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Environmental Stress Testing of Power Transistors Encapsulated in Plastic Packages
Author: Alexander Teverovsky
Document Date: 11/23/04
Environmentally Induced Swelling and Shrinkage of Molding Compounds in PEMs
Author: Alexander Teverovsky
Document Date: 10/15/02
EOS Simulation and Failure Analysis of Metallurgically Bonded Silicon Diodes.
Author: Alexander Teverovsky
Document Date: 03/05/02
ERC Roadmap
Author: Ken LaBel
Document Date: 03/04/02
ESA Sponsored DC/DC Converter for Space
Author: Jeannette Plante1
Document Date: 12/21/04
ESD Prevention for GSFC Hardware
Author: Marcellus Proctor
Document Date: 10/01/03
ESD Stress Test Models
Author: Jose Sancho
Document Date: 01/30/06
ESD Testing of an EEPROM-Based Multichip Module
Author: Harry Shaw
Document Date: 10/23/01
EV61261_LT1014IS
Author: Alexander Teverovsky
Document Date: 02/22/02
EV72015_LT1014IS
Author: Alexander Teverovsky
Document Date: 02/22/02
EV78074_58V1001T25
Author: Alexander Teverovsky
Document Date: 02/22/02
Evaluating Constraints on Heavy-Ion SEE Susceptibility Imposed by Proton SEE Testing and Other Mixed Environments - NSREC 2016 oral presentation
Author: Raymond Ladbury
Document Date: 08/15/17
Evaluation of RF MEMS Lifetime Performance in a High Power (>1W) Application
Author: Joanne Wellman
Document Date: 01/02/03
Evaluation of 3D Plus Test Structures
Author: Jeannette Plante1
Document Date: 11/01/02
Evaluation of an Ultra Low Power Reed Solomon Encoder for NASA's ST5 Mission
Author: Ken Li
Document Date: 02/02/04
Evaluation of an Ultra Low Power Reed Solomon Encoder for NASA's ST5 Mission (slides)
Author: Mike Xapsos
Document Date: 02/02/04
Evaluation of Commercial Communication Protocols for Space Application
Author: Stephen Buchner
Document Date: 02/13/04
Evaluation of Data Retention Characteristics for Ferroelectric Random Access Memories (FRAMs)
Author: Ashok Sharma
Document Date: 11/19/01
Evaluation of ESD Effects During Removal of Conformal Coatings Using Micro Abrasive Blasting, 10/97
Author: Robert Cummings
Document Date: 09/17/01
Evaluation of Flexible Laminated Printed Circuit Boards Under Wide Temperature Cycling
Author: Richard Patterson
Document Date: 03/05/03
Evaluation of Laminated Flexible Printed Circuit Boards Under Wide Temperature Cycling
Author: Richard Patterson
Document Date: 02/28/02
Evaluation Of Linear Technology LT1461 Voltage Reference At Low Temperatures
Author: Richard Patterson
Document Date: 03/04/03
Evaluation of Maxwell Technology PowerCache Ultracapacitor
Author: Henry Machado
Document Date: 10/02/01
Evaluation of Micromachined Relays for Space Applications
Author: Alexander Teverovsky
Document Date: 02/03/03
Evaluation of MultiLayer Ceramic Capacitors for Low Voltage Type Failures - October 20, 2000
Author: Pete Jones
Document Date: 10/25/01
Evaluation of Non-Evaporable Getters for High Vacuum Hermetic Packages
Author: Rajeshuni Ramesham
Document Date: 05/23/05
Evaluation of the Die Attachment, Ablestik 84-1, for its Reliability for TDRS, September 1998
Author: Jong Kadesch
Document Date: 09/17/01
Evaluation of Vertical Cavity Surface Emitting Lasers (VCSEL) mounted on CVD Diamond Substrates
Author: Harry Shaw
Document Date: 10/25/01
Evaluation of Voltage Reference Circuits and N-Channel Field Effect Transistors at Low Temperatures
Author: Richard Patterson
Document Date: 03/05/03
Evaluation Report for the Amphenol-Bendix 453 Miniature Circular Connector with Mil-T-29504 Optical
Author: Jeannette Plante1
Document Date: 10/25/01
Executive Summary CVD Diamond Film Project WPI Major Qualifying Project
Author: Henning Leidecker
Document Date: 09/17/01
Experience With Plastic Part Evaluations at Cold Temperatures
Author: Michael Sandor
Document Date: 10/05/01
Experiment Test Plan for Determining Low Voltage Failure Mechanism in Ceramic Capacitors
Author: Pete Jones
Document Date: 09/18/01
Extreme Temperature (-125oC to +90oC) Thermal Cycling of UC282, LT1813, and LTC1409
Author: Rajeshuni Ramesham
Document Date: 02/28/02
Fabricating Diamond Membranes Using Reactive-Ion Etching
Author: Rajeshuni Ramesham
Document Date: 09/19/01
Failures in Hybrid Microcircuits during Environmental Testing
Author: Alexander Teverovsky
Document Date: 03/27/08
FEA Stress Analysis for the Comparison of BGA and CGA
Author: Mark Fan
Document Date: 09/17/01
Fiber Optic Cable Assemblies for Space Flight Applications - Issues and Remedies
Author: Melanie Ott
Document Date: 10/25/01
Fiber Optic Cable Assemblies for Space Flight Applications - Issues and Remedies, Viewgraphs
Author: Melanie Ott
Document Date: 10/23/01
Fiber Optic Cable Assemblies for Space Flight Applications III: Characterization of Commercial Cable
Author: Melanie Ott
Document Date: 09/17/01
Fiber Optic Cable Assemblies for Space Flight II - Thermal and Radiation Effects (AEIS Conf)
Author: Melanie Ott
Document Date: 10/29/01
Fiber Optic Cable Assemblies for Space Flight II - Thermal and Radiation Effects (JPL Pckg WShp)
Author: Melanie Ott
Document Date: 10/29/01
Fiber Optic Epoxy Outgassing Study for Space Flight Applications
Author: Melanie Ott
Document Date: 10/25/01
Fiber Optic System Qualification at Goddard Space Flight Center
Author: Melanie Ott
Document Date: 10/29/01
Final Results for the Photobit Active Pixel Sensor Heavy-Ion Transient Response Test
Author: Cheryl Marshall1
Document Date: 01/29/04
Flight Data Analysis Report - Seastar and XTE
Author: Christian Poivey
Document Date: 02/02/04
Flight Experiments for Living With a Star Space Environment Testbed (LWS-SET) - HEART 2003 Presentation
Author: Ken LaBel
Document Date: 10/30/13
Flip Chip on Organic Substrates: A Feasibility Study for Space Applications by Scott Popelar, Rich Measmer, Cobham Semiconductor Solutions; Jong-ook Suh, JPL - GOMAC Tech 2017 Presentation
Author: Doug Sheldon
Document Date: 08/31/17
Format for Quartely Report
Author: Ken LaBel
Document Date: 05/09/06
Fundamentals of Microelectromechanical Systems - Part 1 of 3
Author: Author Non-NEPP
Document Date: 10/22/01
Fundamentals of Microelectromechanical Systems - Part 2 of 3
Author: Author Non-NEPP
Document Date: 10/22/01
Fundamentals of Microelectromechanical Systems - Part 3 of 3
Author: Author Non-NEPP
Document Date: 10/22/01
Getters for Reliable Hermetic Packages
Author: Rajeshuni Ramesham
Document Date: 09/19/01
Giant Magnetoresistive (GMR) Sensor MicroElectroMechanical System (MEMS) Device
Author: Rajeshuni Ramesham
Document Date: 09/19/01
Glass Transition Temperature (Tg) Paper JPL
Author: Michael Sandor
Document Date: 11/01/04
Glass Transition Temperature (Tg) Presentation JPL
Author: Michael Sandor
Document Date: 11/01/04
GLAST LAT Project Parts and Mission Assurance Requirements (slides)
Author: Nick Virmani
Document Date: 01/18/02
Gold-Indium Intermetallic Compounds: Properties and Growth Rates
Author: Author Non-NEPP
Document Date: 08/08/03
Gone Fission: A Guide to Evaluating Risks Due to High-Z Materials in Active EEE Parts
Author: Raymond Ladbury
Document Date: 08/16/17
GSFC 311-INST Section C - Crystal Oscillators
Author: Author Non-NEPP
Document Date: 11/13/01
GSFC EEE Parts Activities 2003
Author: Darryl Lakins
Document Date: 03/04/03
GSFC Parts Engineering in COTS PEMs era (slides)
Author: Alexander Teverovsky
Document Date: 02/17/04
GSFC PEMs Information and Links
Author: Marcellus Proctor
Document Date: 10/25/04
GSFC-311-QPLD-031 - Qualified Parts List Directory
Author: Eric Haggquist
Document Date: 11/12/03
Guide of Space Grade Requirements for Electrical Connectors
Author: Melanie Ott
Document Date: 10/25/01
Guidebook on the Use of PEMs at High Altitudes (slides)
Author: Mike Osterman
Document Date: 11/06/01
Heavy Ion & Proton Test Results for SiGe CMOS: IBM 5HP and 7HP and Jazz Semiconductor Jazz-120
Author: Paul W. Marshall
Document Date: 06/01/05
Heavy Ion Broad Beam and Microprobe Studies of SEUs in 0.20 um SiGe HBT Transistors and Circuits
Author: Robert Reed
Document Date: 08/12/05
Heavy Ion SEE Power Supply for GaAs Power Amplifier TPS9103
Author: Christian Poivey
Document Date: 01/14/04
Heavy Ion SEE Test of 16 bit ADC LTC1608
Author: Christian Poivey
Document Date: 01/06/04
Heavy Ion SEE Test of 16 bit DAC LT1657
Author: Christian Poivey
Document Date: 01/06/04
Heavy Ion SEE Test of Power On Reset LP3470
Author: Christian Poivey
Document Date: 01/06/04
Heavy Ion SEE Test of Switching Regulator LM2651
Author: Christian Poivey
Document Date: 01/06/04
Heavy Ion SEE Test of the 5Ohm Ron SPST Switches ADG452
Author: Christian Poivey
Document Date: 01/06/04
Heavy Ion SEE Test on CMOS Voltage Converter ICL7662
Author: Christian Poivey
Document Date: 01/06/04
Heavy Ion SEE Test on the CMOS Op Amp LMC6484
Author: Christian Poivey
Document Date: 02/02/04
Heavy Ion SEE Test Report for 3 Candidate 22V10 Reprogrammable Logic Devices
Author: Scott Kniffin
Document Date: 01/14/04
Heavy Ion SEE Test Report for 4A Adjustable Switch Regulator MSK5042 Run 2 of 2
Author: Christian Poivey
Document Date: 01/14/04
Heavy Ion SEE Test Report for 4A Adjustable Switching Regulator MSK5042 Run 1 of 2
Author: Christian Poivey
Document Date: 01/14/04
Heavy Ion SEE Test Report for AN10E40 FPAA
Author: Anthony Sanders
Document Date: 01/14/04
Heavy Ion SEE Test Results for Temperature Sensor TMP36
Author: Christian Poivey
Document Date: 01/14/04
Heavy Ion SEE Testing of the Intel Pentium III (P3) Microprocessor
Author: James Howard
Document Date: 01/29/04
Heavy Ion SEE Tests of 8 bit ADC AD1175
Author: Christian Poivey
Document Date: 01/06/04
Heavy Ion Test Results for Electronic Devices
Author: Ken LaBel
Document Date: 09/28/01
Heavy Ion Testing at the Galactic Cosmic Ray Energy Peak - RADECS 2009 Paper
Author: Jonathan Pellish
Document Date: 11/12/13
Heavy Ion Transient and Latchup Tesing for the LM193A Dual Differential Comparator
Author: Anthony Sanders
Document Date: 01/29/04
Heavy Ion Transient and Latch-up Test Results for the OP42 Op Amp
Author: Anthony Sanders
Document Date: 01/29/04
Heavy Ion Transient Characterization of a Hardened-by-Design Active Pixel Sensor Array
Author: Cheryl Marshall1
Document Date: 01/21/04
High Density Microelectronics Packaging Roadmap For Space Applications 2001
Author: Lissa Galbraith
Document Date: 09/17/01
High Density Microelectronics Packaging Roadmap for Space Applications 2003
Author: Lissa Galbraith
Document Date: 06/17/02
High Density Microelectronics Roadmap for Aerospace Applications 2003
Author: Lissa Galbraith
Document Date: 03/13/03
High Frequency Of Radiation Hardened CMOS 8-Bit Flash Analog-To-Digital Converter At Cryogenic Temp.
