) Microprocessor
Author: James Howard
Document Date: 01/14/04 |
Radiation Testing and Evaluation Issues for Modern Integrated Circuits - 2005 RADECS Short Course Paper
Author: Ken LaBel
Document Date: 10/30/13 |
Radiation Testing of COTS 62.5/125/250 um Optical Fiber
Author: Melanie Ott
Document Date: 10/29/01 |
Radiation Testing of IEEE 1394 FireWire (presentation)
Author: Stephen Buchner
Document Date: 01/22/04 |
Radiation Testing of IEEE 1394 Firewire (slides)
Author: Stephen Buchner
Document Date: 02/02/04 |
Radiation-Aware Design for CubeSat Form-Factor Experiment using Goal Structuring Notation - SEANET 2016 Poster Presentation by Rebekah A. Austin
Author: Ken LaBel
Document Date: 08/15/17 |
Radiation-Hardened re-programmable Field-Programmable Gate Array (RHrFPGA)
Author: Anthony Sanders
Document Date: 08/22/06 |
Radiation-Inducd Charge Collection in Infrared Detector Arrays
Author: Robert Reed
Document Date: 01/29/04 |
Recent Advances and Future Challenges in Risk-Based Radiation Engineering - Presentation by Jonathan A. Pellish
Author: Jonathan Pellish
Document Date: 11/16/16 |
Recent Photonics Activities Under the NASA Electronic Parts and Packaging (NEPP) Program 2002
Author: Chuck Barnes
Document Date: 07/24/02 |
Recent Radiation Damage and SEE Test Results for Candidate Spacecraft Electronics
Author: Martha O'Bryan
Document Date: 01/21/04 |
Recent Radiation Damage and Single Event Effect Results For Microelectronics 1999
Author: Martha O'Bryan
Document Date: 09/28/01 |
Recent Radiation Damage and Single Event Effects for Candidate Spacecraft Electronics 2001
Author: Ken LaBel
Document Date: 02/22/02 |
Recent Radiation Test Results at JPL 2003
Author: Bernard Rax
Document Date: 09/22/03 |
Recent Radiation Test Results for Trench Power MOSFETs - 2017 NSREC Poster Presentation
Author: Jean-Marie Lauenstein
Document Date: 11/07/17 |
Recommended PEMs Packaging Test Flow & FIT Numbers used by Candidate Manufacturers 2003
Author: Robert (David) Gerke
Document Date: 02/18/03 |
Red Plague
Author: Author Non-NEPP
Document Date: 01/28/05 |
Red Plague - Quick Links
Author: Jeannette Plante1
Document Date: 01/10/05 |
Relay Failures Specific to Space Applications
Author: Alexander Teverovsky
Document Date: 03/05/02 |
Reliability Analysis of Avionics in the Commercial Aerospace Industry
Author: Author Non-NEPP
Document Date: 04/05/05 |
Reliability Assessment of Advanced Flip Chip in Cryogenic Temperatures
Author: Rajeshuni Ramesham
Document Date: 05/23/05 |
Reliability Characterization of GaAs FET Test Structures for Applications in RF/Microwave Modules
Author: Ashok Sharma
Document Date: 10/28/02 |
Reliability considerations for using PEMS in Military Applications
Author: Author Non-NEPP
Document Date: 01/18/02 |
Reliability Evaluation of Linear PEMs Rejected During C-SAM Examination (slides)
Author: Alexander Teverovsky
Document Date: 02/17/04 |
Reliability Implications Of Derating Leading Edge High Complexity Microcircuits
Author: Author Non-NEPP
Document Date: 01/18/02 |
Reliability Issues of COTS MEMS for Aerospace Applications
Author: Rajeshuni Ramesham
Document Date: 09/19/01 |
Reliability Issues Related to the Fatigue Strength of Gold Wire Used in Electronic Assemblies
Author: Jeannette Plante1
Document Date: 09/17/01 |
Reliability of Bvgdo Degraded Power X-Band GaAs MESFET
Author: Harry Shaw
Document Date: 10/23/01 |
Reliability of COTS PEMS
Author: Alexander Teverovsky
Document Date: 05/22/07 |
Reliability of Electronics at Cryogenic Temperatures
Author: Alexander Teverovsky
Document Date: 12/05/05 |
Reliability of Lead (Pb)-Free Solder Alloy
Author: Jong Kadesch
Document Date: 11/05/02 |
Reliability of NMOS Transistors from LL FDSOI Processes
Author: Udo Lieneweg
Document Date: 03/01/02 |
Resources for Radiation Test Data - SEEMAPLD 2014 Presentation
Author: Martha O'Bryan
Document Date: 12/14/16 |
Response of a FM08 Style Fuse to a Pulse of Current: Memo to XTE Project
Author: Henning Leidecker
Document Date: 10/25/01 |
Results for High Speed Op-Amp
Author: Michael Sandor
Document Date: 10/30/04 |
Results for Precision Voltage Reference - PEMS Eval
Author: Michael Sandor
Document Date: 10/30/04 |
Results for Proton and Neutron Testing of Optical Devices Used in the CIRS Instrument
Author: Robert Reed
Document Date: 09/28/01 |
Results of Screening and Qualification Testing of COTS PEMs for Space Applications and Lessons Learn
Author: Alexander Teverovsky
Document Date: 02/14/05 |
Reverse Bias Behavior of Surface Mount Solid Tantalum Capacitors
Author: Alexander Teverovsky
Document Date: 02/28/02 |
Reverse-Bias Degradation of SiGe Transistors at Normal and Cryogenic Temperatures
Author: Alexander Teverovsky
Document Date: 03/03/05 |
Reverse-Bias Degradation of SiGe Transistors at Normal and Cryogenic Temperatures - Ext'd Abstract
Author: Alexander Teverovsky
Document Date: 03/03/05 |
RF MEMS Benefits and Challenges of an Evolving Switch Technology
Author: Author Non-NEPP
Document Date: 05/14/03 |
RF Power handling of Capacitive RF MEMS Devices
Author: Author Non-NEPP
Document Date: 05/08/03 |
S-311-24 - Screening Procedure for a Medium Power, PNP, Silicon Transistor (2N4236)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-317A - Procurement Specification for a Thermostatic Switch
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-320/10G - Detail Specification For a Input Filter, 152 µH, 18V
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-320/7E - Detail Specification for a Input Filter, 90 µH, 10V