Author: Richard Patterson
Document Date: 03/05/03
High Speed Fiber Optics Test Bed Network Technologies Investigation
Author: Melanie Ott
Document Date: 10/30/01
High-Temperature Degradation of Wire Bonds in Plastic Encapsulated Microcircuits
Author: Alexander Teverovsky
Document Date: 06/20/05
Historical: Draft Specification for Optical Cable for Space Flight I
Author: Jeannette Plante1
Document Date: 10/30/01
Historical: Draft Specification for Optical Cable for Space Flight II
Author: Jeannette Plante1
Document Date: 10/30/01
Historical: Draft Specification for Optical Cable for Space Flight III
Author: Jeannette Plante1
Document Date: 10/25/01
Historical: Draft Specification for Optical Cable for Space Flight IV
Author: Jeannette Plante1
Document Date: 10/30/01
Hot Pixel Annealing in the HST Wide Field Camera 3 CCD's
Author: Elizabeth Polidan
Document Date: 06/06/05
Hot-Carrier Degradation of 2-Volt Silicon-On-Insulator (SOI) Transistors
Author: Udo Lieneweg
Document Date: 10/04/01
Hot-Carrier Reliability of Transistors Fabricated by 0.25-mm Fully-Depleted SOI CMOS (Abstract)
Author: Udo Lieneweg
Document Date: 10/09/01
How Long Can the Hubble Space Telescope Operate Reliably? - 2014 NSREC Oral Presentation
Author: Mike Xapsos
Document Date: 08/09/17
How Long Can the Hubble Space Telescope Operate Reliably? – A Total Dose Perspective - 2014 TNS Paper
Author: Mike Xapsos
Document Date: 08/09/17
Hybrid Supplier Assessment Checklist
Author: Ashok Sharma
Document Date: 10/26/01
IEEE Parts Bulletin, June 2012, Volume 4, Issue 2
Author: Shri Agarwal
Document Date: 07/26/12
Impact of Proton Irradiation on High-Voltage 4H-SiC JBS Switching Diodes
Author: Zhiyun Luo
Document Date: 08/12/05
Impact of Tg of Molding Compounds on Screening and Reliability Qual of PEMs for Space (paper)
Author: Alexander Teverovsky
Document Date: 11/12/03
Impact of Tg of Molding Compounds on Screening and Reliability Qual of PEMs for Space (slides)
Author: Alexander Teverovsky
Document Date: 11/12/03
Implementing the Next Generation of NASA Class D Missions – Radiation Engineering Considerations for Higher?Risk Missions - MRQW 2013 Presentation
Author: Jonathan Pellish
Document Date: 02/25/14
Implications of Single Event Effect Characterization of Hybrid DC-DC Converters and a Solid State Po
Author: Ken LaBel
Document Date: 09/28/01
Improved Radiation Qualification & Test Methods for Optical Detector Noise Characterization
Author: Heidi Becker
Document Date: 08/29/05
Inclusion of Radiation Environment Variability in Total Dose Hardness Assurance Methodology - NSREC 2016 oral presentation
Author: Mike Xapsos
Document Date: 08/15/17
Inclusion of Radiation Environment Variability in Total Dose Hardness Assurance Methodology - TNS 2017 paper
Author: Mike Xapsos
Document Date: 08/15/17
In-flight Annealing of Displacement Damage in GaAs LEDs: A Galileo Story
Author: Gary Swift
Document Date: 09/22/03
In-Flight Anomalies and Radiation Performance of NASA Missions, Selected Lessons Learned - 2008 SERESSA Presentation
Author: Ken LaBel
Document Date: 11/12/13
In-Flight Observations of Multiple-Bit Upset in DRAMs 2000 NSREC
Author: Gary Swift
Document Date: 09/18/01
Influence of Structural Characteristics on the Response of Si Avalanche Photodiodes to Proton Rad
Author: Allan Johnston
Document Date: 09/23/03
Information Assurance Risk Management.pdf
Author: Michael Sampson
Document Date: 01/18/02
In-situ Measurements of Thermo-Mechanical Characteristics of Molding Compounds in PEMs
Author: Alexander Teverovsky
Document Date: 09/02/03
Inspection of Hidden Solder Connections
Author: Author Non-NEPP
Document Date: 10/05/01
Integral and Integrated Passives Webbook Update - Part 1
Author: Mike Osterman
Document Date: 11/07/01
Integral and Integrated Passives Webbook Update - Part 2
Author: Mike Osterman
Document Date: 11/07/01
Integral and Integrated Passives Webbook Update - Part 3
Author: Mike Osterman
Document Date: 11/07/01
Integral Heater for Reworking High Density Interfaces
Author: Author Non-NEPP
Document Date: 10/05/01
Intermetallic Issues with Wire Joining by Thermocompression and Soldering
Author: Henning Leidecker
Document Date: 03/11/05
International Rectifier Radiation-Hardened Power MOSFETs Under Wide Temperature
Author: Richard Patterson
Document Date: 03/05/03
Intersil HS-9008RH CMOS 8-Bit Flash Analog To Digital Converter in Temp. Range Of 23 C To 193 C
Author: Richard Patterson
Document Date: 03/05/03
INTRODUCING A NEW MEMBER TO THE FAMILY: GOLD WHISKERS
Author: Alexander Teverovsky
Document Date: 04/16/03
Introduction to the Workmanship Standards Program
Author: Jeannette Plante1
Document Date: 02/17/11
Investigation of Millisecond-Long Analog Single Event Transients in the LM6144 Op Amp
Author: Stephen Buchner
Document Date: 06/07/05
Investigation of Stepper Motor Controllers For Ultra Low Temperature Environments
Author: Richard Patterson
Document Date: 03/05/03
IPPAQ Optoelectronics Survey Results
Author: Melanie Ott
Document Date: 08/22/01
ISS FIber Optic Failure Investigation Root Cause Report
Author: Jeannette Plante1
Document Date: 09/27/05
JESD57 Test Standard, “Procedures for the Measurement of Single-Event Effects in Semiconductor Devices from Heavy-Ion Irradiation” Revision Updates - SEE-MAPLD 2016 presentation
Author: Jean-Marie Lauenstein
Document Date: 08/15/17
Joint Airlock Enhances International Space Station Spacewalk Capabilities
Author: Linda Fortenberry
Document Date: 10/02/01
JPL Institutional Parts Program Requirements
Author: Author Non-NEPP
Document Date: 09/03/03
JPL's Guide to Plastic COTS Parts (slides)
Author: Michael Sandor
Document Date: 01/22/02
Key Proton Test Findings for Sensor Technologies: CID816, HgCdTe, CCD
Author: Paul W. Marshall
Document Date: 02/13/04
Langley Research Center - Soluble Imide (LaRC-SI) Bonding Experiment
Author: James Bockman
Document Date: 10/04/01
LaRC Si-Environment
Author: Arthur Frederickson
Document Date: 01/23/02
Laser Diode Initiated Systems for Space Applications
Author: Author Non-NEPP
Document Date: 10/31/05
Laser SEE Test Results for AD7414 Temperature Sensor
Author: Scott Kniffin
Document Date: 01/21/04
Laser Single Event Effects Test Results for AD7414 Temperature Sensor
Author: Scott Kniffin
Document Date: 01/14/04
Laser Testing of CULPRiT RS Encoder and USES Compression Chip
Author: Ken Li
Document Date: 01/21/04
Latchup in Integrated Circuits from Energetic Protons 1997 NSREC
Author: Allan Johnston
Document Date: 09/19/01
Latchup Test Conditions for Analog-to-Digital Converters 2000
Author: Allan Johnston
Document Date: 09/19/01
LCC20 PACKAGES ON T.I. LM158A OPERATIONAL AMPLIFIERS UNDER EXTREME TEMP. & WIDE THERMAL CYCLING
Author: Richard Patterson
Document Date: 03/05/03
LEMO 3-Pin Connector Thermal Test in Vacuum
Author: David Beverly
Document Date: 03/06/06
Lessons Learned from Radiation-induced Effects on Solid State Recorders and Memories (report)
Author: Christian Poivey
Document Date: 02/02/04
Lessons Learned from Radiation-induced Effects on Solid State Recorders and Memories (slides)
Author: Christian Poivey
Document Date: 01/29/04
Lessons Learned from Screening and Qualification of COTS PEMs for Space Applications (slides)
Author: Alexander Teverovsky
Document Date: 02/17/04
Lessons Learned from Screening and Qualification Testing of COTS PEMS in 2004
Author: Alexander Teverovsky
Document Date: 05/23/05
Level I , II and III Requirements Compared for Microcircuits
Author: David Peters
Document Date: 03/23/04
Lifetime Characterization of Capacitive RF MEMS Switches
Author: Author Non-NEPP
Document Date: 05/14/03
List of Radiation Hardness Assurance References
Author: Author Non-NEPP
Document Date: 10/31/05
Low Temperature Evaluation of HTANFET SOI N-CHANNEL FET
Author: Richard Patterson
Document Date: 03/05/03
Low Temperature Evaluation Of The LTC1419 A/D Converter
Author: Richard Patterson
Document Date: 03/04/03
Low Temperature Evaluation Of The LTC1799 Oscillator
Author: Richard Patterson
Document Date: 03/04/03
Low Temperature Evaluation of the TC170 CMOS Current-Mode PWM Controller