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-320/8E - Detail Specification For a Input Filter, 350 µH, 5V
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-320/9G - Detail Specification For a Input Filter, 315 µH, 10V
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-320-LATACD-0004A - Detail Specification for a 0.6 mH Filter Inductor
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-320-LATACD-0004B - Detail Specification for a 0.6 mH Filter Inductor
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-339/1 - Cable, Fiber Optic, Single Fiber, Multi-mode, Flexible Detail Specification for
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-348A - Procurement Specification for a Thermostatic Switch (3BT-DG-33)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-367B - Procurement Specification for a Three Phase Motor Protector Thermostatic Switch
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-407 - Screening Procedure for Diode, Silicon Photedetector Part No. S874-18K Hamamatsu Corporation
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-424B - Thermistor (Thermally Sensitive Resistor), Insulated, Negative Temperature Coefficient, Super Stable, Glass Encapsulated, Style 311-424, Specification for
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-426 - Procurement Specification for a Thermostatic Switch (Elmwood Sensors)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-428A - Procurement Specification for a Thermostatic Switch (Sunstrand Data Contro Inc.)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-429A - Procurement Specification for a Thermostatic Switch (Generic)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-641/01D - Switch, Thermostatic, (Bimetallic), Subminiature Sealed, Single Pole, Single Throw (SPST), Detail Specification for
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-641/02A - Switch, Thermostatic, Bimetallic, SPST, Narrow Differential, Hermetic, Detail Specification for
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-641/03H - Switch, Thermostatic, Bimetallic, SPST, Corrosion Resistant Steel, Hermetic, Detail Specification for
Author: Thomas Perry
Document Date: 05/29/12 |
S-311-641/04B - Switch, Thermostatic, Bimetallic, SPST, High Power, Hermetic, Detail Specification for
Author: Thomas Perry
Document Date: 05/29/12 |
S-311-641/05A - Switch, Thermostatic, (Bimetallic), Subminiature Sealed, Single Pole, Single Throw (SPST), 5 Amperes and Low Level, Detail Specification for
Author: Thomas Perry
Document Date: 07/31/12 |
S-311-641/06 - Switch, Thermostatic, (Bimetallic), Subminiature Sealed, Single Pole, Single Throw (SPST), 1 Ampere and Low Level, Detail Specification for
Author: Thomas Perry
Document Date: 07/31/12 |
S-311-641/07 - Switch, Thermostatic, (Bimetallic), Subminiature Sealed, Single Pole, Single Throw (SPST), 1 Ampere and Low Level, Detail Specification for
Author: Thomas Perry
Document Date: 07/31/12 |
S-311-641B - Switches, Thermostatic, General Requirements for
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-669 - Screening Procedure for Microcircuit AD7541ATQ CMOS 12-Bit Monolithic Multip1ying Digital to Analog Converter (For XTE use only)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-M-70D - SPECIFICATION FOR DESTRUCTIVE PHYSICAL ANALYSES (DPA)
Author: Bruce Meinhold
Document Date: 06/05/03 |
S-311-P-079E - Procuremet Specification for Thermofoil Heater
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-10D - Connectors, Electrical, Rectangular, Miniature, Polarized Shell, Rack and Panel, for Space Flight Use
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-13/1B - Wire, Electrical, Radiation Crosslinked Polyalkene Insulated, Tin-Coated Copper, 600 Volt, For Space Flight Use, Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-13/2A - Wire, Electrical, Radiation Crosslinked Polyalkene Insulated, Tin-Coated Copper, 1000 Volt, For Space Flight Use, Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-13/3A - Wire, Electrical, Radiation Croslinked polyalkene Insulated, Tin-Coated Copper, 2500 Volt, For Space Flight Use; Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-13B - Wire and Cable, Electrical, Insulated, for Space Flight Use
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-18L - Thermistor, (Thermally Sensitive Resistor), Insulated and Uninsulated, Negative Temperature Coefficient, Specifications for
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-4/05C - Connectors, Electrical, Rectangular, Subminiature, Polarized Shell, Detailed Specification for
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-4/06A - Contacts, Electrical, Coaxial, and High Voltage for Electrical Connectors
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-4/07C - CONNECTORS, ELECTRICAL, RECTANGULAR , SUBMINIATURE, RACK AND PANEL, DETAILED SPECIFICATION FOR
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-4/08C - CONTACTS, ELECTRICAL, POWER, CRIMP STYLE, REAR REMOVABLE, SIZE 22D
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-4/09C - Connectors, Electrical, Polarized Shell, Rack and Panel, for Space Flight Use
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-4/10C - CONTACTS, ELECTRICAL, CRIMP STYLE, SIZE 20
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-4D - CONNECTORS, ELECTRICAL, SUBMINIATURE, RACK AND PANEL, GENERAL SPECIFICATION FOR
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-626/01 - Connectors, Electric, Polarized Shell, Rack and Panel, Pin, Electromagnetic Interference Filter Contact, Nonmagnetic, Solder Type, D Subminiature
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-626/02 - Connector Adapter, Electric, Miniature D Rectangular, Polarized Shell, Standard and High Density, Electromagnetic Interference Filter Contacts
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-626/10B - Connector, Electric, Circular Polarized Shell, Electromagnetic Interference Filter Contact
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-626B - Connectors, Electric, Miniature Polarized Shell, Rack and Panel, Pin, Electromagnetic Interference Filter Contact, Nonmagnetic, Solder Type
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-672E - Resistor, Fixed, High Voltage (Victoreen Mini-Mex)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-683B - Resistor, Fixed, Precision High Voltage (Caddock Type MG and HG)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-718 - Connectors, Electrical, Rectangular, Polarized Shell, For Space Flight Use, Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-718/1 - Connectors, Electrical, Rectangular, Polarized Shell, For Space Flight Use, Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-718/2 - Contacts, Power and Coaxial, Removable, for Electrical Connectors, (Sizes 1, 2, and 3) For Space Flight Use, Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-718/3 - Connectors, Electrical, Rectangular, Polarized Shell, EMI Shielding (Size 1) For Space Flight Use, Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-718/4 - Backshell Kits, Connector Rectangular, EMI Shielding, Strain Relief (Sizes 1, 2, and 3) For Space Flight Use, Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-718/5 - Connectors, Electrical, Rectangular, Polarized Shell, EMI Shielding (Size 2) For Space Flight Use, Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-718/6 - Connectors, Electrical, Rectangular, Polarized Shell, EMT Shielding (size 3) For Space Flight Use
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-721 - Procurement Specification for Real Time Express DSP/Microcontroller, RTX2010RH Type Microcircuit, Radiation Hardened, (100 Kilorad (Si) minimum)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-741 - Resistor, Fixed, Low TC, Precision, High Voltage (Caddock Type TG)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-742D - Resistor, Fixed, Low TC, Precision, Radial-Lead (Caddoc Type TK)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-754/01 - Relays, Electromagnetic, Hermetically Sealed, 2PDT (2C), Latching, Low Level to 1 Ampere (TO-5 Enclosure)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-754/02 - Relays, Electromagnetic, Hermetically Sealed, 2PDT (2C), Latching, Low Level to 1 Ampere, Internal Diode for Coil Transients (To-5 Enclosure)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-754/03 - Relays, Electromagnetic, Hermetically Sealed, 2PDT (2C), Low Level to 1 Ampere (To-5 Enclosure)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-754/04A - Relays, Electromagnetic, Hermetically Sealed, 2PDT (2C), Low Level to 1 Ampere, Internal Diode for Coil Transients, (TO-5 Enclosure)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-754/05 - Relays, Electromagnetic, Hermetically Sealed, High Vibration, 2PDT (2C), Low Level to 1 Ampere (To-5 Enclosure)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-754/06B - Relays, Electromagnetic, Hermetically Sealed, 2PDT (2C), Permanent Magnet Drive, 10 AMP, All Welded, DC Coils
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-754/07A - Relays, Electromagnetic, Hermetically Sealed, 2PDT (2C), Low Level to 2 Amperes (0.150 Inch Terminal Spacing)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-754/08C - Relays, Electromagnetic, Hermetically Sealed, 4PDT (4C), Latching, Low level to 2 Amperes (0.150 inch Terminal Spacing)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-754/09 - Relays, Electromagnetic, Hermetically Sealed, 4PDT (4C), Low Level to 2 Amperes (0.150 inch Terminal Spacing)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-754/10B - Relays, Electromagnetic, Hermetically Sealed, 4PDT (4C), Permanent Magnet Drive, 10 Ampere, All Welded
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-754/11 - Relays, Electromagnetic, Hermetically Sealed, 3PDT (3C), Latching, 25 amperes, All Welded
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-754D - Relays, Electromagnetic, General Specification For
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-767A - Thermistor, Hermetically Sealed, Cryogenic, Negative Temperature Coefficient, Specification for
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-768 - Connectors, Electrical, Miniature, Circular, Low Outgassing [Amphenol (453) Suffix], General Specification for
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-772 - Connector, Coaxial, Panel Mount, Receptacle, Strip Line, Series SMA
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-783 - Control Drawing for a Radiation Tolerant, 32K X 8 CMOS EEPROM (Generic No. U28C256E)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-785 - Capacitor, Fixed, Axial-Lead, Metallized Polycarbonate Dielectric, Hermetically Sealed in Metal Cases. For use on the Hubble Space Telescope
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-787 - Procurement Specification for Diode, Temperature Sensing. (XDT-570)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-790 - PROCUREMENT SPECIFICATION FOR DIODE, LIGHT EMITTING, INFRARED, LPE GaAlAs, (OD-880WJ)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-791 - PROCUREMENT SPECIFICATION FOR DI ODE, LIGHT EMITTING, INFRARED, GaAlAs.