Author: Richard Patterson
Document Date: 03/05/03
Low Temperature Evaluation of the UCC1802 Low Power BiCMOS Current Mode PWM
Author: Richard Patterson
Document Date: 03/06/03
Low Temperature Evaluation of the UCC3581 Voltage-Mode PWM Controller
Author: Author Non-NEPP
Document Date: 03/06/03
Low Temperature Evaluation of the UCC3585 Low Voltage Synchronization Buck Controller
Author: Author Non-NEPP
Document Date: 03/06/03
Low Temperature Evaluation of the UCC3588 5-bit Programmable Output Power Supply Controller
Author: Author Non-NEPP
Document Date: 03/06/03
Low Temperature Evaluation of the Unitrode UC3846 Current-Mode PWM Controller
Author: Richard Patterson
Document Date: 03/05/03
Low Temperature Performance of a 12-bit Serial CMOS A/D Converter
Author: Author Non-NEPP
Document Date: 03/06/03
Low Temperature Testing of JPL BGA Board #1
Author: Richard Patterson
Document Date: 03/05/03
Low-Cost Low Actuation Voltage Copper RF MEMS Switches
Author: Author Non-NEPP
Document Date: 05/08/03
Low-Temperature Electronics for Space & Terrestrial Applications - NEPP Webex Series #2
Author: Richard Patterson
Document Date: 12/17/03
Making Electronic Parts and Packaging Technology Viable for Flight Projects
Author: Richard Brace
Document Date: 10/04/01
Manufacturing Robustness of CSP on an SMT Line 
Author: Reza Ghaffarian
Document Date: 09/19/01
Measurement of the Effective Sensitive Volume of FAMOS Cells of an Ultraviolet Erasable Programmable
Author: Leif Scheick
Document Date: 09/19/01
Measurements of Thermo-Mechanical Characteristics of PEMs for Failure Analysis and Reliability Evalu
Author: Alexander Teverovsky
Document Date: 06/07/04
Meeting Minutes G-11 September 2003
Author: Author Non-NEPP
Document Date: 03/01/04
Meeting Report: DSCC, Resistors, 1996
Author: Jay Brusse
Document Date: 10/25/01
Memories and NASA Spacecraft: A Description of Memories, Radiation Failure Modes, and System Design Considerations - Spaceborne 2010 Presentation
Author: Ken LaBel
Document Date: 11/13/13
Memories and NASA Spacecraft: Part 1 - History and Requirements - RADECS 2010 Presentation
Author: Ken LaBel
Document Date: 11/13/13
Memories and NASA Spacecraft: Part 2 - Future Developments - RADECS 2010 Presentation
Author: Ken LaBel
Document Date: 11/13/13
Memory Overview, Technologies and Needs - NEPP ETW 2010 Presentation
Author: Ken LaBel
Document Date: 11/13/13
MEMS Sensors and Carrier-Level Reliability
Author: Mike Osterman
Document Date: 11/07/01
Microbeam Testing of SiGe HBTs Fabricated in IBM 5HP, 6HP and 7HP
Author: Robert Reed
Document Date: 02/13/04
Micromachined Low-Loss Microwave Switches
Author: Author Non-NEPP
Document Date: 05/08/03
Micromechanical Membrane Switches
Author: Author Non-NEPP
Document Date: 05/08/03
MIL-81044 - Wire, Electric, Crosslinked Polyakene Insulated
Author: Author Non-NEPP
Document Date: 03/12/03
MIL-C-123 - Fixed, Ceramic Dielectric High Reliability Capacitors
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-C-17 - Cables, Radio Frequency, Felxible and Semirigid
Author: Author Non-NEPP
Document Date: 03/12/03
MIL-C-27500 - Cable, Power, Electrical & Cable Special Purpose, Electrical Shielded & Unshielded
Author: Author Non-NEPP
Document Date: 03/12/03
MIL-C-85049 CONNECTOR ACCESSORIES, ELECTRICAL
Author: Author Non-NEPP
Document Date: 06/16/03
MIL-DTL-5015 CONNECTORS, ELECTRICAL, CIRCULAR THREADED, AN TYPE
Author: Author Non-NEPP
Document Date: 06/16/03
MIL-DTL-9395 - Switches, Pressure, (Absolute Gage & Differential)
Author: Author Non-NEPP
Document Date: 03/19/03
MIL-HDBK-978B - NASA Parts Application Handbook (Volumes 1 through 5)
Author: NASA Document Reference Only
Document Date: 11/04/04
MIL-HDBK-978B Volume 1 of 5
Author: NASA Document Reference Only
Document Date: 08/02/11
MIL-HDBK-978B Volume 2 of 5
Author: NASA Document Reference Only
Document Date: 08/02/11
MIL-HDBK-978B Volume 3 of 5
Author: NASA Document Reference Only
Document Date: 08/02/11
MIL-HDBK-978B Volume 4 of 5
Author: NASA Document Reference Only
Document Date: 08/02/11
MIL-HDBK-978B Volume 5 of 5
Author: NASA Document Reference Only
Document Date: 08/02/11
MIL-P-50884 - Printed Circuit Wiring Boards Flexible & Rigid-flex
Author: Author Non-NEPP
Document Date: 03/12/03
MIL-PRF-14409 - Capacitors, Variable (Piston Type, Tubular Trimmer)
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-PRF-15733 - Filters & Capacitors, Radio Frequency Interferece
Author: Author Non-NEPP
Document Date: 03/11/03
MIL-PRF-19978 - Capacitors, Fixed, Plastic (Or Paper-plastic) Dielectric
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-PRF-20J - Capacitor , Fixed, Ceramic Dielectric, (Temperature Compensating) Reliability
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-PRF-23269 - Capacitors, Fixed, Glass Dielectric, Established Reliability
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-PRF-23419 - Fuse, Cartridge, Instrument Type
Author: Author Non-NEPP
Document Date: 03/11/03
MIL-PRF-23648 - Resistors, Thermal (Thermistor)
Author: Author Non-NEPP
Document Date: 03/12/03
MIL-PRF-24236 - Switches, Thermostatic ( Metallic & Bimetallic)
Author: Author Non-NEPP
Document Date: 03/19/03
MIL-PRF-28861 - Filters & Capacitors, Radio Frequency/Electromagnetic Interference Suppresion
Author: Author Non-NEPP
Document Date: 03/11/03
MIL-PRF-3098 - Crystal Units, Quartz
Author: Author Non-NEPP
Document Date: 03/10/03
MIL-PRF-38534 - Integrated Circuits (Microcircuits) Manufacturing
Author: Author Non-NEPP
Document Date: 03/11/03
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing
Author: Author Non-NEPP
Document Date: 03/11/03
MIL-PRF-39001- Capacitors, Fixed, Mica Dielectric, Reliability
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-PRF-39003 - Capacitors, Fixed, Electrolytic (Solid Electrolyte), Tantalum
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-PRF-39006 - Capacitor, Fixed, Electrolytic (NonSolid Electrolytic) Tantalum Est. Reliability
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-PRF-39010/1E - Coils, Fixed, Radio Frequency, Molded, Microminiature, Magnetically Shielded
Author: Author Non-NEPP
Document Date: 03/28/03
MIL-PRF-39014 - Capacitor, Fixed, Ceramic Dielectric (General Purpose) Est. & Non-Est. Reliability
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-PRF-39014/22D, Capacitors, Fixed, Ceramic Dielectric (General Purpose), Established Reliability
Author: Author Non-NEPP
Document Date: 03/28/03
MIL-PRF-39014/2K-Capacitors, Fixed, Ceramic Dielectric (General Purpose), Est. & NonEst Reliability
Author: Author Non-NEPP
Document Date: 03/28/03
MIL-PRF-39014/5F, Capacitors, Fixed, Ceramic Dielectric (General Purpose), Established Reliability
Author: Author Non-NEPP
Document Date: 03/28/03
MIL-PRF-39015/2H, Resistors, Variable, Wire-Wound (Lead-Screw Actuated), Est. & NonEst. Reliability
Author: Author Non-NEPP
Document Date: 03/28/03
MIL-PRF-39015/3L, Resistors, Variable, Wire-Wound (Lead-Screw Actuated),Est. & NonEst. Reliability,
Author: Author Non-NEPP
Document Date: 03/28/03
MIL-PRF-39016 - Relays, Electromagnetic, Established Reliability
Author: Author Non-NEPP
Document Date: 03/11/03
MIL-PRF-39017/1P - Resistors, Fixed, Film (Insulated), NonEst. Reliability & Est. Reliability
Author: Author Non-NEPP
Document Date: 04/04/03
MIL-PRF-39017/3H - Resistors, Fixed, Film (Insulated), NonEst. Reliability, & Est. Reliability
Author: Author Non-NEPP
Document Date: 04/04/03
MIL-PRF-39017/5M - Resistors, Fixed, Film (Insulated), NonEst. & Est. Reliability
Author: Author Non-NEPP
Document Date: 04/04/03
MIL-PRF-39019/1G, Circuit Breakers, Magnetic, Low-Power, Sealed, Trip-Free one-Pole
Author: Author Non-NEPP
Document Date: 04/04/03
MIL-PRF-39022 - Capacitors, Fixed, Metallized, Paper-plastic film, CR Plastic Film Dielectric
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-PRF-39039017/2K - Resistors, Fixed, Film (Insulated), NonEst. & Est. Reliability
Author: Author Non-NEPP
Document Date: 04/04/03
MIL-PRF-49464 - Capacitors, Chip, Single Layer, Fixed, Parallel Flate, Ceramic Dielectric, Rel.