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-794A - Resistor, Fixed, Low TC, Precision High Stability (Caddock Type TK)
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-795A - Resistor, Fixed, Foil, Precicion, Power, Current Sensing, Hermetically Sealed
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-796C - Resistors, Matched-Pair", Low TC, Precision, Radial-Lead (Caddock Type TK)"
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-798 - Procurement Specification for Precision Trimming Potentiometer - Vishay 1285G
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-799/01A - Resistor, Network - Precision
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-799/02B - Resistor, Network - Precision
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-799/03B - Resistor, Network - Precision
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-799/04B - Resistor, Network - Precision
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-799/05C - Resistor, Network - Precision
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-799/06 - Resistor, Network - Film (Tantalum Nitride), Precision
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-799/07 - Resistor, Network - Film (Tantalum Nitride), Precision
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-799/08 - Resistor, Network-Film (Tantalum Nitride), Precision
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-799A - PROCUREMENT SPECIFICATION FOR HERMETICALLY SEALED RESISTOR NETWORKS, BASE SPECIFICATION
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-8(17) - Crystal Units, Quartz for Space Flight Use
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-813D - Resistor, Fixed, Low Temperature Characteristic Precision, Radial-Lead
Author: Jay Brusse
Document Date: 05/29/12 |
S-311-P-822A - Connectors, PWB, 2mmc PCITM Style, High Reliability
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-826A - Triaxial Connector, Ultraminiature
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-827A - Thermistor (Thermally Sensitive Resistor), Chip, Negative Temperature Coefficient or Positive Temperature Coefficient
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-829K - Capacitor, Ceramic, Multilayer Chip, Space Applications
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-835 - Connector, Electrical, RF, Twinaxial, Microminiature
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-P-838B - Capacitor, Ceramic, Multilayer Chip, Base-Metal Electrodes, Space Applications
Author: Author Non-NEPP
Document Date: 06/18/15 |
S-311-P-841 - General Specification for Thermofoil Heater, All-Polyimide, Space Applications
Author: Susana Douglas
Document Date: 02/19/16 |
S-311-S-819 - Resistor, Fixed, Foil (Managanin) Power, Current Sensing, Surface Mount
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-S-820 - Resistor, Fixed, Foil (Manganin) Power, Current Sensing, 2-Terminal, Surface Mount
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-311-S-821 - Resistor, Fixed, Foil (Manganin), Chip, Power, Current Sensing, Surface Mount
Author: Author Non-NEPP
Document Date: 05/29/12 |
S-312-P-003
Author: Author Non-NEPP
Document Date: 02/23/04 |
Scaling and Technology Issues for Soft Error Rates 2000 Res Rel
Author: Allan Johnston
Document Date: 09/19/01 |
SDRAM Testing: Lessons Learned (or How to test an SDRAM in Less than 7 years) - SEESYM 2010 Presentation
Author: Raymond Ladbury
Document Date: 11/13/13 |
SDRAMs: Can't Live With Them, But Can We Live Without Them?
Author: Raymond Ladbury
Document Date: 01/22/04 |
SEE & TID Testing of CULPRiT Reed Solomon Encoders
Author: Ken Li
Document Date: 02/02/04 |
SEE And Radiation Damage Results For Candidate Spacecraft Electronics 1998
Author: Martha O'Bryan
Document Date: 09/28/01 |
SEE Characteristics of CMOS Devices Employing Various Epi-layer Thicknesses
Author: Ken LaBel
Document Date: 09/28/01 |
SEE Characterization of the K4F660812 DRAM for ST5
Author: Author Non-NEPP
Document Date: 01/14/04 |
SEE Data Analysis of Multiple NASA Spacecraft and Experiments 1995
Author: Ken LaBel
Document Date: 09/28/01 |
SEE Proton and Heavy Ion Test Results for Candidate Spacecraft Electronics 1994
Author: Ken LaBel
Document Date: 09/28/01 |
SEE Proton And Heavy Ion Test Results In Support Of Candidate Nasa Programs 1995
Author: Ken LaBel
Document Date: 09/28/01 |
SEE Test Report on IEEE 1394
Author: Hak Kim
Document Date: 01/29/04 |
SEE Test Results For Candidate Spacecraft Electronics 1996
Author: Ken LaBel
Document Date: 09/28/01 |
SEE Test Results for CandidateSpacecraft Electronics 1996
Author: Ken LaBel
Document Date: 09/28/01 |
SEE Test Results for CandidateSpacecraft Electronics 1996
Author: Ken LaBel
Document Date: 09/25/01 |
SEE Testing of an Actel ASIC
Author: Stephen Buchner
Document Date: 02/13/04 |
SEE Testing of the AD8151 Digital Crosspoint Switch
Author: Stephen Buchner
Document Date: 01/29/04 |
SEE Testing of the Intel 80386 Family and the 80486 Microprocessor
Author: Ken LaBel
Document Date: 09/28/01 |
SEE Testing of the Intel Pentium III (P3) Microprocessor (presentation w/notes)
Author: James Howard
Document Date: 01/22/04 |
SEL Test Results for IBM 5HP CMOS Ring Oscillator
Author: Robert Reed
Document Date: 01/29/04 |
SEL Testing of the AD5334 Digital to Analog Converter
Author: James Howard
Document Date: 01/29/04 |
Selected Literature on COTS products.pdf
Author: Author Non-NEPP
Document Date: 01/22/02 |
SET and Destructive SEE Re-Testing of the MDI3051RED12ZF DC-to-DC Converters
Author: James Howard
Document Date: 01/29/04 |
SET and Destructive SEE Re-Testing of the MDI3051RED15ZF DC-to-DC Converters
Author: James Howard
Document Date: 01/29/04 |
SET and Destructive SEE Re-Testing of the MDI3051RES05ZF DC-to-DC Converters
Author: James Howard
Document Date: 01/29/04 |
SET and Destructive SEE Testing of the LTC1149 Step-Down Switching Regulator
Author: James Howard
Document Date: 01/29/04 |
SET and Destructive SEE Testing of the SG1525A PWM Controller
Author: James Howard
Document Date: 01/29/04 |
SETs in an LT1128 Op Amp by Heavy Ions
Author: Christian Poivey
Document Date: 02/10/04 |
SETs in Linear Devices - NASA GSFC Studies (slides)
Author: Christian Poivey
Document Date: 02/02/04 |
SETs in Linear Devices Testing Guidelines (slides)
Author: Christian Poivey
Document Date: 01/14/04 |
SETs in Linear Devices, Testing Guidelines (Slides)
Author: Christian Poivey
Document Date: 01/22/04 |
SETs in LM124 Op Amp Laser Test Report
Author: Ken LaBel
Document Date: 01/14/04 |
SEU Cross-Section Measurements on High Speed Silicon-on-Sapphire Divide-by-2 Devices
Author: Robert Reed
Document Date: 01/22/04 |
SEU Evaluation of SRAM Memories for Space Applications 2000 NSREC
Author: Leif Scheick
Document Date: 09/19/01 |
SEU Mitigation Testing of Xilinx Virtex II FPGAs
Author: Gary Swift
Document Date: 09/22/03 |
SEU Study of Seastar, and the MAP Anomaly (presentation)
Author: Christian Poivey
Document Date: 01/22/04 |
SEU Test Results for the Xilinx XQ1701L PROM 1999 NSREC
Author: Steven Guertin
Document Date: 09/19/01 |
SEU Test Results on a Prescalar Fab'd in IBM's 5HP SiGe Heterojunction Bipolar Transistors BiCMOS
Author: Robert Reed
Document Date: 01/21/04 |
SEUs in Evolving Commercial Silicon-on-Insulator Microprocessor Technologies
Author: Farokh Irom
Document Date: 09/22/03 |
SEUs in Flash Memories 1997 NSREC
Author: Allan Johnston
Document Date: 09/19/01 |
SEUs in Optocouplers 1998 NSREC
Author: Allan Johnston
Document Date: 09/19/01 |
Shock and Thermal Cycling Synergism Effects on Reliability of CBGA Assemblies
Author: Reza Ghaffarian
Document Date: 09/25/01 |
SiC and SOI Electronics for Harsh Environmental Applications - Part 1
Author: Author Non-NEPP
Document Date: 10/05/01 |
SiC and SOI Electronics for Harsh Environmental Applications - Part 2
Author: Author Non-NEPP
Document Date: 10/05/01 |
SiC and SOI Electronics for Harsh Environmental Applications - Part 3
Author: Author Non-NEPP
Document Date: 10/05/01 |
SiC and SOI Electronics for Harsh Environmental Applications - Part 4
Author: Author Non-NEPP
Document Date: 10/05/01 |