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-PRF-49467 - Capacitor, Fixed, Cermaic, Multilayer, High Voltage (General Purpose)
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-PRF-55310 - Oscillator, Crystal Controlled
Author: Author Non-NEPP
Document Date: 03/11/03
MIL-PRF-55365 - Capacitor, Fixed, Electrolytic (Tantalum), Chip, Est. & Non-Est Reliability
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-PRF-55681 - Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Est. & Non-Est. Rel.
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-PRF-55681/2C, Capacitors, Chips, Multiple Layers, Fixed, Ceramic Dielectric, Est. Reliability
Author: Author Non-NEPP
Document Date: 05/29/03
MIL-PRF-55681/3D, Capacitors, Chips, Multiple Layers, Fixed, Ceramic Dielectric, Est. Reliability
Author: Author Non-NEPP
Document Date: 05/29/03
MIL-PRF-55681/4E, Capacitors, Chips, Multiple Layers, Fixed, Ceramic Dielectric, Established Reliabi
Author: Author Non-NEPP
Document Date: 05/29/03
MIL-PRF-55681/5D, Capacitors, Chips, Multiple Layers, Fixed, Ceramic Dielectric, Est. Reliability
Author: Author Non-NEPP
Document Date: 05/29/03
MIL-PRF-55681/7B, Capacitors, Chips, Multiple Layers, Fixed, Ceramic Dielectric, Est. Reliability
Author: Author Non-NEPP
Document Date: 05/29/03
MIL-PRF-55681/8B, Capacitors, Chips, Multiple Layers, Fixed, Ceramic Dielectric, Established Reliabi
Author: Author Non-NEPP
Document Date: 05/29/03
MIL-PRF-6106 - Relays, Electromagnetic,
Author: Author Non-NEPP
Document Date: 03/11/03
MIL-PRF-81 - Capacitors, Variale, Ceramic Dielectric
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-PRF-83401/2G, Resistors, Network, Fixed, Film, Style RZ020
Author: Author Non-NEPP
Document Date: 05/29/03
MIL-PRF-83421 - Capacitors, Fixed, Metallized, Plastic Film Dielectric, Hermetically Sealed
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-PRF-83421/1B, Capacitors Fixed, Metallized Plastic Film Dielectric, DC & AC, Hermetically Sealed
Author: Author Non-NEPP
Document Date: 05/29/03
MIL-PRF-83446/6D, Coils, Radio Frequency, Chip, Fixed
Author: Author Non-NEPP
Document Date: 05/29/03
MIL-PRF-83513/2F, Connectors, Electrical, Rectangular, Receptacle, Microminiature, Polarized Shell
Author: Author Non-NEPP
Document Date: 05/29/03
MIL-PRF-83536 - Relays, Electromagnetic, Established Reliability
Author: Author Non-NEPP
Document Date: 03/11/03
MIL-PRF-87164 - Capacitors, Fixed, Mica Dielectric, High Reliability
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-PRF-87217 - Capacitors, Fixed, Supermetallized Plastic Film Dielectric
Author: Author Non-NEPP
Document Date: 03/03/03
MIL-PRF-8805 - Switches & Switch Assemblies, Sensitive, Snap Action
Author: Author Non-NEPP
Document Date: 03/19/03
MIL-R-39016/12F, Relays, Electromagnetic, Est. Reliability, DODT, Low Level to 1.0 Ampere (Latching)
Author: Author Non-NEPP
Document Date: 06/17/03
MIL-R-39016/15J, Relays, Electromagnetic, Est. Reliability, DODT, Low Level to 1.0 Ampere
Author: Author Non-NEPP
Document Date: 06/17/03
MIL-R-39016/18G, Relays, Electromagnetic, Est. Reliability, DODT, Low Level to 1.0 Ampere
Author: Author Non-NEPP
Document Date: 06/17/03
MIL-R-39016/20H, Relays, Electromagnetic, Est. Reliability, DODT, Low Level to 1.0 Ampere
Author: Author Non-NEPP
Document Date: 06/17/03
MIL-R-39016/23E - Relays, Electromagnetic, Established Reliability
Author: Author Non-NEPP
Document Date: 04/04/03
MIL-R-39016/29F - Relays, Electromagnetic, Established Reliability
Author: Author Non-NEPP
Document Date: 04/04/03
MIL-R-39016/31B - Relays, Electromagnetic, Established Reliability, Hermetically Sealed
Author: Author Non-NEPP
Document Date: 04/04/03
MIL-R-39016/7F, Relays, Electromagnetic, Established Reliability, SPDT, Low Level to 1.0 Ampere
Author: Author Non-NEPP
Document Date: 04/04/03
MIL-R-39016/9H, Relays, Electromagnetic, Established Reliability, DPDT, Low Level to 1.0 Ampere
Author: Author Non-NEPP
Document Date: 04/04/03
MIL-STD-1344 TEST METHODS FOR ELECTRICAL CONNECTORS
Author: Author Non-NEPP
Document Date: 06/16/03
MIL-STD-1553 AIRCRAFT INTERNAL TIME DIVISION COMMAND/RESPONSE MULTIPLEX DATA BUS
Author: Author Non-NEPP
Document Date: 06/16/03
MIL-STD-202 - Department Of Defense Test Method Standard Electronic & Electrical Component Parts
Author: Author Non-NEPP
Document Date: 03/11/03
MIL-STD-2223 Test Method For Insulated Electric Wire
Author: Author Non-NEPP
Document Date: 06/11/03
MIL-STD-750 - Department Of Defense Test Method Standards Semiconductor Devices
Author: Author Non-NEPP
Document Date: 03/11/03
MIL-STD-883 - Department Of Defense Test Method Standard Microcircuits
Author: Author Non-NEPP
Document Date: 03/11/03
MIL-STD-981 - Design, Manufacturing & Quality Standards for Custom Electromagnetic Devices
Author: Author Non-NEPP
Document Date: 03/11/03
MIL-W-22759 - Wire, Electric, Fluoropolymer-insulated Extrude TFE
Author: Author Non-NEPP
Document Date: 03/12/03
Modeling of SEEs in Circuit-Hardened High-Speed SiGe HBT Logic
Author: Paul W. Marshall
Document Date: 01/29/04
Modeling of Single Event Effects in Circuit-Hardened High-Speed SiGe HBT Logic
Author: Robert Reed
Document Date: 02/26/02
Modeling Radiation-Induced Transients in the Next Generation Space Telescope (NGST)
Author: Robert Reed
Document Date: 01/29/04
Moisture Characteristics of Molding Compound and Environmental Effects in PEMs (slides)
Author: Alexander Teverovsky
Document Date: 11/26/02
Moisture Characteristics of Molding Compounds in PEMs (slides)
Author: Alexander Teverovsky
Document Date: 10/28/02
Moisture diffusion in molding compounds and quality assurance of PEMs for space applications
Author: Alexander Teverovsky
Document Date: 12/09/02
Moisture effects in PEMs intended for space applications (slides)
Author: Alexander Teverovsky
Document Date: 04/12/02
Moisture-related failures of operational amplifiers in plastic packages
Author: Alexander Teverovsky
Document Date: 08/16/04
Monte Carlo Simulation of BGA Failure Distributions for Virtual Qualification
Author: Reza Ghaffarian
Document Date: 09/25/01
MPTB AS-1773 FODB Lessons Learned
Author: Christina Seidleck
Document Date: 02/13/04
MSFC-STD-3012A - ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE
Author: Author Non-NEPP
Document Date: 07/17/14
MSFC-STD-355C with Amendment 1: STANDARD - RADIOGRAPHIC INSPECTION OF ELECTRONIC PARTS
Author: NASA Document Reference Only
Document Date: 01/27/12
Multi Spectral Lidar
Author: Melanie Ott
Document Date: 10/31/05
NASA Detector Requirements (slides)
Author: Cheryl Marshall1
Document Date: 02/13/04
NASA EEE Parts Assurance Group (NEPAG)
Author: David Peters
Document Date: 10/10/01
NASA Electronic Radiation Characterization Project
Author: Ken LaBel
Document Date: 01/14/04
NASA Electronics Parts & Packaging Program Assurance Research on Optoelectronics
Author: Melanie Ott
Document Date: 10/31/05
NASA Perspective on Radiation Hardness Assurance (RHA)
Author: James Howard
Document Date: 01/29/04
NASA Presentation to G12 Space Sub-Committee
Author: Michael Sampson
Document Date: 10/23/13
NASA Presentation to G12 Space Sub-Committee
Author: Michael Sampson
Document Date: 02/25/14
NASA Techn Brief: Tailoring Cores of Optical Fibers by a Sol-Gel Method
Author: Harry Shaw
Document Date: 10/25/01
NASA-STD-6001 FLAMMABILITY, ODOR, OFFGASSING, & COMPATIBILITY REQUIREMENTS & TEST PROCEDURES
Author: Author Non-NEPP
Document Date: 06/09/03
NASA-STD-8739.1B
Author: Jeannette Plante
Document Date: 04/28/17
NASA-STD-8739.3 - Soldered Electrical Connections
Author: Author Non-NEPP
Document Date: 03/11/03
NASA-STD-8739.4A
Author: Jeannette Plante
Document Date: 04/28/17
NASA-STD-8739.5A
Author: Jeannette Plante
Document Date: 04/28/17
NASA-STD-8739.6A
Author: Jeannette Plante
Document Date: 04/28/17
NEPAG PEMS Activation Energy Calculator
Author: Michael Sandor
Document Date: 11/01/04
NEPAG PEMS CSAM Data Analysis for Multiplexer
Author: Michael Sandor
Document Date: 11/02/04
NEPAG PEMS CSAM Data Review for Multiplexer
Author: Michael Sandor
Document Date: 11/02/04
NEPAG PEMS Guidelines DRAFT
Author: Michael Sandor
Document Date: 11/02/04
NEPAG PEMS MSL & Moisture Qualification Results
Author: Robert (David) Gerke
Document Date: 11/01/04
NEPAG PEMS Packaging Evaluation Results
Author: Robert (David) Gerke
Document Date: 11/01/04
NEPP and CALCE Working Together
Author: Mike Osterman
Document Date: 10/09/01
NEPP Conference 2002 Final Program
Author: Lissa Galbraith
Document Date: 04/26/02
NEPP News Flash - June 2001
Author: Chuck Barnes
Document Date: 10/09/01
NEPP News Flash - November 2001
Author: Author Non-NEPP
Document Date: 11/28/01
NEPP News Flash - October 2002
Author: Jeanne Ilg
Document Date: 10/17/02
NEPP News Flash - September 2001
Author: Chuck Barnes
Document Date: 10/09/01
NEPP News Flash May 2006
Author: Lois Scaglione
Document Date: 05/09/06
NEPP Parts Activities Presented to SPWG (March 1998)
Author: Jay Brusse
Document Date: 10/25/01
New DC/DC Converter for Space Applications - JAXA
Author: Author Non-NEPP
Document Date: 12/21/04
No-Clean Assembly Process Conditions - Effects on Flip-Chip/Underfill Reliability
Author: Author Non-NEPP
Document Date: 10/05/01
Notes on the Reliability of The HST Gyros
Author: Henning Leidecker
Document Date: 01/28/02
On Nibbles and Bytes: The Conundrum of Memory for Space Systems - NASA Electronic Parts and Packaging (NEPP) and Efforts in Memories - 2009 RHET Presentation