Single Event Effect Criticality Assessment(SEECA) - the SEECA document
Author: Ken LaBel
Document Date: 09/28/01 |
Single Event Effects (SEE) Challenges: Testing and Modeling Shortfalls - NEPP ETW 2012 Presentation
Author: Ken LaBel
Document Date: 10/24/13 |
Snapstrate and Socket for Chip-on-Board Programmable Technologies, September 1998
Author: Jeannette Plante1
Document Date: 09/17/01 |
Solid Tantalum Capacitor Surge Current Failure Mechanism Experiment
Author: Pete Jones
Document Date: 09/18/01 |
Space Flight Heritage of Optical Fiber Cables
Author: Author Non-NEPP
Document Date: 10/31/05 |
Space Parts Working Group (SPWG) Trip Report March 1998
Author: Jay Brusse
Document Date: 10/25/01 |
Space Qualification of InGaAs/InP Active Pixel Receivers
Author: Quiesup Kim
Document Date: 10/04/01 |
Space Radiation Effects on Electronics: Simple Concepts and New Challenges - 2004 MRS Presentation
Author: Ken LaBel
Document Date: 10/30/13 |
Space Weather Event on the Microwave Anisotropy Probe
Author: Christian Poivey
Document Date: 01/22/04 |
Space Weather Event on the Microwave Anisotropy Probe (presentation)
Author: Christian Poivey
Document Date: 01/22/04 |
SPICE Modeling the Electrical Interconnect of the Stackable Package
Author: Phillip Zulueta
Document Date: 09/17/01 |
Spotlight FPGA's: NEPP News Flash - December 2002
Author: Jeanne Ilg
Document Date: 12/10/02 |
Spotlight NEPP Website: NEPP News Flash - October 2001
Author: Chuck Barnes
Document Date: 11/01/01 |
Spotlight Optical Cable: NEPP News Flash - January 2002
Author: Author Non-NEPP
Document Date: 12/19/01 |
SSB-1: Guidelines for using PEMs.pdf
Author: Author Non-NEPP
Document Date: 01/18/02 |
Standard for preparing a COTS assembly management plan.doc
Author: Author Non-NEPP
Document Date: 01/22/02 |
Standards for Radiation Effects Testing: Ensuring Scientific Rigor in the Face of Budget Realities and Modern Device Challenges - HEART 2015 Presentation
Author: Jean-Marie Lauenstein
Document Date: 08/09/17 |
Statistical Modeling for Radiation Hardness Assurance: Toward Bigger Data - TNS 2015 paper
Author: Raymond Ladbury
Document Date: 08/09/17 |
Strategies for SEE Hardness Assurance — From Buy-It-And-Fly-It to Bullet Proof - 2017 NSREC Short Course Paper
Author: Raymond Ladbury
Document Date: 11/07/17 |
Strategies for SEE Hardness Assurance — From Buy-It-And-Fly-It to Bullet Proof - 2017 NSREC Short Course Presentation
Author: Raymond Ladbury
Document Date: 11/07/17 |
Structure Optimization of Au Wire Wedge-bond for High Temperature Applications
Author: Liangyu Chen-Author PI
Document Date: 06/07/05 |
Study of Measurement Variation in IR Images of COTS Computer Boards
Author: Jeannette Plante1
Document Date: 09/25/01 |
Summary of the Radiation Testing of the Intel Pentium III (P3) Microprocessor
Author: James Howard
Document Date: 01/03/03 |
Surface Micromachining of Diamond for Fabrication of MEMS Microstructures
Author: Rajeshuni Ramesham
Document Date: 09/19/01 |
Survey of Heterojunction Bipolar Transitor (HBT) Device Reliability
Author: Marcellus Proctor
Document Date: 02/12/04 |
Synopsis V1.1: Heavy Ion-Induced Single Event Effects Measurements on Advanced Analog DC/DC Converte
Author: Robert Reed
Document Date: 09/28/01 |
System Level Radiation Hardening - 2014 Microelectronic Technology Conference
Author: Raymond Ladbury
Document Date: 02/28/17 |
System on a Chip (SoC) Overview - NEPP ETW 2010 Presentation
Author: Ken LaBel
Document Date: 11/13/13 |
Technology Readiness Overview: Embedded Actives
Author: Stephen Strickland
Document Date: 01/28/05 |
Technology Readiness Overview: VCSELs
Author: Paul W. Marshall
Document Date: 02/13/04 |
Technology Readiness Overview: CMOS Ultra-Low Power Radiation Tolerant (CULPRiT) Integrated Circuits
Author: Mike Xapsos
Document Date: 02/02/04 |
Technology Validation of Optical Fiber Cables for Space Flight Environments
Author: Melanie Ott
Document Date: 09/14/01 |
Terrestrial Sources of X-Ray Radiation and Their Effects on NASA Flight Hardware - TID Paper by Scott Kniffin
Author: Scott Kniffin
Document Date: 11/16/16 |
Test Flows for Space PEMs
Author: Harry Shaw
Document Date: 02/28/02 |
Test Methodology for Characterizing SEE Response of a Commercial IEEE 1394 Serial Bus (FireWire)
Author: Christina Seidleck
Document Date: 01/22/04 |
Test Methodology for SET in Linear Devices
Author: James Howard
Document Date: 02/26/02 |
Test Standard Revision Update: JESD57, “Procedures for the Measurement of Single-Event Effects in Semiconductor Devices from Heavy-Ion Irradiation”- NEPP ETW 2015 Presentation
Author: Jean-Marie Lauenstein
Document Date: 08/09/17 |
The application of PEMS in space.pdf
Author: Author Non-NEPP
Document Date: 01/22/02 |
The Continuing Dangers of Tin Whiskers and Attempts to Control Them with Conformal Coating
Author: Jay Brusse
Document Date: 10/02/01 |
The Effects of Ionizing Radiation on Wearout and Reliability of Thin Gate Oxides 2000 MRQ
Author: Allan Johnston
Document Date: 09/19/01 |
The Effects of Proton Irradiation on SiGe:C HBTs
Author: Cheryl Marshall1
Document Date: 02/26/02 |
The Effects of Space Radiation on Linear Integrated Circuits 2000 Aerospace Conference
Author: Allan Johnston
Document Date: 09/19/01 |
The Future of COTS and QML in Military and Space Hardware
Author: Author Non-NEPP
Document Date: 01/18/02 |
The High-Speed Potential of Multi-Chip Modules Built with Pico-Substrates
Author: Jeannette Plante1
Document Date: 09/17/01 |
The Impact of System Configuration on Device Radiation Damage Testing of Optical Components
Author: Scott Kniffin
Document Date: 02/10/04 |
The Inaugural SEE Run for the NSCL SEE Test Facility (slides)
Author: Robert Reed
Document Date: 08/08/05 |
The Influence of Variations of Diffusion Length on Charge Collected by Diffusion from Ion Tracks
Author: Larry Edmonds
Document Date: 09/19/01 |
The Living With a Star Space Environment Testbed Experiments - SEEMAPLD 2014 Presentation
Author: Mike Xapsos
Document Date: 02/28/17 |
The Living With a Star Space Environment Testbed Payload - AFRL 2015 presentation
Author: Mike Xapsos
Document Date: 08/09/17 |
The NASA Electronics Radiation Characterization Project
Author: Ken LaBel
Document Date: 01/03/03 |
The opportunities and complexities of applying comercial off the shelf components.pdf
Author: Author Non-NEPP
Document Date: 01/22/02 |
The Perry Initiative and the use of PEMS in Military Equipment
Author: Author Non-NEPP
Document Date: 01/18/02 |
The Role of Parasitic Elements in the SET Response of Linear Circuits
Author: Stephen Buchner
Document Date: 01/29/04 |
The Space Radiation Envoronment as it Relates to Electronic System Performance - 2005 AAS Conference Presentation
Author: Ken LaBel
Document Date: 10/17/13 |
The Starfish exo-atmospheric high altitude nuclear weapons - HEART 2015 presentation
Author: System Administrator
Document Date: 11/18/15 |
The Starfish exo-atmospheric high altitude nuclear weapons - HEART 2015 supplemental paper
Author: System Administrator
Document Date: 11/18/15 |
The View from 10,000 ft – what is happening and what it means for flight electronics - NEPP ETW 2010 Presentation
Author: Ken LaBel
Document Date: 11/13/13 |
Thermal and Dynamic Assessment for 3D-Plus MCM-V Module
Author: Mark Fan
Document Date: 09/17/01 |
Thermal and Mechanical Reliability of Five COTS MEMS Accelerometers
Author: Reza Ghaffarian
Document Date: 02/28/02 |
Thermal Cycling Characterization of Complementary heterostructure Field Effect Transistors (CHFETs)
Author: Ashok Sharma
Document Date: 02/28/02 |
Thermal Cycling Effects On A JPL Flip Chip Printed Circuit Board
Author: Richard Patterson
Document Date: 03/05/03 |
Thermal Cycling/Shock Behavior of CSP Assemblies
Author: Reza Ghaffarian
Document Date: 10/02/01 |
Thermal Evaluation of Fiber Bragg Gratings at Extreme Temperatures
Author: Author Non-NEPP
Document Date: 10/25/06 |
Thermal Impedance Measurements for Quality Assessment of Metallurgically Bonded Diodes
Author: Alexander Teverovsky
Document Date: 03/05/02 |
Thermal Signature of a Resistor - And Problems Encountered Along the Way - NEPP-ETW 2016 Presentation by Jack Shue
Author: Ken LaBel
Document Date: 12/14/16 |
TI Device Change Notice 06/21/02
Author: Author Non-NEPP
Document Date: 06/21/02 |
TID and SEE Test Results for the Intel Pentium III and AMD K7 Microprocessors
Author: James Howard
Document Date: 02/22/02 |
TID and SEE Test Results for the Intel Pentium III and AMD K7 Microprocessors: an update (slides)
Author: James Howard
Document Date: 01/03/03 |
TID Radiation Induced Attenuation Testing at 1300 nm Using ISS Requirements on Three Optical Fibers
Author: Melanie Ott
Document Date: 09/19/01 |
TID Test Report for a P-Channel MOSFET IRLML5103A
Author: Author Non-NEPP
Document Date: 01/14/04 |
TID Test Report for a P-Channel MOSFET NDS352AP
Author: Author Non-NEPP
Document Date: 01/14/04 |
TID Test Report for an N-Channel MOSFET IRLML2803A
Author: Author Non-NEPP
Document Date: 01/14/04 |
TID Test Results for a N-Channel MOSFET FDN361AN
Author: Author Non-NEPP
Document Date: 01/14/04 |
TID Testing Results for A-to-D Converter (DAC) AD5334
Author: James Howard
Document Date: 01/14/04 |