Author: Ken LaBel
Document Date: 11/12/13
On the Role of Energy Deposition in Triggering SEGR in Power MOSFETs 1999 NSREC
Author: Luis Selva
Document Date: 09/19/01
On the Suitability of Fiber Optic Data Links in the Space Radiation Environment
Author: Ken LaBel
Document Date: 09/17/01
Optical Assemblies for Space Environments: Characterization of W.L.Gore Flexlite with Diamond AVIMS
Author: Melanie Ott
Document Date: 03/31/04
Optical Fiber Cable Assembly Characterization for the Mercury Laser Altimeter (MLA)
Author: Melanie Ott
Document Date: 06/16/03
Optical Inspection of ADI OP Amp Packages Before and After Thermal Cycling (-125oC to 90oC
Author: Rajeshuni Ramesham
Document Date: 10/02/01
Overview of COTS Reliability Work Done by JPL
Author: Michael Sandor
Document Date: 11/01/04
Overview of NASA-STD-8739.1A Changes
Author: Jose Sancho
Document Date: 05/27/09
Overview of NEPAG COTS PEMS Evaluation
Author: Michael Sandor
Document Date: 10/30/04
Package induced instability in voltage reference PEMs (slides)
Author: Alexander Teverovsky
Document Date: 06/17/03
Package Qualification Testing Results Performed on the 5 Part Types in the NEPP/NEPAG PEMS Study
Author: Robert (David) Gerke
Document Date: 03/18/04
Packaging of High Temperature SiC Based Electronics
Author: Liangyu Chen-Author PI
Document Date: 10/02/01
Packaging Technology for 500° SiC Microsystems
Author: Liangyu Chen-Author PI
Document Date: 10/04/01
Parameter Degradation and SEU in Optocouplers in Radiation Environments
Author: Robert Reed
Document Date: 02/26/02
Particle Test Fluence: What’s the Right Number? - SEEMAPLD 2014 Presentation
Author: Ken LaBel
Document Date: 07/27/16
Particle Test Fluence: What’s the Right Number? - SEEMAPLD 2014 Presentation
Author: Ken LaBel
Document Date: 02/28/17
Parts Obsolescence Workshop: Impact of Commercial Parts on Part Obsolescence 1997
Author: Author Non-NEPP
Document Date: 01/18/02
Parts Selection for Space Systems, An Overview and Radiation Perspective - 2008 SERESSA Presentation
Author: Ken LaBel
Document Date: 11/12/13
PEM-INST-001 Instructions for Plastic Encapsulated Microcircuit (PEM) Select, Screen, & Qualify
Author: Alexander Teverovsky
Document Date: 06/16/03
PEMS Cold Tests Powerpoint Slides
Author: Jeannette Plante1
Document Date: 11/01/04
PEMS CSAM Presentation JPL
Author: Michael Sandor
Document Date: 11/01/04
PEMS Moisture Test Terminology Compared
Author: Jeannette Plante1
Document Date: 11/01/04
PEMs Research
Author: Alexander Teverovsky
Document Date: 09/23/04
PEMS-INST-001 (pointer)
Author: Alexander Teverovsky
Document Date: 01/04/05
Performance of Analog Devices OP284 OpAmps Under Wide Temperature Cycling
Author: Richard Patterson
Document Date: 03/05/03
Performance of Low-Loss RF MEMS Capacitive Switches
Author: Muzar Jah
Document Date: 05/08/03
Performance of Rad-Hard Quad Receivers at Extreme Temperatures
Author: Quiesup Kim
Document Date: 10/04/01
Performance Of The AD590 Temperature Transducer At Low Temperature
Author: Richard Patterson
Document Date: 03/05/03
Performance Of The Analog Devices AD780BR Voltage Reference At Cryogenic Temperatures
Author: Richard Patterson
Document Date: 03/05/03
Performance of the LTC1650 16-bit D/A Converter at Cyrogenic Temperatures
Author: Author Non-NEPP
Document Date: 03/06/03
Performance of Various Types of Resistors at Low Temperatures
Author: Richard Patterson
Document Date: 03/05/03
Phase And Gain Response Of A Closed-Loop-Control High Voltage DC-DC Converter At Cryo Temperatures
Author: Richard Patterson
Document Date: 03/04/03
Phenomenological Application of Target Theory Effects in SEE Analysis 2000 SEE Symp
Author: Leif Scheick
Document Date: 09/19/01
Photonic Integrated Circuit (PIC) Device Structures: Background, Fabrication Ecosystem, Relevance to Space Systems Applications, and Discussion of Related Radiation Effects - BOK Paper by Shannon Alt
Author: Ken LaBel
Document Date: 09/29/16
Photonic Integration and Usage Guidelines Manual D-18228
Author: Author Non-NEPP
Document Date: 10/30/01
Photonic Validation Methods Handbook D-18230
Author: Author Non-NEPP
Document Date: 10/30/01
Plastic Encapsulated Microcircuit (PEM) Derating, Storage and Qualification Report
Author: Ashok Sharma
Document Date: 10/25/01
Plastic Encapsulated Microcircuit (PEM) Guidelines for Screening and Qualification for Space
Author: Jong Kadesch
Document Date: 09/28/01
Plastic Encapsulated Microcircuits (PEMs) Reliability/Usage Guidelines For Space Applications
Author: Michael Sandor
Document Date: 10/30/02
Potential Manufacturers for High Reliability Solid-State Relays
Author: David Beverly
Document Date: 06/01/05
PPL-21 Notice 1
Author: NASA Document Reference Only
Document Date: 06/18/03
Preliminary Evaluation of Data Retention Characteristics for Ferroelectric Random Access Memories
Author: Ashok Sharma
Document Date: 10/02/01
Preliminary Heavy Ion SEE Test of ADC 16 bits LTC1605
Author: Christian Poivey
Document Date: 01/29/04
Preliminary Heavy Ion SEE Test Report for CMOS Op-Amp LMC6484
Author: Christian Poivey
Document Date: 01/14/04
Preliminary Test Plan for Reliability Evaluation of Copper-Based Metallization Systems
Author: Ashok Sharma
Document Date: 10/25/01
President's Vision on Space Exploration Feb 12, 2004
Author: Author Non-NEPP
Document Date: 03/23/04
Probabilistic Model for Low Altitude Trapped Proton Fluxes
Author: Mike Xapsos
Document Date: 01/21/04
Probing Proton Damage in SOI CMOS Technology by Using Lateral Bipolar Action
Author: Ying Li
Document Date: 08/15/05
Programmable Oscillators: Evaluation Test Report
Author: Shri Agarwal
Document Date: 05/17/05
Programmable Read Only Memory (PROM) Programming Procedure Guideline, 2000
Author: Ashok Sharma
Document Date: 10/25/01
Proton and Heavy Ion SEE Test Results for 12.5 GHz Pseudo-Random Number Generator via IBM 7HP SiGe
Author: Robert Reed
Document Date: 01/14/04
Proton Damage Effects in Linear Integrated Circuits 1998 NSREC
Author: Bernard Rax
Document Date: 09/18/01
Proton Damage in Linear and Digital Optocouplers 1999 RADECS
Author: Allan Johnston
Document Date: 09/19/01
Proton Degradation in Light-Emitting Diodes 1999 NSREC
Author: Allan Johnston
Document Date: 09/18/01
Proton Displacement Damage in Light-Emitting and Laser Diodes 2000 RADCOTS
Author: Allan Johnston
Document Date: 09/19/01
Proton Induced Transients and Charge Collection Measurements in LWIR HgCdTe Focal Plane Array
Author: Paul W. Marshall
Document Date: 02/13/04
Proton Induced Transients and Charge Collection Mechanisms in a LWIR HgCdTe Focal Plane Array
Author: Paul W. Marshall
Document Date: 02/13/04
Proton Irradiation Effects in Oxide-Confined Vertical Cavity Surface Emitting Laser (VCSEL) Diodes 1
Author: Chuck Barnes
Document Date: 09/19/01
Proton Radiation Response of SiGe HBT Analog and RF Circuits and Passives
Author: Cheryl Marshall1
Document Date: 01/29/04
Proton SEE Test Results for the Intel Pentium III (P3) Microprocessor
Author: James Howard
Document Date: 01/14/04
Proton SEE Testing of the Myrinet Crossbar Switch and Network Interface Card
Author: James Howard
Document Date: 01/21/04
Proton SEE Testing of the Myrinet Crossbar Switch and Network Interface Card
Author: James Howard
Document Date: 01/14/04
Proton SEE Testing of UT54LVDS217 Serializer
Author: Stephen Buchner
Document Date: 02/13/04
Proton SEU Cross Sections Derived from Heavy-Ion Test Data
Author: Larry Edmonds
Document Date: 09/19/01
Proton Single Event Effects (SEE) Guideline
Author: Ken LaBel
Document Date: 09/14/09
Proton Single Event Effects (SEE) Guideline - 2009 Proton Guideline
Author: Ken LaBel
Document Date: 11/12/13
Proton Test Guideline Development - Lessons Learned
Author: Stephen Buchner
Document Date: 01/29/04
Proton Test Results for MTX8501/MRX8501 12 x 1.25 Gbps Parallel Array Transmitter and Receiver Modul
Author: Paul W. Marshall
Document Date: 01/14/04
Proton Testing Guideline Development - Lessons Learned
Author: Stephen Buchner
Document Date: 01/14/04
Proton Testing of the AD8151 Cross-Point Switch
Author: Cheryl Marshall1
Document Date: 01/14/04
Proton Testing: Opportunities, Pitfalls and Puzzles - 2017 SEE-MAPLD Presentation
Author: Raymond Ladbury
Document Date: 11/07/17
Proton Tolerance of 3rd Generation, 0.12 um 185 GHz SiGe HBTs
Author: Yuan Lu
Document Date: 08/15/05
Proton Tolerance of Multiple-Threshold Voltage and Multiple-Breakdown Voltage CMOS Device Design
Author: Ying Li
Document Date: 08/15/05
Proton Tolerance of Third-Generation 0.12 um 185 GHz SiGe HBT Technology
Author: Robert Reed
Document Date: 02/13/04
Proton-Induced Bit Error Studies in a 10 Gb/s Fiber Optic Link
Author: Paul W. Marshall
Document Date: 02/13/04
Proton-Induced Bit Error Studies in a 10 Gb/s Fiber Optic Link (slides)
Author: Paul W. Marshall
Document Date: 02/13/04
Proton-induced dark current and charge transfer efficiency reponses of n-and p-channel CCD's
Author: Cheryl Marshall1
Document Date: 05/31/05
Pulsed Laser Test of Atmel SpaceWire ASIC
Author: Stephen Buchner
Document Date: 02/13/04
Quad Flat No-Lead (QFN) Evaluation Testing
Author: Reza Ghaffarian
Document Date: 02/26/18
Qualification of PEMs Using Board-level Testing
Author: Alexander Teverovsky
Document Date: 11/07/02
QUALIFIED PARTS LIST DIRECTORY
Author: Thomas Perry
Document Date: 06/17/04
Qualified Parts List Directory
Author: Javad Shockri
Document Date: 04/28/05
Radiation Damage of Electronic and Optoelectronic Devices in Space 2000 4th Int. WS on Rad Effects
Author: Allan Johnston
Document Date: 09/18/01
Radiation Effect Characterization and Test Methods of Single-Chip and Multi-Chip Stacked 16Mbit DRAM
Author: Ken LaBel
Document Date: 09/28/01
Radiation Effects Data for Commercially Available Optical Fiber: Database Summary
Author: Melanie Ott
Document Date: 01/21/04
Radiation Effects in Advanced Microelectronics Technologies 1997 RADECS
Author: Allan Johnston
Document Date: 09/18/01
Radiation Effects on Advanced Flash Memories 1999 NSREC
Author: Duc Nguyen
Document Date: 09/18/01
Radiation Effects on Current Field Programmable Technologies
Author: Ken LaBel
Document Date: 09/28/01
Radiation Effects on Electronics 101: Simple Concepts and New Challenges - NEPP WebEx Series #6
Author: Ken LaBel
Document Date: 04/22/04
Radiation Engineering for Designers - NASA Engineering Network Presentation
Author: Jonathan Pellish
Document Date: 08/09/17
Radiation Environment Inferred from Charge Collection Modeling of NICMOS Darkframes
Author: Raymond Ladbury
Document Date: 01/21/04
Radiation Environment Performance of JWST Prototype FPA's
Author: Paul W. Marshall
Document Date: 02/02/04
Radiation Environments and Environmental Models - an overview
Author: Janet Barth
Document Date: 01/06/04
Radiation Evaluation Method for COTS Boards
Author: Author Non-NEPP
Document Date: 01/18/02
Radiation Hardness of Optical Fiber Presentation to the Space Parts Working Group
Author: Melanie Ott
Document Date: 10/29/01
Radiation Induced Charge Collection in Detector Arrays
Author: Robert Reed
Document Date: 01/21/04
Radiation Requirements and Requirements Flowdown: Single Event Effects (SEEs) and Requirements
Author: Ken LaBel
Document Date: 10/18/13
Radiation Response of a MEMS Accelerometer: An Electrostatic Force
Author: Larry Edmonds
Document Date: 09/19/01
Radiation Test Results for Charge Coupled Device CCD486
Author: Paul W. Marshall
Document Date: 01/14/04
Radiation Test Results for the Pentium III (P3) Microprocessor
Author: James Howard
Document Date: 01/14/04
Radiation Testing and Evaluation Issues for Modern Integrated Circuits - 2005 RADECS Short Course Paper
Author: Ken LaBel
Document Date: 10/30/13
Radiation Testing of COTS 62.5/125/250 um Optical Fiber
Author: Melanie Ott
Document Date: 10/29/01
Radiation Testing of IEEE 1394 FireWire (presentation)
Author: Stephen Buchner
Document Date: 01/22/04
Radiation Testing of IEEE 1394 Firewire (slides)
Author: Stephen Buchner
Document Date: 02/02/04
Radiation-Aware Design for CubeSat Form-Factor Experiment using Goal Structuring Notation - SEANET 2016 Poster Presentation by Rebekah A. Austin
Author: Ken LaBel
Document Date: 08/15/17
Radiation-Hardened re-programmable Field-Programmable Gate Array (RHrFPGA)
Author: Anthony Sanders
Document Date: 08/22/06
Radiation-Inducd Charge Collection in Infrared Detector Arrays
Author: Robert Reed
Document Date: 01/29/04
Recent Advances and Future Challenges in Risk-Based Radiation Engineering - Presentation by Jonathan A. Pellish
Author: Jonathan Pellish
Document Date: 11/16/16
Recent Photonics Activities Under the NASA Electronic Parts and Packaging (NEPP) Program 2002
Author: Chuck Barnes
Document Date: 07/24/02
Recent Radiation Damage and SEE Test Results for Candidate Spacecraft Electronics
Author: Martha O'Bryan
Document Date: 01/21/04
Recent Radiation Damage and Single Event Effect Results For Microelectronics 1999
Author: Martha O'Bryan
Document Date: 09/28/01
Recent Radiation Damage and Single Event Effects for Candidate Spacecraft Electronics 2001
Author: Ken LaBel
Document Date: 02/22/02
Recent Radiation Test Results at JPL 2003
Author: Bernard Rax
Document Date: 09/22/03
Recent Radiation Test Results for Trench Power MOSFETs - 2017 NSREC Poster Presentation
Author: Jean-Marie Lauenstein
Document Date: 11/07/17
Recommended PEMs Packaging Test Flow & FIT Numbers used by Candidate Manufacturers 2003
Author: Robert (David) Gerke
Document Date: 02/18/03
Red Plague
Author: Author Non-NEPP
Document Date: 01/28/05
Red Plague - Quick Links
Author: Jeannette Plante1
Document Date: 01/10/05
Relay Failures Specific to Space Applications
Author: Alexander Teverovsky
Document Date: 03/05/02
Reliability Analysis of Avionics in the Commercial Aerospace Industry
Author: Author Non-NEPP
Document Date: 04/05/05
Reliability Assessment of Advanced Flip Chip in Cryogenic Temperatures
Author: Rajeshuni Ramesham
Document Date: 05/23/05
Reliability Characterization of GaAs FET Test Structures for Applications in RF/Microwave Modules
Author: Ashok Sharma
Document Date: 10/28/02
Reliability considerations for using PEMS in Military Applications
Author: Author Non-NEPP
Document Date: 01/18/02
Reliability Evaluation of Linear PEMs Rejected During C-SAM Examination (slides)
Author: Alexander Teverovsky
Document Date: 02/17/04
Reliability Implications Of Derating Leading Edge High Complexity Microcircuits
Author: Author Non-NEPP
Document Date: 01/18/02
Reliability Issues of COTS MEMS for Aerospace Applications
Author: Rajeshuni Ramesham
Document Date: 09/19/01
Reliability Issues Related to the Fatigue Strength of Gold Wire Used in Electronic Assemblies
Author: Jeannette Plante1
Document Date: 09/17/01
Reliability of Bvgdo Degraded Power X-Band GaAs MESFET
Author: Harry Shaw
Document Date: 10/23/01
Reliability of COTS PEMS
Author: Alexander Teverovsky
Document Date: 05/22/07
Reliability of Electronics at Cryogenic Temperatures
Author: Alexander Teverovsky
Document Date: 12/05/05
Reliability of Lead (Pb)-Free Solder Alloy
Author: Jong Kadesch
Document Date: 11/05/02
Reliability of NMOS Transistors from LL FDSOI Processes
Author: Udo Lieneweg
Document Date: 03/01/02
Resources for Radiation Test Data - SEEMAPLD 2014 Presentation
Author: Martha O'Bryan
Document Date: 12/14/16
Response of a FM08 Style Fuse to a Pulse of Current: Memo to XTE Project
Author: Henning Leidecker
Document Date: 10/25/01
Results for High Speed Op-Amp
Author: Michael Sandor
Document Date: 10/30/04
Results for Precision Voltage Reference - PEMS Eval
Author: Michael Sandor
Document Date: 10/30/04
Results for Proton and Neutron Testing of Optical Devices Used in the CIRS Instrument
Author: Robert Reed
Document Date: 09/28/01
Results of Screening and Qualification Testing of COTS PEMs for Space Applications and Lessons Learn
Author: Alexander Teverovsky
Document Date: 02/14/05
Reverse Bias Behavior of Surface Mount Solid Tantalum Capacitors
Author: Alexander Teverovsky
Document Date: 02/28/02
Reverse-Bias Degradation of SiGe Transistors at Normal and Cryogenic Temperatures
Author: Alexander Teverovsky
Document Date: 03/03/05
Reverse-Bias Degradation of SiGe Transistors at Normal and Cryogenic Temperatures - Ext'd Abstract
Author: Alexander Teverovsky
Document Date: 03/03/05
RF MEMS Benefits and Challenges of an Evolving Switch Technology
Author: Author Non-NEPP
Document Date: 05/14/03
RF Power handling of Capacitive RF MEMS Devices
Author: Author Non-NEPP
Document Date: 05/08/03
S-311-24 - Screening Procedure for a Medium Power, PNP, Silicon Transistor (2N4236)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-317A - Procurement Specification for a Thermostatic Switch
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-320/10G - Detail Specification For a Input Filter, 152 µH, 18V
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-320/7E - Detail Specification for a Input Filter, 90 µH, 10V
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-320/8E - Detail Specification For a Input Filter, 350 µH, 5V
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-320/9G - Detail Specification For a Input Filter, 315 µH, 10V
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-320-LATACD-0004A - Detail Specification for a 0.6 mH Filter Inductor
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-320-LATACD-0004B - Detail Specification for a 0.6 mH Filter Inductor
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-339/1 - Cable, Fiber Optic, Single Fiber, Multi-mode, Flexible Detail Specification for
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-348A - Procurement Specification for a Thermostatic Switch (3BT-DG-33)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-367B - Procurement Specification for a Three Phase Motor Protector Thermostatic Switch
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-407 - Screening Procedure for Diode, Silicon Photedetector Part No. S874-18K Hamamatsu Corporation
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-424B - Thermistor (Thermally Sensitive Resistor), Insulated, Negative Temperature Coefficient, Super Stable, Glass Encapsulated, Style 311-424, Specification for
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-426 - Procurement Specification for a Thermostatic Switch (Elmwood Sensors)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-428A - Procurement Specification for a Thermostatic Switch (Sunstrand Data Contro Inc.)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-429A - Procurement Specification for a Thermostatic Switch (Generic)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-641/01D - Switch, Thermostatic, (Bimetallic), Subminiature Sealed, Single Pole, Single Throw (SPST), Detail Specification for