TID, SEE and Radiation Induced Failures in Advanced Flash Memories
Author: Duc Nguyen
Document Date: 09/22/03 |
Tin Whisker Observations on Pure Tin-Plated Ceramic Chip Capacitors
Author: Jay Brusse
Document Date: 07/11/02 |
Tin Whiskers: Attributes and Mitigation
Author: Jay Brusse
Document Date: 07/11/02 |
Tin Whiskers: Revisiting An Old Problem
Author: Jay Brusse
Document Date: 09/19/01 |
Total Dose Degradation of MEMS Optical Mirrors
Author: Steven McClure
Document Date: 09/22/03 |
Total Ionizing Dose Effects on 64-Mb, 3.3 V DRAMs 1997 NSREC
Author: Allan Johnston
Document Date: 09/19/01 |
Total Ionizing Dose Effects on Flash Memories 1998 NSREC
Author: Duc Nguyen
Document Date: 09/19/01 |
Total Ionizing Dose Testing of the Intel Pentium III (P3) and AMD K7 Microprocessors
Author: James Howard
Document Date: 01/14/04 |
Training Slides for NASA-HDBK-8739.21
Author: Jeannette Plante1
Document Date: 03/02/11 |
Trip Report and Preliminary Test Results for 10 Gbps OMNET Flyable Link Proton Tests
Author: Paul W. Marshall
Document Date: 01/14/04 |
Trip Report EIA G12 Meeting 0104 Phoenix AZ MSampson
Author: Michael Sampson
Document Date: 02/13/04 |
Tutorial: Radiation Effects in Electronic Systems - 2017 ASEC presentation
Author: Jonathan Pellish
Document Date: 11/07/17 |
Twelve Channel Optical Fiber Connector Assembly: From Commercial off the Shelf to Space Flight Use
Author: Melanie Ott
Document Date: 10/29/01 |
Twelve Channel Optical Fiber Connector Assembly: From COTS to Space Flight Use (slides)
Author: Melanie Ott
Document Date: 10/29/01 |
Up Close With David Beverly and Curt Tallman
Author: Author Non-NEPP
Document Date: 10/02/01 |
Up Close with...Dr. Michael Greenfield
Author: Author Non-NEPP
Document Date: 02/28/02 |
Update on TID and SEE Testing of the Pentium III (P3) and AMD K7 Microprocessors
Author: James Howard
Document Date: 01/14/04 |
US Airforce Position on Tin Useage
Author: Author Non-NEPP
Document Date: 03/23/04 |
Use of PEMs in Military Equipment
Author: Author Non-NEPP
Document Date: 01/22/02 |
Use of Proton SEE Data as a Proxy for Bounding Heavy-Ion SEE Susceptibility - NSREC 2015 poster
Author: Raymond Ladbury
Document Date: 08/09/17 |
Using Infrared Imaging to Evaluate Bond Uniformity in Si Structures: JPL Meso-Gyro Failure Analysis
Author: Joanne Wellman
Document Date: 01/02/03 |
Using Proton Irradiation to Probe the Origins of Low-f Noise Variations in SiGe HBTs
Author: Robert Reed
Document Date: 08/15/05 |
Variables Affecting CSP Reliability
Author: Reza Ghaffarian
Document Date: 09/25/01 |
Vibration-induced Fatigue Failures in Bonding Wires Used in Stacked Chip Modules
Author: Henning Leidecker
Document Date: 09/17/01 |
Video: Electronic Packaging Technology for SiC based High Temperature Micro-systems - Part 1
Author: Liangyu Chen-Author PI
Document Date: 10/04/01 |
Video: Electronic Packaging Technology for SiC based High Temperature Micro-systems - Part 2
Author: Liangyu Chen-Author PI
Document Date: 10/04/01 |
Video: Electronic Packaging Technology for SiC based High Temperature Micro-systems - Part 3
Author: Liangyu Chen-Author PI
Document Date: 10/04/01 |
Video: Electronic Packaging Technology for SiC based High Temperature Micro-systems - Questions
Author: Liangyu Chen-Author PI
Document Date: 10/04/01 |
Video: Known Problems with the Use of Pure Tin Coatings - Questions
Author: Henning Leidecker
Document Date: 10/04/01 |
Video: Packaging and Reliability of Electronic Noses for Space Applications - Part 1
Author: Author Non-NEPP
Document Date: 10/04/01 |
Video: Packaging and Reliability of Electronic Noses for Space Applications - Part 2
Author: Author Non-NEPP
Document Date: 10/04/01 |
Video: Packaging and Reliability of Electronic Noses for Space Applications - Questions
Author: Author Non-NEPP
Document Date: 10/04/01 |
Video: Known Problems with the Use of Pure Tin Coatings - Part 1
Author: Henning Leidecker
Document Date: 10/04/01 |
Video: Known Problems with the Use of Pure Tin Coatings - Part 2
Author: Henning Leidecker
Document Date: 10/04/01 |
Virtual Qualification of Electronic Hardware
Author: Mike Osterman
Document Date: 10/05/01 |
What Can We Learn From Proton Recoils about Heavy-Ion SEE Sensitivity? - JEDEC 2016 Presentation
Author: Raymond Ladbury
Document Date: 04/20/17 |
What is Up at Jet Propulsion Laboratory? --- Ray Billig presentation, SAE AE-8 Meetings, San Diego, 2019Oct08
Author: Ray Billig
Document Date: 11/07/19 |
What's New in J-STD-001ES
Author: Jeannette Plante1
Document Date: 03/27/13 |
X-Band Power GaAs MESFET Investigation
Author: Harry Shaw
Document Date: 10/23/01 |