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-641/02A - Switch, Thermostatic, Bimetallic, SPST, Narrow Differential, Hermetic, Detail Specification for
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-641/03H - Switch, Thermostatic, Bimetallic, SPST, Corrosion Resistant Steel, Hermetic, Detail Specification for
Author: Thomas Perry
Document Date: 05/29/12
S-311-641/04B - Switch, Thermostatic, Bimetallic, SPST, High Power, Hermetic, Detail Specification for
Author: Thomas Perry
Document Date: 05/29/12
S-311-641/05A - Switch, Thermostatic, (Bimetallic), Subminiature Sealed, Single Pole, Single Throw (SPST), 5 Amperes and Low Level, Detail Specification for
Author: Thomas Perry
Document Date: 07/31/12
S-311-641/06 - Switch, Thermostatic, (Bimetallic), Subminiature Sealed, Single Pole, Single Throw (SPST), 1 Ampere and Low Level, Detail Specification for
Author: Thomas Perry
Document Date: 07/31/12
S-311-641/07 - Switch, Thermostatic, (Bimetallic), Subminiature Sealed, Single Pole, Single Throw (SPST), 1 Ampere and Low Level, Detail Specification for
Author: Thomas Perry
Document Date: 07/31/12
S-311-641B - Switches, Thermostatic, General Requirements for
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-669 - Screening Procedure for Microcircuit AD7541ATQ CMOS 12-Bit Monolithic Multip1ying Digital to Analog Converter (For XTE use only)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-M-70D - SPECIFICATION FOR DESTRUCTIVE PHYSICAL ANALYSES (DPA)
Author: Bruce Meinhold
Document Date: 06/05/03
S-311-P-079E - Procuremet Specification for Thermofoil Heater
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-10D - Connectors, Electrical, Rectangular, Miniature, Polarized Shell, Rack and Panel, for Space Flight Use
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-13/1B - Wire, Electrical, Radiation Crosslinked Polyalkene Insulated, Tin-Coated Copper, 600 Volt, For Space Flight Use, Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-13/2A - Wire, Electrical, Radiation Crosslinked Polyalkene Insulated, Tin-Coated Copper, 1000 Volt, For Space Flight Use, Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-13/3A - Wire, Electrical, Radiation Croslinked polyalkene Insulated, Tin-Coated Copper, 2500 Volt, For Space Flight Use; Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-13B - Wire and Cable, Electrical, Insulated, for Space Flight Use
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-18L - Thermistor, (Thermally Sensitive Resistor), Insulated and Uninsulated, Negative Temperature Coefficient, Specifications for
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-4/05C - Connectors, Electrical, Rectangular, Subminiature, Polarized Shell, Detailed Specification for
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-4/06A - Contacts, Electrical, Coaxial, and High Voltage for Electrical Connectors
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-4/07C - CONNECTORS, ELECTRICAL, RECTANGULAR , SUBMINIATURE, RACK AND PANEL, DETAILED SPECIFICATION FOR
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-4/08C - CONTACTS, ELECTRICAL, POWER, CRIMP STYLE, REAR REMOVABLE, SIZE 22D
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-4/09C - Connectors, Electrical, Polarized Shell, Rack and Panel, for Space Flight Use
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-4/10C - CONTACTS, ELECTRICAL, CRIMP STYLE, SIZE 20
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-4D - CONNECTORS, ELECTRICAL, SUBMINIATURE, RACK AND PANEL, GENERAL SPECIFICATION FOR
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-626/01 - Connectors, Electric, Polarized Shell, Rack and Panel, Pin, Electromagnetic Interference Filter Contact, Nonmagnetic, Solder Type, D Subminiature
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-626/02 - Connector Adapter, Electric, Miniature D Rectangular, Polarized Shell, Standard and High Density, Electromagnetic Interference Filter Contacts
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-626/10B - Connector, Electric, Circular Polarized Shell, Electromagnetic Interference Filter Contact
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-626B - Connectors, Electric, Miniature Polarized Shell, Rack and Panel, Pin, Electromagnetic Interference Filter Contact, Nonmagnetic, Solder Type
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-672E - Resistor, Fixed, High Voltage (Victoreen Mini-Mex)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-683B - Resistor, Fixed, Precision High Voltage (Caddock Type MG and HG)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-718 - Connectors, Electrical, Rectangular, Polarized Shell, For Space Flight Use, Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-718/1 - Connectors, Electrical, Rectangular, Polarized Shell, For Space Flight Use, Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-718/2 - Contacts, Power and Coaxial, Removable, for Electrical Connectors, (Sizes 1, 2, and 3) For Space Flight Use, Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-718/3 - Connectors, Electrical, Rectangular, Polarized Shell, EMI Shielding (Size 1) For Space Flight Use, Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-718/4 - Backshell Kits, Connector Rectangular, EMI Shielding, Strain Relief (Sizes 1, 2, and 3) For Space Flight Use, Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-718/5 - Connectors, Electrical, Rectangular, Polarized Shell, EMI Shielding (Size 2) For Space Flight Use, Detail Specification For
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-718/6 - Connectors, Electrical, Rectangular, Polarized Shell, EMT Shielding (size 3) For Space Flight Use
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-721 - Procurement Specification for Real Time Express DSP/Microcontroller, RTX2010RH Type Microcircuit, Radiation Hardened, (100 Kilorad (Si) minimum)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-741 - Resistor, Fixed, Low TC, Precision, High Voltage (Caddock Type TG)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-742D - Resistor, Fixed, Low TC, Precision, Radial-Lead (Caddoc Type TK)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-754/01 - Relays, Electromagnetic, Hermetically Sealed, 2PDT (2C), Latching, Low Level to 1 Ampere (TO-5 Enclosure)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-754/02 - Relays, Electromagnetic, Hermetically Sealed, 2PDT (2C), Latching, Low Level to 1 Ampere, Internal Diode for Coil Transients (To-5 Enclosure)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-754/03 - Relays, Electromagnetic, Hermetically Sealed, 2PDT (2C), Low Level to 1 Ampere (To-5 Enclosure)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-754/04A - Relays, Electromagnetic, Hermetically Sealed, 2PDT (2C), Low Level to 1 Ampere, Internal Diode for Coil Transients, (TO-5 Enclosure)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-754/05 - Relays, Electromagnetic, Hermetically Sealed, High Vibration, 2PDT (2C), Low Level to 1 Ampere (To-5 Enclosure)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-754/06B - Relays, Electromagnetic, Hermetically Sealed, 2PDT (2C), Permanent Magnet Drive, 10 AMP, All Welded, DC Coils
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-754/07A - Relays, Electromagnetic, Hermetically Sealed, 2PDT (2C), Low Level to 2 Amperes (0.150 Inch Terminal Spacing)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-754/08C - Relays, Electromagnetic, Hermetically Sealed, 4PDT (4C), Latching, Low level to 2 Amperes (0.150 inch Terminal Spacing)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-754/09 - Relays, Electromagnetic, Hermetically Sealed, 4PDT (4C), Low Level to 2 Amperes (0.150 inch Terminal Spacing)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-754/10B - Relays, Electromagnetic, Hermetically Sealed, 4PDT (4C), Permanent Magnet Drive, 10 Ampere, All Welded
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-754/11 - Relays, Electromagnetic, Hermetically Sealed, 3PDT (3C), Latching, 25 amperes, All Welded
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-754D - Relays, Electromagnetic, General Specification For
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-767A - Thermistor, Hermetically Sealed, Cryogenic, Negative Temperature Coefficient, Specification for
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-768 - Connectors, Electrical, Miniature, Circular, Low Outgassing [Amphenol (453) Suffix], General Specification for
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-772 - Connector, Coaxial, Panel Mount, Receptacle, Strip Line, Series SMA
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-783 - Control Drawing for a Radiation Tolerant, 32K X 8 CMOS EEPROM (Generic No. U28C256E)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-785 - Capacitor, Fixed, Axial-Lead, Metallized Polycarbonate Dielectric, Hermetically Sealed in Metal Cases. For use on the Hubble Space Telescope
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-787 - Procurement Specification for Diode, Temperature Sensing. (XDT-570)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-790 - PROCUREMENT SPECIFICATION FOR DIODE, LIGHT EMITTING, INFRARED, LPE GaAlAs, (OD-880WJ)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-791 - PROCUREMENT SPECIFICATION FOR DI ODE, LIGHT EMITTING, INFRARED, GaAlAs.
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-794A - Resistor, Fixed, Low TC, Precision High Stability (Caddock Type TK)
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-795A - Resistor, Fixed, Foil, Precicion, Power, Current Sensing, Hermetically Sealed
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-796C - Resistors, Matched-Pair", Low TC, Precision, Radial-Lead (Caddock Type TK)"
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-798 - Procurement Specification for Precision Trimming Potentiometer - Vishay 1285G
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-799/01A - Resistor, Network - Precision
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-799/02B - Resistor, Network - Precision
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-799/03B - Resistor, Network - Precision
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-799/04B - Resistor, Network - Precision
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-799/05C - Resistor, Network - Precision
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-799/06 - Resistor, Network - Film (Tantalum Nitride), Precision
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-799/07 - Resistor, Network - Film (Tantalum Nitride), Precision
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-799/08 - Resistor, Network-Film (Tantalum Nitride), Precision
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-799A - PROCUREMENT SPECIFICATION FOR HERMETICALLY SEALED RESISTOR NETWORKS, BASE SPECIFICATION
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-8(17) - Crystal Units, Quartz for Space Flight Use
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-813D - Resistor, Fixed, Low Temperature Characteristic Precision, Radial-Lead
Author: Jay Brusse
Document Date: 05/29/12
S-311-P-822A - Connectors, PWB, 2mmc PCITM Style, High Reliability
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-826A - Triaxial Connector, Ultraminiature
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-827A - Thermistor (Thermally Sensitive Resistor), Chip, Negative Temperature Coefficient or Positive Temperature Coefficient
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-829J - Capacitor, Ceramic, Multilayer Chip, Space Applications
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-835 - Connector, Electrical, RF, Twinaxial, Microminiature
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-P-838A - Capacitor, Ceramic, Multilayer Chip, Base-Metal Electrodes, Space Applications
Author: Author Non-NEPP
Document Date: 06/18/15
S-311-P-841 - General Specification for Thermofoil Heater, All-Polyimide, Space Applications
Author: Susana Douglas
Document Date: 02/19/16
S-311-S-819 - Resistor, Fixed, Foil (Managanin) Power, Current Sensing, Surface Mount
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-S-820 - Resistor, Fixed, Foil (Manganin) Power, Current Sensing, 2-Terminal, Surface Mount
Author: Author Non-NEPP
Document Date: 05/29/12
S-311-S-821 - Resistor, Fixed, Foil (Manganin), Chip, Power, Current Sensing, Surface Mount
Author: Author Non-NEPP
Document Date: 05/29/12
S-312-P-003
Author: Author Non-NEPP
Document Date: 02/23/04
Scaling and Technology Issues for Soft Error Rates 2000 Res Rel
Author: Allan Johnston
Document Date: 09/19/01
SDRAM Testing: Lessons Learned (or How to test an SDRAM in Less than 7 years) - SEESYM 2010 Presentation
Author: Raymond Ladbury
Document Date: 11/13/13
SDRAMs: Can't Live With Them, But Can We Live Without Them?
Author: Raymond Ladbury
Document Date: 01/22/04
SEE & TID Testing of CULPRiT Reed Solomon Encoders
Author: Ken Li
Document Date: 02/02/04
SEE And Radiation Damage Results For Candidate Spacecraft Electronics 1998
Author: Martha O'Bryan
Document Date: 09/28/01
SEE Characteristics of CMOS Devices Employing Various Epi-layer Thicknesses
Author: Ken LaBel
Document Date: 09/28/01
SEE Characterization of the K4F660812 DRAM for ST5
Author: Author Non-NEPP
Document Date: 01/14/04
SEE Data Analysis of Multiple NASA Spacecraft and Experiments 1995
Author: Ken LaBel
Document Date: 09/28/01
SEE Proton and Heavy Ion Test Results for Candidate Spacecraft Electronics 1994
Author: Ken LaBel
Document Date: 09/28/01
SEE Proton And Heavy Ion Test Results In Support Of Candidate Nasa Programs 1995
Author: Ken LaBel
Document Date: 09/28/01
SEE Test Report on IEEE 1394
Author: Hak Kim
Document Date: 01/29/04
SEE Test Results For Candidate Spacecraft Electronics 1996
Author: Ken LaBel
Document Date: 09/28/01
SEE Test Results for CandidateSpacecraft Electronics 1996
Author: Ken LaBel
Document Date: 09/28/01
SEE Test Results for CandidateSpacecraft Electronics 1996
Author: Ken LaBel
Document Date: 09/25/01
SEE Testing of an Actel ASIC
Author: Stephen Buchner
Document Date: 02/13/04
SEE Testing of the AD8151 Digital Crosspoint Switch
Author: Stephen Buchner
Document Date: 01/29/04
SEE Testing of the Intel 80386 Family and the 80486 Microprocessor
Author: Ken LaBel
Document Date: 09/28/01
SEE Testing of the Intel Pentium III (P3) Microprocessor (presentation w/notes)
Author: James Howard
Document Date: 01/22/04
SEL Test Results for IBM 5HP CMOS Ring Oscillator
Author: Robert Reed
Document Date: 01/29/04
SEL Testing of the AD5334 Digital to Analog Converter
Author: James Howard
Document Date: 01/29/04
Selected Literature on COTS products.pdf
Author: Author Non-NEPP
Document Date: 01/22/02
SET and Destructive SEE Re-Testing of the MDI3051RED12ZF DC-to-DC Converters
Author: James Howard
Document Date: 01/29/04
SET and Destructive SEE Re-Testing of the MDI3051RED15ZF DC-to-DC Converters
Author: James Howard
Document Date: 01/29/04
SET and Destructive SEE Re-Testing of the MDI3051RES05ZF DC-to-DC Converters
Author: James Howard
Document Date: 01/29/04
SET and Destructive SEE Testing of the LTC1149 Step-Down Switching Regulator
Author: James Howard
Document Date: 01/29/04
SET and Destructive SEE Testing of the SG1525A PWM Controller
Author: James Howard
Document Date: 01/29/04
SETs in an LT1128 Op Amp by Heavy Ions
Author: Christian Poivey
Document Date: 02/10/04
SETs in Linear Devices - NASA GSFC Studies (slides)
Author: Christian Poivey
Document Date: 02/02/04
SETs in Linear Devices Testing Guidelines (slides)
Author: Christian Poivey
Document Date: 01/14/04
SETs in Linear Devices, Testing Guidelines (Slides)
Author: Christian Poivey
Document Date: 01/22/04
SETs in LM124 Op Amp Laser Test Report
Author: Ken LaBel
Document Date: 01/14/04
SEU Cross-Section Measurements on High Speed Silicon-on-Sapphire Divide-by-2 Devices
Author: Robert Reed
Document Date: 01/22/04
SEU Evaluation of SRAM Memories for Space Applications 2000 NSREC
Author: Leif Scheick
Document Date: 09/19/01
SEU Mitigation Testing of Xilinx Virtex II FPGAs
Author: Gary Swift
Document Date: 09/22/03
SEU Study of Seastar, and the MAP Anomaly (presentation)
Author: Christian Poivey
Document Date: 01/22/04
SEU Test Results for the Xilinx XQ1701L PROM 1999 NSREC
Author: Steven Guertin
Document Date: 09/19/01
SEU Test Results on a Prescalar Fab'd in IBM's 5HP SiGe Heterojunction Bipolar Transistors BiCMOS
Author: Robert Reed
Document Date: 01/21/04
SEUs in Evolving Commercial Silicon-on-Insulator Microprocessor Technologies
Author: Farokh Irom
Document Date: 09/22/03
SEUs in Flash Memories 1997 NSREC
Author: Allan Johnston
Document Date: 09/19/01
SEUs in Optocouplers 1998 NSREC
Author: Allan Johnston
Document Date: 09/19/01
Shock and Thermal Cycling Synergism Effects on Reliability of CBGA Assemblies
Author: Reza Ghaffarian
Document Date: 09/25/01
SiC and SOI Electronics for Harsh Environmental Applications - Part 1
Author: Author Non-NEPP
Document Date: 10/05/01
SiC and SOI Electronics for Harsh Environmental Applications - Part 2
Author: Author Non-NEPP
Document Date: 10/05/01
SiC and SOI Electronics for Harsh Environmental Applications - Part 3
Author: Author Non-NEPP
Document Date: 10/05/01
SiC and SOI Electronics for Harsh Environmental Applications - Part 4
Author: Author Non-NEPP
Document Date: 10/05/01
Single Event Effect Criticality Assessment(SEECA) - the SEECA document
Author: Ken LaBel
Document Date: 09/28/01
Single Event Effects (SEE) Challenges: Testing and Modeling Shortfalls - NEPP ETW 2012 Presentation
Author: Ken LaBel
Document Date: 10/24/13
Snapstrate and Socket for Chip-on-Board Programmable Technologies, September 1998
Author: Jeannette Plante1
Document Date: 09/17/01
Solid Tantalum Capacitor Surge Current Failure Mechanism Experiment
Author: Pete Jones
Document Date: 09/18/01
Space Flight Heritage of Optical Fiber Cables
Author: Author Non-NEPP
Document Date: 10/31/05
Space Parts Working Group (SPWG) Trip Report March 1998
Author: Jay Brusse
Document Date: 10/25/01
Space Qualification of InGaAs/InP Active Pixel Receivers
Author: Quiesup Kim
Document Date: 10/04/01
Space Radiation Effects on Electronics: Simple Concepts and New Challenges - 2004 MRS Presentation
Author: Ken LaBel
Document Date: 10/30/13
Space Weather Event on the Microwave Anisotropy Probe
Author: Christian Poivey
Document Date: 01/22/04
Space Weather Event on the Microwave Anisotropy Probe (presentation)
Author: Christian Poivey
Document Date: 01/22/04
SPICE Modeling the Electrical Interconnect of the Stackable Package
Author: Phillip Zulueta
Document Date: 09/17/01
Spotlight FPGA's: NEPP News Flash - December 2002
Author: Jeanne Ilg
Document Date: 12/10/02
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The Effects of Ionizing Radiation on Wearout and Reliability of Thin Gate Oxides 2000 MRQ
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The Effects of Space Radiation on Linear Integrated Circuits 2000 Aerospace Conference
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The Future of COTS and QML in Military and Space Hardware
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The Impact of System Configuration on Device Radiation Damage Testing of Optical Components
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Video: Packaging and Reliability of Electronic Noses for Space Applications - Part 2
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